JP7171568B2 - 半導体素子およびこれを含む表示装置 - Google Patents
半導体素子およびこれを含む表示装置 Download PDFInfo
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- JP7171568B2 JP7171568B2 JP2019527891A JP2019527891A JP7171568B2 JP 7171568 B2 JP7171568 B2 JP 7171568B2 JP 2019527891 A JP2019527891 A JP 2019527891A JP 2019527891 A JP2019527891 A JP 2019527891A JP 7171568 B2 JP7171568 B2 JP 7171568B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
- H01L25/0655—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0157703 | 2016-11-24 | ||
| KR1020160157703A KR102639100B1 (ko) | 2016-11-24 | 2016-11-24 | 반도체 소자 및 이를 포함하는 표시 장치 |
| KR10-2016-0160753 | 2016-11-29 | ||
| KR1020160160753A KR102739437B1 (ko) | 2016-11-29 | 2016-11-29 | 반도체 소자 및 이를 포함하는 표시 장치 |
| PCT/KR2017/013560 WO2018097667A1 (ko) | 2016-11-24 | 2017-11-24 | 반도체 소자 및 이를 포함하는 표시 장치 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019536292A JP2019536292A (ja) | 2019-12-12 |
| JP2019536292A5 JP2019536292A5 (enExample) | 2020-01-30 |
| JP7171568B2 true JP7171568B2 (ja) | 2022-11-15 |
Family
ID=62196218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019527891A Active JP7171568B2 (ja) | 2016-11-24 | 2017-11-24 | 半導体素子およびこれを含む表示装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10790330B2 (enExample) |
| EP (2) | EP3547376B1 (enExample) |
| JP (1) | JP7171568B2 (enExample) |
| CN (1) | CN110024142B (enExample) |
| WO (1) | WO2018097667A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6824501B2 (ja) * | 2017-02-08 | 2021-02-03 | ウシオ電機株式会社 | 半導体発光素子 |
| TWI707491B (zh) * | 2019-12-04 | 2020-10-11 | 錼創顯示科技股份有限公司 | 微型發光二極體顯示面板 |
| KR102523976B1 (ko) * | 2017-11-21 | 2023-04-20 | 삼성전자주식회사 | 디스플레이 장치 |
| TWI852919B (zh) | 2018-01-23 | 2024-08-21 | 晶元光電股份有限公司 | 發光元件、其製造方法及顯示模組 |
| KR102551354B1 (ko) * | 2018-04-20 | 2023-07-04 | 삼성전자 주식회사 | 반도체 발광 소자 및 그 제조 방법 |
| US11985881B2 (en) * | 2018-06-29 | 2024-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Display panel, display device, input/output device, data processing device |
| KR102701627B1 (ko) * | 2018-07-03 | 2024-09-02 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조방법 |
| US11289463B2 (en) * | 2018-07-20 | 2022-03-29 | PlayNitride Inc. | Display panel |
| TWI683445B (zh) * | 2018-07-20 | 2020-01-21 | 英屬開曼群島商錼創科技股份有限公司 | 顯示面板 |
| KR102663635B1 (ko) | 2018-09-19 | 2024-05-14 | 삼성디스플레이 주식회사 | 발광 장치 및 이를 구비하는 표시 장치 |
| KR102671368B1 (ko) * | 2018-12-12 | 2024-06-04 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
| TWI733466B (zh) * | 2019-05-24 | 2021-07-11 | 晶元光電股份有限公司 | 封裝與顯示模組 |
| CN110649181B (zh) * | 2019-10-08 | 2022-04-26 | 京东方科技集团股份有限公司 | 显示基板、显示装置以及显示基板的制备方法 |
| CN110752242B (zh) * | 2019-10-31 | 2021-09-21 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
| JP2021071645A (ja) * | 2019-10-31 | 2021-05-06 | シャープ福山セミコンダクター株式会社 | 表示デバイス、および表示デバイスの製造方法 |
| TW202119652A (zh) * | 2019-10-31 | 2021-05-16 | 隆達電子股份有限公司 | 顯示裝置及其製造方法 |
| US12463077B2 (en) | 2019-10-31 | 2025-11-04 | Lextar Electronics Corporation | Method of manufacturing display device |
| JP7239451B2 (ja) * | 2019-11-14 | 2023-03-14 | アオイ電子株式会社 | 発光装置および発光装置の製造方法 |
| CN211555890U (zh) * | 2019-12-02 | 2020-09-22 | 深圳市绎立锐光科技开发有限公司 | Led显示装置 |
| US11476394B2 (en) * | 2020-01-09 | 2022-10-18 | Samsung Electronics Co., Ltd. | Light emitting device and display apparatus |
| DE102020101470A1 (de) * | 2020-01-22 | 2021-07-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauelement mit konverterschicht und verfahren zur herstellung eines bauelements |
| JP2021125616A (ja) * | 2020-02-07 | 2021-08-30 | ソニーセミコンダクタソリューションズ株式会社 | 表示装置 |
| CN113707037A (zh) * | 2020-05-22 | 2021-11-26 | 北京芯海视界三维科技有限公司 | 发光模组、显示模组、显示屏及显示器 |
| CN113851502A (zh) * | 2020-06-10 | 2021-12-28 | 华为机器有限公司 | 显示面板、显示装置及显示面板的制备方法 |
| US20220003903A1 (en) * | 2020-07-01 | 2022-01-06 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Quantum dot color filter substrate, manufacturing method thereof, and display panel |
| KR20220019198A (ko) * | 2020-08-07 | 2022-02-16 | 삼성디스플레이 주식회사 | 표시 장치 |
| US12136610B2 (en) * | 2020-11-30 | 2024-11-05 | Seoul Viosys Co., Ltd. | Unit pixel and displaying apparatus including the unit pixel |
