JP7205662B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP7205662B2
JP7205662B2 JP2022508097A JP2022508097A JP7205662B2 JP 7205662 B2 JP7205662 B2 JP 7205662B2 JP 2022508097 A JP2022508097 A JP 2022508097A JP 2022508097 A JP2022508097 A JP 2022508097A JP 7205662 B2 JP7205662 B2 JP 7205662B2
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JP
Japan
Prior art keywords
semiconductor module
pin fins
top plate
module according
fin
Prior art date
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JP2022508097A
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English (en)
Japanese (ja)
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JPWO2021186891A1 (https=
JPWO2021186891A5 (https=
Inventor
義博 立石
竜彦 浅井
貴裕 小山
広道 郷原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of JPWO2021186891A1 publication Critical patent/JPWO2021186891A1/ja
Publication of JPWO2021186891A5 publication Critical patent/JPWO2021186891A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2022508097A 2020-03-18 2021-01-21 半導体モジュール Active JP7205662B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020047766 2020-03-18
JP2020047766 2020-03-18
PCT/JP2021/002072 WO2021186891A1 (ja) 2020-03-18 2021-01-21 半導体モジュール

Publications (3)

Publication Number Publication Date
JPWO2021186891A1 JPWO2021186891A1 (https=) 2021-09-23
JPWO2021186891A5 JPWO2021186891A5 (https=) 2022-05-31
JP7205662B2 true JP7205662B2 (ja) 2023-01-17

Family

ID=77770797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508097A Active JP7205662B2 (ja) 2020-03-18 2021-01-21 半導体モジュール

Country Status (4)

Country Link
US (1) US12127382B2 (https=)
JP (1) JP7205662B2 (https=)
CN (1) CN114365282B (https=)
WO (1) WO2021186891A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3671828A1 (en) * 2018-12-21 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Evaporative microchip cooling
JP7577948B2 (ja) * 2020-09-15 2024-11-06 富士電機株式会社 冷却器及び半導体装置
WO2026014178A1 (ja) * 2024-07-10 2026-01-15 株式会社デンソー 冷却器、および、電力変換装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176881A (ja) 2008-01-23 2009-08-06 Nissan Motor Co Ltd 冷却装置
WO2012157247A1 (ja) 2011-05-16 2012-11-22 富士電機株式会社 半導体モジュール用冷却器
WO2016042903A1 (ja) 2014-09-17 2016-03-24 富士電機株式会社 半導体モジュール
JP2018133350A (ja) 2017-02-13 2018-08-23 株式会社Uacj 回路基板付きヒートシンク及びその製造方法
JP2019204922A (ja) 2018-05-25 2019-11-28 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
JP2020035927A (ja) 2018-08-30 2020-03-05 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP2020092250A (ja) 2018-11-22 2020-06-11 富士電機株式会社 半導体モジュール、車両および製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20112594U1 (de) * 2001-07-31 2002-01-17 TRW Automotive Electronics & Components GmbH & Co. KG, 78315 Radolfzell Elektronisches Steuergerät in Fahrzeugen
JP4675283B2 (ja) * 2006-06-14 2011-04-20 トヨタ自動車株式会社 ヒートシンクおよび冷却器
EP2417843A2 (en) * 2009-04-08 2012-02-15 NS Acquisition LLC Low stress-inducing heat sink
JP5686606B2 (ja) * 2010-01-12 2015-03-18 日本軽金属株式会社 フィン一体型基板の製造方法およびフィン一体型基板
JP5790039B2 (ja) * 2010-07-23 2015-10-07 富士電機株式会社 半導体装置
EP2704191B1 (en) * 2011-04-26 2019-03-13 Fuji Electric Co., Ltd. Cooler for semiconductor module
CN104145333B (zh) * 2012-04-16 2018-02-02 富士电机株式会社 半导体装置以及半导体装置用冷却器
JP6262422B2 (ja) * 2012-10-02 2018-01-17 昭和電工株式会社 冷却装置および半導体装置
WO2014069174A1 (ja) * 2012-10-29 2014-05-08 富士電機株式会社 半導体装置
US10957621B2 (en) * 2014-05-30 2021-03-23 Avid Controls, Inc. Heat sink for a power semiconductor module
US11003227B2 (en) * 2015-06-03 2021-05-11 Mitsubishi Electric Corporation Liquid-type cooling apparatus and manufacturing method for heat radiation fin in liquid-type cooling apparatus
CN109076716B (zh) * 2016-05-10 2020-10-27 三菱电机株式会社 散热器
JP6662242B2 (ja) * 2016-08-24 2020-03-11 トヨタ自動車株式会社 半導体装置
JP7039917B2 (ja) * 2017-10-06 2022-03-23 富士電機株式会社 冷却器
JP7205071B2 (ja) * 2018-04-02 2023-01-17 富士電機株式会社 冷却装置、半導体モジュールおよび車両
CN110543069A (zh) * 2018-05-28 2019-12-06 中强光电股份有限公司 液冷式散热器
WO2020020619A1 (de) * 2018-07-23 2020-01-30 Siemens Aktiengesellschaft Kühlung von bauteilen, stromrichter und luftfahrzeug
US11129310B2 (en) * 2018-11-22 2021-09-21 Fuji Electric Co., Ltd. Semiconductor module, vehicle and manufacturing method
JP7243262B2 (ja) * 2019-02-15 2023-03-22 富士電機株式会社 半導体モジュール、車両および製造方法
US11145571B2 (en) * 2019-06-04 2021-10-12 Semiconductor Components Industries, Llc Heat transfer for power modules

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176881A (ja) 2008-01-23 2009-08-06 Nissan Motor Co Ltd 冷却装置
WO2012157247A1 (ja) 2011-05-16 2012-11-22 富士電機株式会社 半導体モジュール用冷却器
WO2016042903A1 (ja) 2014-09-17 2016-03-24 富士電機株式会社 半導体モジュール
JP2018133350A (ja) 2017-02-13 2018-08-23 株式会社Uacj 回路基板付きヒートシンク及びその製造方法
JP2019204922A (ja) 2018-05-25 2019-11-28 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
JP2020035927A (ja) 2018-08-30 2020-03-05 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP2020092250A (ja) 2018-11-22 2020-06-11 富士電機株式会社 半導体モジュール、車両および製造方法

Also Published As

Publication number Publication date
US20220183194A1 (en) 2022-06-09
JPWO2021186891A1 (https=) 2021-09-23
CN114365282A (zh) 2022-04-15
US12127382B2 (en) 2024-10-22
WO2021186891A1 (ja) 2021-09-23
CN114365282B (zh) 2026-01-23

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