JP7222245B2 - 気密パッケージ - Google Patents
気密パッケージ Download PDFInfo
- Publication number
- JP7222245B2 JP7222245B2 JP2018567411A JP2018567411A JP7222245B2 JP 7222245 B2 JP7222245 B2 JP 7222245B2 JP 2018567411 A JP2018567411 A JP 2018567411A JP 2018567411 A JP2018567411 A JP 2018567411A JP 7222245 B2 JP7222245 B2 JP 7222245B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- material layer
- package
- glass
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Glass Compositions (AREA)
- Electroluminescent Light Sources (AREA)
Description
10 パッケージ基体
11 ガラス蓋
12 基部
13 枠部
14 内部素子(例えば、深紫外LED素子)
15 封着材料層
16 封着材料層の内側端部
17 封着材料層の外側端部
18 レーザー照射装置
L レーザー光
Claims (6)
- パッケージ基体とガラス蓋とが封着材料層を介して気密封着された気密パッケージにおいて、
パッケージ基体が、基部と基部上に設けられた枠部とを有し、
パッケージ基体の枠部内に、内部素子が収容されており、
パッケージ基体の枠部の頂部とガラス蓋の間に封着材料層が配されており、
封着材料層の端部が、断面視で円弧状に側方に突き出ており、
封着材料層が、少なくともビスマス系ガラス粉末と耐火性フィラー粉末を含む複合粉末の焼結体であり、
ビスマス系ガラス粉末が、モル%で、Bi2O3 28~60%、B2O3 15~37%、ZnO 1~30%、CuO 1~40%、Fe 2 O 3 0.1~10%を含有することを特徴とする気密パッケージ。 - 封着材料層の平均厚みを封着材料層の最大幅で除した値が0.003以上であることを特徴とする請求項1に記載の気密パッケージ。
- 封着材料層が、枠部の頂部の内側端縁から離間した位置に形成されると共に、枠部の頂部の外側端縁から離間した位置に形成されていることを特徴とする請求項1又は2に記載の気密パッケージ。
- 封着材料層の平均厚みが8.0μm未満であると共に、封着材料層の最大幅が1~1000μmであることを特徴とする請求項1~3の何れかに記載の気密パッケージ。
- 封着材料層が、実質的にレーザー吸収材を含んでいないことを特徴とする請求項1~4の何れかに記載の気密パッケージ。
- パッケージ基体が、ガラス、ガラスセラミック、窒化アルミニウム、酸化アルミニウムの何れか、或いはこれらの複合材料であることを特徴とする請求項1~5の何れかに記載の気密パッケージ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017020004 | 2017-02-07 | ||
JP2017020004 | 2017-02-07 | ||
PCT/JP2018/003753 WO2018147210A1 (ja) | 2017-02-07 | 2018-02-05 | 気密パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018147210A1 JPWO2018147210A1 (ja) | 2019-12-19 |
JP7222245B2 true JP7222245B2 (ja) | 2023-02-15 |
Family
ID=63108210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018567411A Active JP7222245B2 (ja) | 2017-02-07 | 2018-02-05 | 気密パッケージ |
Country Status (6)
Country | Link |
---|---|
US (1) | US11871676B2 (ja) |
JP (1) | JP7222245B2 (ja) |
KR (1) | KR102414498B1 (ja) |
CN (1) | CN110249421B (ja) |
TW (1) | TW201839918A (ja) |
WO (1) | WO2018147210A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111276588B (zh) | 2018-12-05 | 2021-09-28 | 光宝光电(常州)有限公司 | 发光封装结构及其制造方法 |
TWI692125B (zh) * | 2018-12-05 | 2020-04-21 | 大陸商光寶光電(常州)有限公司 | 發光封裝結構及其製造方法 |
KR102566572B1 (ko) | 2022-12-08 | 2023-08-16 | 주식회사 엔유씨전자 | 식품 가공기 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006143585A (ja) | 2005-12-09 | 2006-06-08 | Nippon Electric Glass Co Ltd | ビスマス系ガラス混合物 |