| US12154936B2 (en) * | 2021-02-02 | 2024-11-26 | Samsung Electronics Co., Ltd. | Display module and manufacturing method thereof |
| US20220352247A1 (en) * | 2021-04-30 | 2022-11-03 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| CN117223106A (zh) * | 2021-05-17 | 2023-12-12 | 三星电子株式会社 | 显示模块和包括该显示模块的电子设备 |
| US12095012B2 (en) * | 2021-07-16 | 2024-09-17 | Epistar Corporation | Light-emitting device |
| KR102847517B1 (ko) * | 2021-07-27 | 2025-08-19 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR20230099023A (ko) * | 2021-12-27 | 2023-07-04 | 엘지디스플레이 주식회사 | 표시 장치 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010039A (ja) | 2008-06-30 | 2010-01-14 | Sharp Corp | 画像表示装置 |
| JP2011108588A (ja) | 2009-11-20 | 2011-06-02 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
| WO2013137052A1 (ja) | 2012-03-16 | 2013-09-19 | シャープ株式会社 | 蛍光体基板およびこれを備えた表示装置 |
| JP2015156431A (ja) | 2014-02-20 | 2015-08-27 | スタンレー電気株式会社 | 半導体発光素子及び半導体発光装置 |
| US20150362165A1 (en) | 2014-06-14 | 2015-12-17 | Hiphoton Co., Ltd. | Light Engine Array |
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| JP3306130B2 (ja) * | 1992-11-17 | 2002-07-24 | 三洋電機株式会社 | 発光ダイオードアレイ装置 |
| JPH11251059A (ja) * | 1998-02-27 | 1999-09-17 | Sanyo Electric Co Ltd | カラー表示装置 |
| JP2008010298A (ja) | 2006-06-29 | 2008-01-17 | Idemitsu Kosan Co Ltd | 色変換基板及びカラー表示装置 |
| EP2460191A2 (en) * | 2009-07-30 | 2012-06-06 | 3M Innovative Properties Company | Pixelated led |
| TW201216512A (en) * | 2010-10-12 | 2012-04-16 | Ubilux Optoelectronics Corp | LED capable of laterally emitting light |
| KR20130007037A (ko) | 2011-06-28 | 2013-01-18 | (주)세미머티리얼즈 | 발광소자 패키지 및 그 제조 방법 |
| JP2014199267A (ja) * | 2011-08-05 | 2014-10-23 | シャープ株式会社 | 蛍光体基板、表示装置および電子機器 |
| KR101422037B1 (ko) * | 2012-09-04 | 2014-07-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
| KR101948207B1 (ko) | 2012-09-24 | 2019-04-26 | 삼성디스플레이 주식회사 | 백색 발광 소자, 이를 포함하는 백색 발광 패널, 백색 발광 패널의 제조 방법, 및 백색 발광 소자를 포함하는 표시 장치 |
| JP2015056650A (ja) | 2013-09-13 | 2015-03-23 | 株式会社東芝 | 発光装置 |
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| GB201420452D0 (en) * | 2014-11-18 | 2014-12-31 | Mled Ltd | Integrated colour led micro-display |
| KR101688163B1 (ko) * | 2015-03-30 | 2016-12-20 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| WO2016171207A1 (ja) * | 2015-04-24 | 2016-10-27 | シャープ株式会社 | 波長変換基板、発光装置並びにこれを備えた表示装置、照明装置および電子機器 |
| WO2017209437A1 (en) * | 2016-05-31 | 2017-12-07 | Lg Electronics Inc. | Display device using semiconductor light emitting device and fabrication method thereof |
| EP4033532B1 (en) * | 2016-09-22 | 2023-11-01 | LG Electronics Inc. | Display apparatus using semiconductor light emitting device |
-
2017
- 2017-11-24 US US16/463,730 patent/US10790330B2/en active Active
- 2017-11-24 EP EP17872964.6A patent/EP3547376B1/en active Active
- 2017-11-24 WO PCT/KR2017/013560 patent/WO2018097667A1/ko not_active Ceased
- 2017-11-24 JP JP2019527891A patent/JP7171568B2/ja active Active
- 2017-11-24 EP EP23165030.0A patent/EP4224526A1/en active Pending
- 2017-11-24 CN CN201780072900.9A patent/CN110024142B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010039A (ja) | 2008-06-30 | 2010-01-14 | Sharp Corp | 画像表示装置 |
| JP2011108588A (ja) | 2009-11-20 | 2011-06-02 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
| WO2013137052A1 (ja) | 2012-03-16 | 2013-09-19 | シャープ株式会社 | 蛍光体基板およびこれを備えた表示装置 |
| JP2015156431A (ja) | 2014-02-20 | 2015-08-27 | スタンレー電気株式会社 | 半導体発光素子及び半導体発光装置 |
| US20150362165A1 (en) | 2014-06-14 | 2015-12-17 | Hiphoton Co., Ltd. | Light Engine Array |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110024142B (zh) | 2023-02-17 |
| US10790330B2 (en) | 2020-09-29 |
| EP3547376A4 (en) | 2020-07-01 |
| EP3547376A1 (en) | 2019-10-02 |
| JP2019536292A (ja) | 2019-12-12 |
| US20190378873A1 (en) | 2019-12-12 |
| WO2018097667A1 (ko) | 2018-05-31 |
| CN110024142A (zh) | 2019-07-16 |
| EP4224526A1 (en) | 2023-08-09 |
| EP3547376B1 (en) | 2023-05-17 |
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