CN119317506B - 数值孔径可变装置、激光器装置及激光加工机 - Google Patents

数值孔径可变装置、激光器装置及激光加工机

Info

Publication number
CN119317506B
CN119317506B CN202280096831.6A CN202280096831A CN119317506B CN 119317506 B CN119317506 B CN 119317506B CN 202280096831 A CN202280096831 A CN 202280096831A CN 119317506 B CN119317506 B CN 119317506B
Authority
CN
China
Prior art keywords
laser
numerical aperture
variable device
transmission
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202280096831.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN119317506A (zh
Inventor
京藤友博
菊池弘
石川恭平
河崎正人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN119317506A publication Critical patent/CN119317506A/zh
Application granted granted Critical
Publication of CN119317506B publication Critical patent/CN119317506B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4296Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)
CN202280096831.6A 2022-08-02 2022-08-02 数值孔径可变装置、激光器装置及激光加工机 Active CN119317506B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/029624 WO2024028972A1 (ja) 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機

Publications (2)

Publication Number Publication Date
CN119317506A CN119317506A (zh) 2025-01-14
CN119317506B true CN119317506B (zh) 2025-11-18

Family

ID=85503266

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280096831.6A Active CN119317506B (zh) 2022-08-02 2022-08-02 数值孔径可变装置、激光器装置及激光加工机

Country Status (5)

Country Link
US (1) US20250170672A1 (https=)
JP (1) JP7237261B1 (https=)
CN (1) CN119317506B (https=)
DE (1) DE112022007071B4 (https=)
WO (1) WO2024028972A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008142747A (ja) * 2006-12-11 2008-06-26 Olympus Corp レーザ加工装置
CN110770617A (zh) * 2017-06-21 2020-02-07 通快激光有限责任公司 用于从光导纤维耦合输出辐射的设备、光导线缆和加工头

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3531199B2 (ja) * 1994-02-22 2004-05-24 三菱電機株式会社 光伝送装置
JP5124490B2 (ja) * 2007-02-09 2013-01-23 株式会社フジクラ ファイバレーザ
JP2009072789A (ja) * 2007-09-18 2009-04-09 Hamamatsu Photonics Kk レーザ加工装置
US9310560B2 (en) * 2014-02-26 2016-04-12 TeraDiode, Inc. Systems and methods for multiple-beam laser arrangements with variable beam parameter product
CN105720463B (zh) * 2014-08-01 2021-05-14 恩耐公司 光纤和光纤传输的激光器中的背向反射保护与监控
JP5909537B1 (ja) * 2014-10-14 2016-04-26 株式会社アマダホールディングス ダイレクトダイオードレーザ発振器、ダイレクトダイオードレーザ加工装置及び反射光検出方法
WO2019176502A1 (ja) * 2018-03-15 2019-09-19 パナソニックIpマネジメント株式会社 レーザ発振器、それを用いたレーザ加工装置及びレーザ発振方法
JP7382553B2 (ja) * 2019-05-29 2023-11-17 パナソニックIpマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法
JP2020199513A (ja) * 2019-06-07 2020-12-17 株式会社アマダ レーザ加工機及びレーザ加工機の制御方法
JP7437745B2 (ja) * 2020-03-13 2024-02-26 パナソニックIpマネジメント株式会社 レーザ発振器及びレーザ加工装置
JP7579112B2 (ja) * 2020-11-11 2024-11-07 Jswアクティナシステム株式会社 レーザ照射装置、及び半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008142747A (ja) * 2006-12-11 2008-06-26 Olympus Corp レーザ加工装置
CN110770617A (zh) * 2017-06-21 2020-02-07 通快激光有限责任公司 用于从光导纤维耦合输出辐射的设备、光导线缆和加工头

Also Published As

Publication number Publication date
CN119317506A (zh) 2025-01-14
US20250170672A1 (en) 2025-05-29
WO2024028972A1 (ja) 2024-02-08
DE112022007071T5 (de) 2025-03-06
JP7237261B1 (ja) 2023-03-10
DE112022007071B4 (de) 2026-04-23
JPWO2024028972A1 (https=) 2024-02-08

Similar Documents

Publication Publication Date Title
KR101004497B1 (ko) 낮은 흡광 물질로 구성된 소재 내로 방사 에너지를 유도하기 위한 빔 형성 유닛을 포함하는 장치
CN110036320B (zh) 光纤耦合装置
JP2720811B2 (ja) レーザ集光方法及び装置
US11000919B2 (en) Laser processing apparatus
CN110961780B (zh) 激光处理设备
WO2021145205A1 (ja) レーザ装置及びそれを用いたレーザ加工装置
CN119317506B (zh) 数值孔径可变装置、激光器装置及激光加工机
WO2021145358A1 (ja) レーザ加工装置
KR20190001631A (ko) 균질화된 레이저 빔의 사이즈를 가변시키는 광학 시스템
JP2008134468A (ja) 集光光学系および光加工装置
CN116897092B (zh) 激光加工机以及激光加工方法
KR102615739B1 (ko) 레이저 가공 장치
JP5068332B2 (ja) レーザビーム装置
US6532047B1 (en) Irradiation device for polarized light for optical alignment of a liquid crystal cell element
CN113825588B (zh) 槽加工装置以及槽加工方法
KR101850365B1 (ko) 레이저 가공 장치, 이를 이용한 레이저 가공 방법 및 이에 사용되는 레이저 조사 유닛
JP4927051B2 (ja) 半導体レーザ光出力装置および固体レーザロッド励起モジュール
KR100381856B1 (ko) 노광기용 스캔형 광학계
CN114706280B (zh) 一种di光刻机系统
KR102689657B1 (ko) 레이저 절단 장치
JP5420172B2 (ja) レーザ装置
JP3792193B2 (ja) 線状光照射装置
KR101574737B1 (ko) 경사진 폴리곤 미러를 사용한 직접 노광 방법 및 이를 수행하는 직접 노광 장치
KR20250138437A (ko) 곡선 레이저 빔 조사 장치
WO2026004530A1 (ja) 光学ユニット、レーザ加工装置および鏡筒

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant