CN114365282B - 半导体模块 - Google Patents

半导体模块

Info

Publication number
CN114365282B
CN114365282B CN202180005166.0A CN202180005166A CN114365282B CN 114365282 B CN114365282 B CN 114365282B CN 202180005166 A CN202180005166 A CN 202180005166A CN 114365282 B CN114365282 B CN 114365282B
Authority
CN
China
Prior art keywords
fin
top plate
semiconductor module
pin
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180005166.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN114365282A (zh
Inventor
立石义博
浅井竜彦
小山贵裕
乡原广道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN114365282A publication Critical patent/CN114365282A/zh
Application granted granted Critical
Publication of CN114365282B publication Critical patent/CN114365282B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202180005166.0A 2020-03-18 2021-01-21 半导体模块 Active CN114365282B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020047766 2020-03-18
JP2020-047766 2020-03-18
PCT/JP2021/002072 WO2021186891A1 (ja) 2020-03-18 2021-01-21 半導体モジュール

Publications (2)

Publication Number Publication Date
CN114365282A CN114365282A (zh) 2022-04-15
CN114365282B true CN114365282B (zh) 2026-01-23

Family

ID=77770797

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180005166.0A Active CN114365282B (zh) 2020-03-18 2021-01-21 半导体模块

Country Status (4)

Country Link
US (1) US12127382B2 (https=)
JP (1) JP7205662B2 (https=)
CN (1) CN114365282B (https=)
WO (1) WO2021186891A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3671828A1 (en) * 2018-12-21 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Evaporative microchip cooling
JP7577948B2 (ja) * 2020-09-15 2024-11-06 富士電機株式会社 冷却器及び半導体装置
WO2026014178A1 (ja) * 2024-07-10 2026-01-15 株式会社デンソー 冷却器、および、電力変換装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20112594U1 (de) * 2001-07-31 2002-01-17 TRW Automotive Electronics & Components GmbH & Co. KG, 78315 Radolfzell Elektronisches Steuergerät in Fahrzeugen
JP4675283B2 (ja) * 2006-06-14 2011-04-20 トヨタ自動車株式会社 ヒートシンクおよび冷却器
JP2009176881A (ja) * 2008-01-23 2009-08-06 Nissan Motor Co Ltd 冷却装置
EP2417843A2 (en) * 2009-04-08 2012-02-15 NS Acquisition LLC Low stress-inducing heat sink
JP5686606B2 (ja) * 2010-01-12 2015-03-18 日本軽金属株式会社 フィン一体型基板の製造方法およびフィン一体型基板
JP5790039B2 (ja) * 2010-07-23 2015-10-07 富士電機株式会社 半導体装置
EP2704191B1 (en) * 2011-04-26 2019-03-13 Fuji Electric Co., Ltd. Cooler for semiconductor module
JPWO2012157247A1 (ja) 2011-05-16 2014-07-31 富士電機株式会社 半導体モジュール用冷却器
CN104145333B (zh) * 2012-04-16 2018-02-02 富士电机株式会社 半导体装置以及半导体装置用冷却器
JP6262422B2 (ja) * 2012-10-02 2018-01-17 昭和電工株式会社 冷却装置および半導体装置
WO2014069174A1 (ja) * 2012-10-29 2014-05-08 富士電機株式会社 半導体装置
US10957621B2 (en) * 2014-05-30 2021-03-23 Avid Controls, Inc. Heat sink for a power semiconductor module
JP6344477B2 (ja) * 2014-09-17 2018-06-20 富士電機株式会社 半導体モジュール
US11003227B2 (en) * 2015-06-03 2021-05-11 Mitsubishi Electric Corporation Liquid-type cooling apparatus and manufacturing method for heat radiation fin in liquid-type cooling apparatus
CN109076716B (zh) * 2016-05-10 2020-10-27 三菱电机株式会社 散热器
JP6662242B2 (ja) * 2016-08-24 2020-03-11 トヨタ自動車株式会社 半導体装置
JP2018133350A (ja) * 2017-02-13 2018-08-23 株式会社Uacj 回路基板付きヒートシンク及びその製造方法
JP7039917B2 (ja) * 2017-10-06 2022-03-23 富士電機株式会社 冷却器
JP7205071B2 (ja) * 2018-04-02 2023-01-17 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7159617B2 (ja) * 2018-05-25 2022-10-25 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
CN110543069A (zh) * 2018-05-28 2019-12-06 中强光电股份有限公司 液冷式散热器
WO2020020619A1 (de) * 2018-07-23 2020-01-30 Siemens Aktiengesellschaft Kühlung von bauteilen, stromrichter und luftfahrzeug
JP7200549B2 (ja) * 2018-08-30 2023-01-10 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7367394B2 (ja) 2018-11-22 2023-10-24 富士電機株式会社 半導体モジュール、車両および製造方法
US11129310B2 (en) * 2018-11-22 2021-09-21 Fuji Electric Co., Ltd. Semiconductor module, vehicle and manufacturing method
JP7243262B2 (ja) * 2019-02-15 2023-03-22 富士電機株式会社 半導体モジュール、車両および製造方法
US11145571B2 (en) * 2019-06-04 2021-10-12 Semiconductor Components Industries, Llc Heat transfer for power modules

Also Published As

Publication number Publication date
US20220183194A1 (en) 2022-06-09
JPWO2021186891A1 (https=) 2021-09-23
CN114365282A (zh) 2022-04-15
US12127382B2 (en) 2024-10-22
WO2021186891A1 (ja) 2021-09-23
JP7205662B2 (ja) 2023-01-17

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