JP7186095B2 - 基板処理装置、基板処理方法及び記憶媒体 - Google Patents

基板処理装置、基板処理方法及び記憶媒体 Download PDF

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Publication number
JP7186095B2
JP7186095B2 JP2019001330A JP2019001330A JP7186095B2 JP 7186095 B2 JP7186095 B2 JP 7186095B2 JP 2019001330 A JP2019001330 A JP 2019001330A JP 2019001330 A JP2019001330 A JP 2019001330A JP 7186095 B2 JP7186095 B2 JP 7186095B2
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Prior art keywords
processing
substrate
liquid
section
adsorption
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JP2019001330A
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Japanese (ja)
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JP2020113577A (ja
Inventor
宏展 百武
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2019001330A priority Critical patent/JP7186095B2/ja
Priority to CN201911375970.9A priority patent/CN111415883B/zh
Publication of JP2020113577A publication Critical patent/JP2020113577A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2019001330A 2019-01-08 2019-01-08 基板処理装置、基板処理方法及び記憶媒体 Active JP7186095B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019001330A JP7186095B2 (ja) 2019-01-08 2019-01-08 基板処理装置、基板処理方法及び記憶媒体
CN201911375970.9A CN111415883B (zh) 2019-01-08 2019-12-27 基片处理装置、基片处理方法和存储介质

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019001330A JP7186095B2 (ja) 2019-01-08 2019-01-08 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

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JP2020113577A JP2020113577A (ja) 2020-07-27
JP7186095B2 true JP7186095B2 (ja) 2022-12-08

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JP (1) JP7186095B2 (zh)
CN (1) CN111415883B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243219A (ja) 2012-05-18 2013-12-05 Shin Etsu Handotai Co Ltd 半導体ウェーハの洗浄方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109683A (ja) * 1991-03-27 1993-04-30 Mitsubishi Materials Corp 半導体シリコンウエーハ洗浄液の金属不純物除去方法
JP2893493B2 (ja) * 1991-12-13 1999-05-24 三菱マテリアル株式会社 シリコンウェーハの洗浄方法
US5501767A (en) * 1992-11-13 1996-03-26 Micron Technology, Inc. Method for gettering noble metals from mineral acid solution
JPH0845885A (ja) * 1994-07-26 1996-02-16 Sony Corp ウェーハの洗浄方法
JP3355827B2 (ja) * 1994-11-22 2002-12-09 ソニー株式会社 処理液による半導体処理方法及び半導体処理装置
JP2005093733A (ja) * 2003-09-17 2005-04-07 Ebara Corp 基板処理装置
JP2006231319A (ja) * 2005-01-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
CN101122024A (zh) * 2006-05-18 2008-02-13 住友精密工业株式会社 处理液处理装置和具备该装置的基板处理装置
JP2008291312A (ja) * 2007-05-24 2008-12-04 Sumitomo Precision Prod Co Ltd 基板処理装置
JP5977727B2 (ja) * 2013-11-13 2016-08-24 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
JP6453724B2 (ja) * 2014-08-26 2019-01-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置
JP6370233B2 (ja) * 2015-01-30 2018-08-08 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6857526B2 (ja) * 2017-03-27 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243219A (ja) 2012-05-18 2013-12-05 Shin Etsu Handotai Co Ltd 半導体ウェーハの洗浄方法

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Publication number Publication date
CN111415883B (zh) 2024-04-02
CN111415883A (zh) 2020-07-14
JP2020113577A (ja) 2020-07-27

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