JP7164970B2 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
JP7164970B2
JP7164970B2 JP2018091232A JP2018091232A JP7164970B2 JP 7164970 B2 JP7164970 B2 JP 7164970B2 JP 2018091232 A JP2018091232 A JP 2018091232A JP 2018091232 A JP2018091232 A JP 2018091232A JP 7164970 B2 JP7164970 B2 JP 7164970B2
Authority
JP
Japan
Prior art keywords
workpiece
ultraviolet
processing
light source
ultraviolet light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018091232A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019197818A (ja
Inventor
英明 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018091232A priority Critical patent/JP7164970B2/ja
Priority to CN201910361599.4A priority patent/CN110473803B/zh
Priority to TW108115704A priority patent/TWI789518B/zh
Publication of JP2019197818A publication Critical patent/JP2019197818A/ja
Application granted granted Critical
Publication of JP7164970B2 publication Critical patent/JP7164970B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2018091232A 2018-05-10 2018-05-10 加工装置 Active JP7164970B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018091232A JP7164970B2 (ja) 2018-05-10 2018-05-10 加工装置
CN201910361599.4A CN110473803B (zh) 2018-05-10 2019-04-30 加工装置
TW108115704A TWI789518B (zh) 2018-05-10 2019-05-07 加工裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018091232A JP7164970B2 (ja) 2018-05-10 2018-05-10 加工装置

Publications (2)

Publication Number Publication Date
JP2019197818A JP2019197818A (ja) 2019-11-14
JP7164970B2 true JP7164970B2 (ja) 2022-11-02

Family

ID=68507445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018091232A Active JP7164970B2 (ja) 2018-05-10 2018-05-10 加工装置

Country Status (3)

Country Link
JP (1) JP7164970B2 (zh)
CN (1) CN110473803B (zh)
TW (1) TWI789518B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7393926B2 (ja) * 2019-11-27 2023-12-07 株式会社ディスコ 加工装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051229A (ja) 2003-07-15 2005-02-24 Tokyo Seimitsu Co Ltd 光量算出装置および光量算出方法
JP2006289192A (ja) 2005-04-06 2006-10-26 Omron Corp 紫外線照射装置
JP2010219358A (ja) 2009-03-18 2010-09-30 Disco Abrasive Syst Ltd 紫外線照射装置
JP2014008475A (ja) 2012-06-29 2014-01-20 Disco Abrasive Syst Ltd 紫外線照射装置および紫外線照射装置を備えた加工装置
JP2014022574A (ja) 2012-07-18 2014-02-03 Disco Abrasive Syst Ltd 紫外線照射手段を備えた加工装置
JP2015131372A (ja) 2014-01-14 2015-07-23 株式会社ディスコ 切削装置
JP2016200425A (ja) 2015-04-07 2016-12-01 コニカミノルタ株式会社 紫外線照度測定装置および紫外線照射装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196555A (ja) * 1992-12-24 1994-07-15 Nitto Denko Corp 紫外線照射装置
JP6230354B2 (ja) * 2013-09-26 2017-11-15 株式会社ディスコ デバイスウェーハの加工方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051229A (ja) 2003-07-15 2005-02-24 Tokyo Seimitsu Co Ltd 光量算出装置および光量算出方法
JP2006289192A (ja) 2005-04-06 2006-10-26 Omron Corp 紫外線照射装置
JP2010219358A (ja) 2009-03-18 2010-09-30 Disco Abrasive Syst Ltd 紫外線照射装置
JP2014008475A (ja) 2012-06-29 2014-01-20 Disco Abrasive Syst Ltd 紫外線照射装置および紫外線照射装置を備えた加工装置
JP2014022574A (ja) 2012-07-18 2014-02-03 Disco Abrasive Syst Ltd 紫外線照射手段を備えた加工装置
JP2015131372A (ja) 2014-01-14 2015-07-23 株式会社ディスコ 切削装置
JP2016200425A (ja) 2015-04-07 2016-12-01 コニカミノルタ株式会社 紫外線照度測定装置および紫外線照射装置

Also Published As

Publication number Publication date
CN110473803B (zh) 2024-03-12
TW201948003A (zh) 2019-12-16
CN110473803A (zh) 2019-11-19
JP2019197818A (ja) 2019-11-14
TWI789518B (zh) 2023-01-11

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