JP7208757B2 - 制御装置 - Google Patents
制御装置 Download PDFInfo
- Publication number
- JP7208757B2 JP7208757B2 JP2018188525A JP2018188525A JP7208757B2 JP 7208757 B2 JP7208757 B2 JP 7208757B2 JP 2018188525 A JP2018188525 A JP 2018188525A JP 2018188525 A JP2018188525 A JP 2018188525A JP 7208757 B2 JP7208757 B2 JP 7208757B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- substrate
- fixed
- guided
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Manipulator (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018188525A JP7208757B2 (ja) | 2018-10-03 | 2018-10-03 | 制御装置 |
CN201980064432.XA CN112806108B (zh) | 2018-10-03 | 2019-10-02 | 控制装置 |
PCT/JP2019/038918 WO2020071425A1 (ja) | 2018-10-03 | 2019-10-02 | 制御装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018188525A JP7208757B2 (ja) | 2018-10-03 | 2018-10-03 | 制御装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020057717A JP2020057717A (ja) | 2020-04-09 |
JP7208757B2 true JP7208757B2 (ja) | 2023-01-19 |
Family
ID=70055230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018188525A Active JP7208757B2 (ja) | 2018-10-03 | 2018-10-03 | 制御装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7208757B2 (zh) |
CN (1) | CN112806108B (zh) |
WO (1) | WO2020071425A1 (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003235112A (ja) | 2001-12-07 | 2003-08-22 | Toshiba Transport Eng Inc | 電力変換装置 |
JP2004248426A (ja) | 2003-02-14 | 2004-09-02 | Sumitomo Wiring Syst Ltd | パワーモジュール及びその製造方法 |
JP2007165423A (ja) | 2005-12-12 | 2007-06-28 | Yaskawa Electric Corp | 電子機器装置 |
US20100177484A1 (en) | 2009-01-12 | 2010-07-15 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Heat sink |
JP2010225874A (ja) | 2009-03-24 | 2010-10-07 | Toppan Printing Co Ltd | ヒートシンク付き基板及び筐体 |
JP2017045788A (ja) | 2015-08-25 | 2017-03-02 | ファナック株式会社 | モータ駆動装置の取り付けが容易なモータ駆動装置を備える装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004349345A (ja) * | 2003-05-20 | 2004-12-09 | Denso Corp | 電子制御装置 |
JP5439309B2 (ja) * | 2010-07-28 | 2014-03-12 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
CN103339839B (zh) * | 2011-01-31 | 2015-12-09 | 丰田自动车株式会社 | 电力控制装置的搭载结构 |
JP2013114782A (ja) * | 2011-11-25 | 2013-06-10 | Sanyo Electric Co Ltd | 電池パック |
WO2013105166A1 (ja) * | 2012-01-13 | 2013-07-18 | 富士電機株式会社 | 電力変換装置 |
JP2014093414A (ja) * | 2012-11-02 | 2014-05-19 | Hitachi Automotive Systems Ltd | 電子制御装置 |
CN205256734U (zh) * | 2015-12-28 | 2016-05-25 | 苏州蒂勒智能科技有限公司 | 一种手机贴膜器 |
JP2017195663A (ja) * | 2016-04-18 | 2017-10-26 | アスモ株式会社 | モータ装置 |
-
2018
- 2018-10-03 JP JP2018188525A patent/JP7208757B2/ja active Active
-
2019
- 2019-10-02 WO PCT/JP2019/038918 patent/WO2020071425A1/ja active Application Filing
- 2019-10-02 CN CN201980064432.XA patent/CN112806108B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003235112A (ja) | 2001-12-07 | 2003-08-22 | Toshiba Transport Eng Inc | 電力変換装置 |
JP2004248426A (ja) | 2003-02-14 | 2004-09-02 | Sumitomo Wiring Syst Ltd | パワーモジュール及びその製造方法 |
JP2007165423A (ja) | 2005-12-12 | 2007-06-28 | Yaskawa Electric Corp | 電子機器装置 |
US20100177484A1 (en) | 2009-01-12 | 2010-07-15 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Heat sink |
JP2010225874A (ja) | 2009-03-24 | 2010-10-07 | Toppan Printing Co Ltd | ヒートシンク付き基板及び筐体 |
JP2017045788A (ja) | 2015-08-25 | 2017-03-02 | ファナック株式会社 | モータ駆動装置の取り付けが容易なモータ駆動装置を備える装置 |
Also Published As
Publication number | Publication date |
---|---|
CN112806108B (zh) | 2023-12-15 |
WO2020071425A1 (ja) | 2020-04-09 |
JP2020057717A (ja) | 2020-04-09 |
CN112806108A (zh) | 2021-05-14 |
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