JP2016027610A (ja) | 2014-06-27 | 2016-02-18 | 旭硝子株式会社 | パッケージ基板、パッケージ、および電子デバイス |
WO2016136899A1 (ja) | 2015-02-26 | 2016-09-01 | 日本電気硝子株式会社 | 気密パッケージの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4775647A (en) * | 1984-09-19 | 1988-10-04 | Olin Corporation | Sealing glass composite |
JPH05226493A (ja) * | 1992-01-08 | 1993-09-03 | Nec Corp | ガラス封止型集積回路 |
JP3814810B2 (ja) * | 1996-04-05 | 2006-08-30 | 日本電気硝子株式会社 | ビスマス系ガラス組成物 |
KR100442830B1 (ko) | 2001-12-04 | 2004-08-02 | 삼성전자주식회사 | 저온의 산화방지 허메틱 실링 방법 |
CN102471137B (zh) * | 2009-07-31 | 2014-07-02 | 旭硝子株式会社 | 半导体器件用密封玻璃、密封材料、密封材料糊料以及半导体器件及其制造方法 |
WO2013015414A1 (ja) * | 2011-07-27 | 2013-01-31 | 日本電気硝子株式会社 | 封着材料層付きガラス基板、これを用いた有機elデバイス、及び電子デバイスの製造方法 |
JP2013239609A (ja) | 2012-05-16 | 2013-11-28 | Asahi Glass Co Ltd | 気密部材とその製造方法 |
JP2014236202A (ja) | 2013-06-05 | 2014-12-15 | 旭硝子株式会社 | 発光装置 |
JP6237989B2 (ja) * | 2013-07-24 | 2017-11-29 | 日本電気硝子株式会社 | 電気素子パッケージの製造方法及び電気素子パッケージ |
WO2015060248A1 (ja) * | 2013-10-21 | 2015-04-30 | 日本電気硝子株式会社 | 封着材料 |
JP2016086049A (ja) * | 2014-10-24 | 2016-05-19 | セイコーエプソン株式会社 | パッケージ、パッケージの製造方法、電子デバイス、電子機器及び移動体 |
JP6819943B2 (ja) * | 2016-06-10 | 2021-01-27 | 日本電気硝子株式会社 | 気密パッケージの製造方法及び気密パッケージ |
JP6913276B2 (ja) * | 2017-01-26 | 2021-08-04 | 日本電気硝子株式会社 | 気密パッケージ |
-
2018
- 2018-02-05 JP JP2018567411A patent/JP7222245B2/ja active Active
- 2018-02-05 US US16/482,764 patent/US11871676B2/en active Active
- 2018-02-05 CN CN201880010453.9A patent/CN110249421B/zh active Active
- 2018-02-05 WO PCT/JP2018/003753 patent/WO2018147210A1/ja active Application Filing
- 2018-02-05 TW TW107104000A patent/TW201839918A/zh unknown
- 2018-02-05 KR KR1020197017896A patent/KR102414498B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006143585A (ja) | 2005-12-09 | 2006-06-08 | Nippon Electric Glass Co Ltd | ビスマス系ガラス混合物 |
JP2016027610A (ja) | 2014-06-27 | 2016-02-18 | 旭硝子株式会社 | パッケージ基板、パッケージ、および電子デバイス |
WO2016136899A1 (ja) | 2015-02-26 | 2016-09-01 | 日本電気硝子株式会社 | 気密パッケージの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110249421A (zh) | 2019-09-17 |
KR20190112716A (ko) | 2019-10-07 |
KR102414498B1 (ko) | 2022-06-29 |
WO2018147210A1 (ja) | 2018-08-16 |
TW201839918A (zh) | 2018-11-01 |
JPWO2018147210A1 (ja) | 2019-12-19 |
CN110249421B (zh) | 2023-10-24 |
US20190355893A1 (en) | 2019-11-21 |
US11871676B2 (en) | 2024-01-09 |
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