JP7173792B2 - ウエーハの保護方法 - Google Patents
ウエーハの保護方法 Download PDFInfo
- Publication number
- JP7173792B2 JP7173792B2 JP2018158913A JP2018158913A JP7173792B2 JP 7173792 B2 JP7173792 B2 JP 7173792B2 JP 2018158913 A JP2018158913 A JP 2018158913A JP 2018158913 A JP2018158913 A JP 2018158913A JP 7173792 B2 JP7173792 B2 JP 7173792B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- wafer
- protective member
- adhesive force
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Formation Of Insulating Films (AREA)
Description
12:デバイス
14:分割予定ライン
20:シート
20A:シートロール
22:保護部材領域
22a:保護部材
24:保護部材
30A:第一の加熱手段
30B:第二の加熱手段
32A:第一のヒータ本体部
32B:第二のヒータ本体部
34A:第一の噴射部
34B:第二の噴射部
40:保持テーブル
52:ローラカッター
60:研削装置
62:チャックテーブル
70:研削手段
80:保持テーブル
90:ダイシング装置
F:フレーム
Claims (3)
- ウエーハの面に、シート状の保護部材を配設してウエーハを保護するウエーハの保護方法であって、
保護部材の基材となるポリオレフィン系のシート、又はポリエステル系のシートを準備するシート準備工程と、
該シートの面を加熱して粘着力を生成する粘着力生成工程と、
粘着力が生成されたシートの面を、保護すべきウエーハの面に敷設し、押圧力を付与してウエーハの面に該シートを圧着するシート圧着工程と、
該ウエーハの面に圧着したシートを加熱して粘着力を強化する粘着力強化工程と、
から少なくとも構成され、
該粘着力生成工程において、第一の加熱手段から熱風を噴射してシートの面に吹付け、シート自体を溶融させることなく、且つ粘着力が付与される温度に加熱して、該シートに粘着力を生成するウエーハの保護方法。 - 該粘着力強化工程において、第二の加熱手段から熱風を噴射してシートの面に吹付け、シート自体を溶融させることなく、且つ粘着力が付与される温度に加熱して、粘着力を強化する請求項1に記載のウエーハの保護方法。
- 該粘着力強化工程においてシートを加熱する際のシートの目標温度を、該粘着力生成工程においてシートを加熱する際のシートの目標温度と同等、又はそれよりも高く設定する請求項1、又は2に記載のウエーハの保護方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018158913A JP7173792B2 (ja) | 2018-08-28 | 2018-08-28 | ウエーハの保護方法 |
KR1020190088278A KR20200024709A (ko) | 2018-08-28 | 2019-07-22 | 웨이퍼의 보호 방법 |
CN201910710463.XA CN110867396B (zh) | 2018-08-28 | 2019-08-02 | 晶片的保护方法 |
TW108130335A TWI811436B (zh) | 2018-08-28 | 2019-08-23 | 晶圓保護方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018158913A JP7173792B2 (ja) | 2018-08-28 | 2018-08-28 | ウエーハの保護方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020035803A JP2020035803A (ja) | 2020-03-05 |
JP7173792B2 true JP7173792B2 (ja) | 2022-11-16 |
Family
ID=69652153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018158913A Active JP7173792B2 (ja) | 2018-08-28 | 2018-08-28 | ウエーハの保護方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7173792B2 (ja) |
KR (1) | KR20200024709A (ja) |
CN (1) | CN110867396B (ja) |
TW (1) | TWI811436B (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007165636A (ja) | 2005-12-14 | 2007-06-28 | Nippon Zeon Co Ltd | 半導体素子の製造方法 |
JP2008166459A (ja) | 2006-12-28 | 2008-07-17 | Tateyama Machine Kk | 保護テープ貼付方法と装置 |
JP2013219175A (ja) | 2012-04-09 | 2013-10-24 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JP2015126183A (ja) | 2013-12-27 | 2015-07-06 | 日東精機株式会社 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191297A (ja) * | 2003-12-25 | 2005-07-14 | Jsr Corp | ダイシングフィルム及び半導体ウェハの切断方法 |
JP2005246491A (ja) | 2004-03-01 | 2005-09-15 | Disco Abrasive Syst Ltd | 研削装置及びウェーハの研削方法 |
JP2018074082A (ja) * | 2016-11-02 | 2018-05-10 | 株式会社ディスコ | ウエーハの加工方法 |
-
2018
- 2018-08-28 JP JP2018158913A patent/JP7173792B2/ja active Active
-
2019
- 2019-07-22 KR KR1020190088278A patent/KR20200024709A/ko not_active Application Discontinuation
- 2019-08-02 CN CN201910710463.XA patent/CN110867396B/zh active Active
- 2019-08-23 TW TW108130335A patent/TWI811436B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007165636A (ja) | 2005-12-14 | 2007-06-28 | Nippon Zeon Co Ltd | 半導体素子の製造方法 |
JP2008166459A (ja) | 2006-12-28 | 2008-07-17 | Tateyama Machine Kk | 保護テープ貼付方法と装置 |
JP2013219175A (ja) | 2012-04-09 | 2013-10-24 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JP2015126183A (ja) | 2013-12-27 | 2015-07-06 | 日東精機株式会社 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110867396B (zh) | 2024-02-20 |
TW202010009A (zh) | 2020-03-01 |
TWI811436B (zh) | 2023-08-11 |
JP2020035803A (ja) | 2020-03-05 |
CN110867396A (zh) | 2020-03-06 |
KR20200024709A (ko) | 2020-03-09 |
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