CN119317506B - 数值孔径可变装置、激光器装置及激光加工机 - Google Patents
数值孔径可变装置、激光器装置及激光加工机Info
- Publication number
- CN119317506B CN119317506B CN202280096831.6A CN202280096831A CN119317506B CN 119317506 B CN119317506 B CN 119317506B CN 202280096831 A CN202280096831 A CN 202280096831A CN 119317506 B CN119317506 B CN 119317506B
- Authority
- CN
- China
- Prior art keywords
- laser
- numerical aperture
- variable device
- transmission
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/029624 WO2024028972A1 (ja) | 2022-08-02 | 2022-08-02 | 開口数可変装置、レーザ装置およびレーザ加工機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119317506A CN119317506A (zh) | 2025-01-14 |
| CN119317506B true CN119317506B (zh) | 2025-11-18 |
Family
ID=85503266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280096831.6A Active CN119317506B (zh) | 2022-08-02 | 2022-08-02 | 数值孔径可变装置、激光器装置及激光加工机 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250170672A1 (https=) |
| JP (1) | JP7237261B1 (https=) |
| CN (1) | CN119317506B (https=) |
| DE (1) | DE112022007071B4 (https=) |
| WO (1) | WO2024028972A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008142747A (ja) * | 2006-12-11 | 2008-06-26 | Olympus Corp | レーザ加工装置 |
| CN110770617A (zh) * | 2017-06-21 | 2020-02-07 | 通快激光有限责任公司 | 用于从光导纤维耦合输出辐射的设备、光导线缆和加工头 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3531199B2 (ja) * | 1994-02-22 | 2004-05-24 | 三菱電機株式会社 | 光伝送装置 |
| JP5124490B2 (ja) * | 2007-02-09 | 2013-01-23 | 株式会社フジクラ | ファイバレーザ |
| JP2009072789A (ja) * | 2007-09-18 | 2009-04-09 | Hamamatsu Photonics Kk | レーザ加工装置 |
| US9310560B2 (en) * | 2014-02-26 | 2016-04-12 | TeraDiode, Inc. | Systems and methods for multiple-beam laser arrangements with variable beam parameter product |
| CN105720463B (zh) * | 2014-08-01 | 2021-05-14 | 恩耐公司 | 光纤和光纤传输的激光器中的背向反射保护与监控 |
| JP5909537B1 (ja) * | 2014-10-14 | 2016-04-26 | 株式会社アマダホールディングス | ダイレクトダイオードレーザ発振器、ダイレクトダイオードレーザ加工装置及び反射光検出方法 |
| WO2019176502A1 (ja) * | 2018-03-15 | 2019-09-19 | パナソニックIpマネジメント株式会社 | レーザ発振器、それを用いたレーザ加工装置及びレーザ発振方法 |
| JP7382553B2 (ja) * | 2019-05-29 | 2023-11-17 | パナソニックIpマネジメント株式会社 | レーザ加工装置及びそれを用いたレーザ加工方法 |
| JP2020199513A (ja) * | 2019-06-07 | 2020-12-17 | 株式会社アマダ | レーザ加工機及びレーザ加工機の制御方法 |
| JP7437745B2 (ja) * | 2020-03-13 | 2024-02-26 | パナソニックIpマネジメント株式会社 | レーザ発振器及びレーザ加工装置 |
| JP7579112B2 (ja) * | 2020-11-11 | 2024-11-07 | Jswアクティナシステム株式会社 | レーザ照射装置、及び半導体装置の製造方法 |
-
2022
- 2022-08-02 CN CN202280096831.6A patent/CN119317506B/zh active Active
- 2022-08-02 DE DE112022007071.4T patent/DE112022007071B4/de active Active
- 2022-08-02 WO PCT/JP2022/029624 patent/WO2024028972A1/ja not_active Ceased
- 2022-08-02 JP JP2022579057A patent/JP7237261B1/ja active Active
- 2022-08-02 US US18/878,658 patent/US20250170672A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008142747A (ja) * | 2006-12-11 | 2008-06-26 | Olympus Corp | レーザ加工装置 |
| CN110770617A (zh) * | 2017-06-21 | 2020-02-07 | 通快激光有限责任公司 | 用于从光导纤维耦合输出辐射的设备、光导线缆和加工头 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119317506A (zh) | 2025-01-14 |
| US20250170672A1 (en) | 2025-05-29 |
| WO2024028972A1 (ja) | 2024-02-08 |
| DE112022007071T5 (de) | 2025-03-06 |
| JP7237261B1 (ja) | 2023-03-10 |
| DE112022007071B4 (de) | 2026-04-23 |
| JPWO2024028972A1 (https=) | 2024-02-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |