JP7169769B2 - 基板裏面研磨部材のドレッシング装置及びドレッシング方法 - Google Patents

基板裏面研磨部材のドレッシング装置及びドレッシング方法 Download PDF

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JP7169769B2
JP7169769B2 JP2018095095A JP2018095095A JP7169769B2 JP 7169769 B2 JP7169769 B2 JP 7169769B2 JP 2018095095 A JP2018095095 A JP 2018095095A JP 2018095095 A JP2018095095 A JP 2018095095A JP 7169769 B2 JP7169769 B2 JP 7169769B2
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Prior art keywords
polishing
dressing
substrate
polishing member
back surface
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Japanese (ja)
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JP2019034400A (ja
JP2019034400A5 (enExample
Inventor
芳樹 岡本
靖史 滝口
明広 久保
隼斗 保坂
龍人 小篠
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to TW107127216A priority Critical patent/TWI785087B/zh
Priority to US16/059,344 priority patent/US11059145B2/en
Priority to KR1020180093022A priority patent/KR102570853B1/ko
Priority to CN201810908505.6A priority patent/CN109382707B/zh
Publication of JP2019034400A publication Critical patent/JP2019034400A/ja
Priority to US17/347,824 priority patent/US20210308828A1/en
Publication of JP2019034400A5 publication Critical patent/JP2019034400A5/ja
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018095095A 2017-08-10 2018-05-17 基板裏面研磨部材のドレッシング装置及びドレッシング方法 Active JP7169769B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW107127216A TWI785087B (zh) 2017-08-10 2018-08-06 基板背面研磨構件之修整裝置及修整方法
US16/059,344 US11059145B2 (en) 2017-08-10 2018-08-09 Dressing apparatus and dressing method for substrate rear surface polishing member
KR1020180093022A KR102570853B1 (ko) 2017-08-10 2018-08-09 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
CN201810908505.6A CN109382707B (zh) 2017-08-10 2018-08-10 基板背面研磨构件的修整装置和修整方法
US17/347,824 US20210308828A1 (en) 2017-08-10 2021-06-15 Dressing apparatus and dressing method for substrate rear surface polishing member

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017155721 2017-08-10
JP2017155721 2017-08-10

Publications (3)

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JP2019034400A JP2019034400A (ja) 2019-03-07
JP2019034400A5 JP2019034400A5 (enExample) 2021-08-12
JP7169769B2 true JP7169769B2 (ja) 2022-11-11

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JP (1) JP7169769B2 (enExample)
TW (1) TWI785087B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7534142B2 (ja) * 2020-07-16 2024-08-14 株式会社岡本工作機械製作所 ドレッシング装置及び研磨装置
TWI755069B (zh) * 2020-09-21 2022-02-11 合晶科技股份有限公司 修整拋光墊的方法
JP7726611B2 (ja) * 2021-03-04 2025-08-20 東京エレクトロン株式会社 基板処理装置、研磨パッド検査装置、及び研磨パッド検査方法
JP2023111564A (ja) * 2022-01-31 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN117984230A (zh) * 2022-11-07 2024-05-07 杭州众硅电子科技有限公司 抛光垫再利用加工装置
CN117300904B (zh) * 2023-11-28 2024-01-23 苏州博宏源机械制造有限公司 一种抛光垫修整装置
CN119217173B (zh) * 2024-10-28 2025-10-10 燕山大学 一种在线磨辊砂轮修复设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071717A (ja) 2002-08-02 2004-03-04 Kobe Steel Ltd 高圧処理装置
JP2006319249A (ja) 2005-05-16 2006-11-24 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの製造方法により製造された半導体デバイス
JP2009302503A (ja) 2008-06-10 2009-12-24 Semes Co Ltd 枚葉式基板処理装置及び方法
JP2016215342A (ja) 2015-05-22 2016-12-22 信越半導体株式会社 ウェーハの回収方法及び両面研磨装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07285072A (ja) * 1994-04-19 1995-10-31 Daido Steel Co Ltd 研削砥石用ドレッシングツール
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
JP2001038603A (ja) * 1999-08-04 2001-02-13 Speedfam Co Ltd ドレッサ，ドレッサ付き研磨装置及びドレッシング方法
JP4756583B2 (ja) * 2005-08-30 2011-08-24 株式会社東京精密 研磨パッド、パッドドレッシング評価方法、及び研磨装置
JP4658182B2 (ja) * 2007-11-28 2011-03-23 株式会社荏原製作所 研磨パッドのプロファイル測定方法
JP5399672B2 (ja) * 2008-09-22 2014-01-29 株式会社ディスコ 研磨装置
CN103419133A (zh) * 2012-05-23 2013-12-04 扬州市邮谊工具制造有限公司 滚刀加工砂轮修正装置
JP6166974B2 (ja) * 2013-07-22 2017-07-19 株式会社ディスコ 研削装置
US9375825B2 (en) * 2014-04-30 2016-06-28 Applied Materials, Inc. Polishing pad conditioning system including suction
CN204604102U (zh) * 2015-03-28 2015-09-02 鞍钢股份有限公司 一种砂轮片修复工具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071717A (ja) 2002-08-02 2004-03-04 Kobe Steel Ltd 高圧処理装置
JP2006319249A (ja) 2005-05-16 2006-11-24 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの製造方法により製造された半導体デバイス
JP2009302503A (ja) 2008-06-10 2009-12-24 Semes Co Ltd 枚葉式基板処理装置及び方法
JP2016215342A (ja) 2015-05-22 2016-12-22 信越半導体株式会社 ウェーハの回収方法及び両面研磨装置

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JP2019034400A (ja) 2019-03-07
TWI785087B (zh) 2022-12-01
TW201919816A (zh) 2019-06-01

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