JP7218126B2 - 配線板を備えるユニット、モジュールおよび機器 - Google Patents

配線板を備えるユニット、モジュールおよび機器 Download PDF

Info

Publication number
JP7218126B2
JP7218126B2 JP2018161962A JP2018161962A JP7218126B2 JP 7218126 B2 JP7218126 B2 JP 7218126B2 JP 2018161962 A JP2018161962 A JP 2018161962A JP 2018161962 A JP2018161962 A JP 2018161962A JP 7218126 B2 JP7218126 B2 JP 7218126B2
Authority
JP
Japan
Prior art keywords
resin member
wiring board
insulator film
edge
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018161962A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020035925A (ja
JP2020035925A5 (https=
Inventor
智史 野津
悠 青木
弘隆 関口
浩司 佐藤
幸司 都築
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2018161962A priority Critical patent/JP7218126B2/ja
Priority to US16/540,735 priority patent/US11164803B2/en
Publication of JP2020035925A publication Critical patent/JP2020035925A/ja
Publication of JP2020035925A5 publication Critical patent/JP2020035925A5/ja
Priority to US17/498,619 priority patent/US11972990B2/en
Priority to JP2023009353A priority patent/JP7476369B2/ja
Application granted granted Critical
Publication of JP7218126B2 publication Critical patent/JP7218126B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2018161962A 2018-08-30 2018-08-30 配線板を備えるユニット、モジュールおよび機器 Active JP7218126B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018161962A JP7218126B2 (ja) 2018-08-30 2018-08-30 配線板を備えるユニット、モジュールおよび機器
US16/540,735 US11164803B2 (en) 2018-08-30 2019-08-14 Unit with wiring board, module, and equipment
US17/498,619 US11972990B2 (en) 2018-08-30 2021-10-11 Unit with wiring board, module, and equipment
JP2023009353A JP7476369B2 (ja) 2018-08-30 2023-01-25 配線板を備えるユニット、モジュールおよび機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018161962A JP7218126B2 (ja) 2018-08-30 2018-08-30 配線板を備えるユニット、モジュールおよび機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023009353A Division JP7476369B2 (ja) 2018-08-30 2023-01-25 配線板を備えるユニット、モジュールおよび機器

Publications (3)

Publication Number Publication Date
JP2020035925A JP2020035925A (ja) 2020-03-05
JP2020035925A5 JP2020035925A5 (https=) 2021-10-07
JP7218126B2 true JP7218126B2 (ja) 2023-02-06

Family

ID=69641658

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018161962A Active JP7218126B2 (ja) 2018-08-30 2018-08-30 配線板を備えるユニット、モジュールおよび機器
JP2023009353A Active JP7476369B2 (ja) 2018-08-30 2023-01-25 配線板を備えるユニット、モジュールおよび機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023009353A Active JP7476369B2 (ja) 2018-08-30 2023-01-25 配線板を備えるユニット、モジュールおよび機器

Country Status (2)

Country Link
US (2) US11164803B2 (https=)
JP (2) JP7218126B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器
US11239222B2 (en) * 2019-10-28 2022-02-01 Electronics And Telecommunications Research Institute Cooled optical transmission module device and method of manufacturing the same
KR20230023834A (ko) * 2020-12-09 2023-02-20 주식회사 솔루엠 에어포켓 방지 기판, 에어포켓 방지 기판 모듈, 이를 포함하는 전기기기 및 이를 포함하는 전기기기의 제조 방법
US12159850B2 (en) * 2020-12-25 2024-12-03 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12154884B2 (en) * 2021-02-01 2024-11-26 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
JP7538503B2 (ja) * 2021-09-16 2024-08-22 株式会社東芝 半導体パッケージ
WO2024224807A1 (ja) * 2023-04-28 2024-10-31 ソニーセミコンダクタソリューションズ株式会社 半導体パッケージ、および、半導体パッケージの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142616A (ja) 2001-11-08 2003-05-16 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP2015185763A (ja) 2014-03-25 2015-10-22 エムテックスマツムラ株式会社 半導体素子実装用中空パッケージ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079951B2 (ja) * 1986-12-04 1995-02-01 沖電気工業株式会社 半導体装置の製造方法
JPH06350068A (ja) 1993-06-03 1994-12-22 Hamamatsu Photonics Kk 半導体エネルギー線検出器の製造方法
JP2003110945A (ja) 2001-09-26 2003-04-11 Sanyo Electric Co Ltd カメラモジュール
JP3898666B2 (ja) 2003-04-28 2007-03-28 松下電器産業株式会社 固体撮像装置およびその製造方法
JP4106003B2 (ja) 2003-09-03 2008-06-25 松下電器産業株式会社 固体撮像装置の製造方法
JP4147171B2 (ja) 2003-10-23 2008-09-10 松下電器産業株式会社 固体撮像装置およびその製造方法
JP2007019275A (ja) 2005-07-07 2007-01-25 Rohm Co Ltd 半導体装置、基板及び半導体装置の製造方法
JP2008130738A (ja) 2006-11-20 2008-06-05 Fujifilm Corp 固体撮像素子
TWI425718B (zh) * 2011-06-21 2014-02-01 財團法人國家實驗研究院國家晶片系統設計中心 連接座結構組及其連接座結構
JP6296687B2 (ja) 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP6075380B2 (ja) * 2012-10-15 2017-02-08 富士電機株式会社 半導体装置
JP5498604B1 (ja) 2013-04-17 2014-05-21 エムテックスマツムラ株式会社 固体撮像素子用中空パッケージ
CN106663731B (zh) * 2014-08-05 2019-08-06 西铁城电子株式会社 半导体装置及其制造方法
JP6111284B2 (ja) 2015-04-28 2017-04-05 エムテックスマツムラ株式会社 中空パッケージの製造方法、固体撮像素子の製造方法、中空パッケージおよび固体撮像素子
JP6582754B2 (ja) * 2015-08-31 2019-10-02 日亜化学工業株式会社 複合基板、発光装置、及び発光装置の製造方法
JP6648525B2 (ja) 2015-12-28 2020-02-14 株式会社ニコン 基板、撮像ユニットおよび撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142616A (ja) 2001-11-08 2003-05-16 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP2015185763A (ja) 2014-03-25 2015-10-22 エムテックスマツムラ株式会社 半導体素子実装用中空パッケージ

Also Published As

Publication number Publication date
JP2023052621A (ja) 2023-04-11
US11972990B2 (en) 2024-04-30
US11164803B2 (en) 2021-11-02
JP7476369B2 (ja) 2024-04-30
JP2020035925A (ja) 2020-03-05
US20220030716A1 (en) 2022-01-27
US20200075437A1 (en) 2020-03-05

Similar Documents

Publication Publication Date Title
JP7218126B2 (ja) 配線板を備えるユニット、モジュールおよび機器
US12022180B2 (en) Array camera module and application thereof
US9966401B2 (en) Package for image sensor with outer and inner frames
US20090059055A1 (en) Optical device and method for fabricating the same
JP6939561B2 (ja) 撮像素子パッケージ、撮像装置及び撮像素子パッケージの製造方法
US10236243B2 (en) Electronic component, electronic module, manufacturing method therefor, and electronic apparatus
WO2020183881A1 (ja) 半導体装置
JP2008277593A (ja) 回路基板、それを用いた光学デバイス、カメラモジュール、およびその製造方法
CN112447783A (zh) 安装有图像传感器的安装基板、传感器组件及其制造方法
US10763293B2 (en) Image sensing chip package and image sensing chip packaging method
US11342293B2 (en) Semiconductor apparatus and equipment
JP6990317B2 (ja) 撮像ユニット及び撮像装置
JP6757862B2 (ja) 撮像ユニット及び撮像装置
US20190082084A1 (en) Image Sensor Modules Having Support Structures
US20250294903A1 (en) Electronic component and method of manufacturing electronic component
JP3696142B2 (ja) 固体撮像装置
JP7695079B2 (ja) 電子機器
TWI427779B (zh) 影像感測器封裝結構及其製造方法
US20230317749A1 (en) Photoelectric conversion device and equipment
JP2024074533A (ja) 電子部品および機器
JP2011199511A (ja) 固体撮像装置
JP2006269784A (ja) 撮像装置
JP2025093252A (ja) 電子部品
JP2024037400A (ja) パッケージ、電子部品および機器
JP2021193723A (ja) 実装基板、センサパッケージ及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210825

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210825

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220623

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220802

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220928

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221227

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230125

R151 Written notification of patent or utility model registration

Ref document number: 7218126

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151