JP7194116B2 - 酸化ケイ素の核形成/接着の向上により膜粗さを改善するための処理アプローチ - Google Patents
酸化ケイ素の核形成/接着の向上により膜粗さを改善するための処理アプローチ Download PDFInfo
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- JP7194116B2 JP7194116B2 JP2019554823A JP2019554823A JP7194116B2 JP 7194116 B2 JP7194116 B2 JP 7194116B2 JP 2019554823 A JP2019554823 A JP 2019554823A JP 2019554823 A JP2019554823 A JP 2019554823A JP 7194116 B2 JP7194116 B2 JP 7194116B2
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- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
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- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
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- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
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- H10P14/3451—Structure
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- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
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- H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
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- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
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- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762482872P | 2017-04-07 | 2017-04-07 | |
| US62/482,872 | 2017-04-07 | ||
| PCT/US2018/023474 WO2018187034A1 (en) | 2017-04-07 | 2018-03-21 | Treatment approach to improve film roughness by improving nucleation/adhesion of silicon oxide |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020517098A JP2020517098A (ja) | 2020-06-11 |
| JP2020517098A5 JP2020517098A5 (https=) | 2021-05-06 |
| JP7194116B2 true JP7194116B2 (ja) | 2022-12-21 |
Family
ID=63711859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019554823A Active JP7194116B2 (ja) | 2017-04-07 | 2018-03-21 | 酸化ケイ素の核形成/接着の向上により膜粗さを改善するための処理アプローチ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10276379B2 (https=) |
| JP (1) | JP7194116B2 (https=) |
| KR (1) | KR102492223B1 (https=) |
| CN (1) | CN110419093B (https=) |
| WO (1) | WO2018187034A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102509390B1 (ko) * | 2017-07-24 | 2023-03-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 산화규소 상의 초박형 비정질 규소 막의 연속성을 개선하기 위한 전처리 접근법 |
| KR20190035036A (ko) * | 2017-09-25 | 2019-04-03 | 삼성전자주식회사 | 박막 형성 장치 및 이를 이용한 비정질 실리콘 막 형성방법 |
| KR102578827B1 (ko) * | 2018-04-24 | 2023-09-15 | 삼성전자주식회사 | 유연한 유무기 보호막 및 그 제조방법 |
| JP7627432B2 (ja) * | 2019-12-10 | 2025-02-06 | 東京エレクトロン株式会社 | 犠牲キャッピング層としての自己組織化単分子層 |
| US20210327891A1 (en) * | 2020-04-16 | 2021-10-21 | Applied Materials, Inc. | Stack for 3d-nand memory cell |
| US11640905B2 (en) * | 2020-12-17 | 2023-05-02 | Applied Materials, Inc. | Plasma enhanced deposition of silicon-containing films at low temperature |
| KR20250129178A (ko) | 2024-02-22 | 2025-08-29 | 세메스 주식회사 | 기판 처리 방법 및 시스템 |
Citations (3)
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| JP2000031058A (ja) | 1998-07-16 | 2000-01-28 | Ulvac Corp | アモルファスシリコン薄膜製造方法 |
| JP2016047777A (ja) | 2014-08-27 | 2016-04-07 | 国立大学法人大阪大学 | グラフェン薄膜の製造方法、並びにグラフェン薄膜を備えた電子素子およびセンサ |
| JP2017034233A (ja) | 2015-06-08 | 2017-02-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | フィールドガイドによる埋設式露光、及び露光後ベークプロセス |
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| JP3181357B2 (ja) | 1991-08-19 | 2001-07-03 | 株式会社東芝 | 半導体薄膜の形成方法および半導体装置の製造方法 |
| JPH05160394A (ja) * | 1991-10-11 | 1993-06-25 | Sony Corp | Mis型半導体装置及びその製造方法 |
| US5273920A (en) * | 1992-09-02 | 1993-12-28 | General Electric Company | Method of fabricating a thin film transistor using hydrogen plasma treatment of the gate dielectric/semiconductor layer interface |
| JPH07252657A (ja) * | 1994-03-16 | 1995-10-03 | Mitsubishi Heavy Ind Ltd | 成膜方法 |
| US5800878A (en) | 1996-10-24 | 1998-09-01 | Applied Materials, Inc. | Reducing hydrogen concentration in pecvd amorphous silicon carbide films |
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| US7186630B2 (en) | 2002-08-14 | 2007-03-06 | Asm America, Inc. | Deposition of amorphous silicon-containing films |
| US6939794B2 (en) | 2003-06-17 | 2005-09-06 | Micron Technology, Inc. | Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device |
| CN100345249C (zh) * | 2005-04-20 | 2007-10-24 | 中山大学 | 一种制作硅纳米线二极管结构场发射器件的方法 |
| US7651955B2 (en) * | 2005-06-21 | 2010-01-26 | Applied Materials, Inc. | Method for forming silicon-containing materials during a photoexcitation deposition process |
| US7662718B2 (en) | 2006-03-09 | 2010-02-16 | Micron Technology, Inc. | Trim process for critical dimension control for integrated circuits |
| US7485572B2 (en) | 2006-09-25 | 2009-02-03 | International Business Machines Corporation | Method for improved formation of cobalt silicide contacts in semiconductor devices |
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| JP2008192724A (ja) * | 2007-02-02 | 2008-08-21 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ及び有機薄膜トランジスタの製造方法 |
| US20080254619A1 (en) | 2007-04-14 | 2008-10-16 | Tsang-Jung Lin | Method of fabricating a semiconductor device |
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- 2018-03-21 JP JP2019554823A patent/JP7194116B2/ja active Active
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| CN110419093B (zh) | 2023-12-01 |
| CN110419093A (zh) | 2019-11-05 |
| KR102492223B1 (ko) | 2023-01-25 |
| WO2018187034A1 (en) | 2018-10-11 |
| KR20190128668A (ko) | 2019-11-18 |
| US20180294157A1 (en) | 2018-10-11 |
| JP2020517098A (ja) | 2020-06-11 |
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