JPWO2024028972A1 - - Google Patents

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Publication number
JPWO2024028972A1
JPWO2024028972A1 JP2022579057A JP2022579057A JPWO2024028972A1 JP WO2024028972 A1 JPWO2024028972 A1 JP WO2024028972A1 JP 2022579057 A JP2022579057 A JP 2022579057A JP 2022579057 A JP2022579057 A JP 2022579057A JP WO2024028972 A1 JPWO2024028972 A1 JP WO2024028972A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022579057A
Other languages
Japanese (ja)
Other versions
JPWO2024028972A5 (https=
JP7237261B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed filed Critical
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Publication of JP7237261B1 publication Critical patent/JP7237261B1/ja
Publication of JPWO2024028972A1 publication Critical patent/JPWO2024028972A1/ja
Publication of JPWO2024028972A5 publication Critical patent/JPWO2024028972A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2022579057A 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機 Active JP7237261B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/029624 WO2024028972A1 (ja) 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機

Publications (3)

Publication Number Publication Date
JP7237261B1 JP7237261B1 (ja) 2023-03-10
JPWO2024028972A1 true JPWO2024028972A1 (https=) 2024-02-08
JPWO2024028972A5 JPWO2024028972A5 (https=) 2024-07-09

Family

ID=85503266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022579057A Active JP7237261B1 (ja) 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機

Country Status (5)

Country Link
US (1) US20250170672A1 (https=)
JP (1) JP7237261B1 (https=)
CN (1) CN119317506B (https=)
DE (1) DE112022007071B4 (https=)
WO (1) WO2024028972A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3531199B2 (ja) * 1994-02-22 2004-05-24 三菱電機株式会社 光伝送装置
JP5064778B2 (ja) * 2006-12-11 2012-10-31 オリンパス株式会社 レーザ加工装置
JP5124490B2 (ja) * 2007-02-09 2013-01-23 株式会社フジクラ ファイバレーザ
JP2009072789A (ja) * 2007-09-18 2009-04-09 Hamamatsu Photonics Kk レーザ加工装置
US9310560B2 (en) * 2014-02-26 2016-04-12 TeraDiode, Inc. Systems and methods for multiple-beam laser arrangements with variable beam parameter product
CN105720463B (zh) * 2014-08-01 2021-05-14 恩耐公司 光纤和光纤传输的激光器中的背向反射保护与监控
JP5909537B1 (ja) * 2014-10-14 2016-04-26 株式会社アマダホールディングス ダイレクトダイオードレーザ発振器、ダイレクトダイオードレーザ加工装置及び反射光検出方法
DE102017210350B3 (de) * 2017-06-21 2018-03-29 Trumpf Laser Gmbh Vorrichtung zur Auskopplung von Strahlung aus einer Lichtleitfaser, Lichtleitkabel und Bearbeitungskopf damit
WO2019176502A1 (ja) * 2018-03-15 2019-09-19 パナソニックＩｐマネジメント株式会社 レーザ発振器、それを用いたレーザ加工装置及びレーザ発振方法
JP7382553B2 (ja) * 2019-05-29 2023-11-17 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法
JP2020199513A (ja) * 2019-06-07 2020-12-17 株式会社アマダ レーザ加工機及びレーザ加工機の制御方法
JP7437745B2 (ja) * 2020-03-13 2024-02-26 パナソニックＩｐマネジメント株式会社 レーザ発振器及びレーザ加工装置
JP7579112B2 (ja) * 2020-11-11 2024-11-07 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、及び半導体装置の製造方法

Also Published As

Publication number Publication date
CN119317506B (zh) 2025-11-18
CN119317506A (zh) 2025-01-14
US20250170672A1 (en) 2025-05-29
WO2024028972A1 (ja) 2024-02-08
DE112022007071T5 (de) 2025-03-06
JP7237261B1 (ja) 2023-03-10
DE112022007071B4 (de) 2026-04-23

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