JP7138406B2 - 接着剤組成物、接着シート、及び封止体 - Google Patents

接着剤組成物、接着シート、及び封止体 Download PDF

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Publication number
JP7138406B2
JP7138406B2 JP2019521261A JP2019521261A JP7138406B2 JP 7138406 B2 JP7138406 B2 JP 7138406B2 JP 2019521261 A JP2019521261 A JP 2019521261A JP 2019521261 A JP2019521261 A JP 2019521261A JP 7138406 B2 JP7138406 B2 JP 7138406B2
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JP
Japan
Prior art keywords
component
adhesive
adhesive composition
adhesive sheet
parts
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JP2019521261A
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English (en)
Japanese (ja)
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JPWO2018221572A1 (ja
Inventor
健太 西嶋
樹 長谷川
幹広 樫尾
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Lintec Corp
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Lintec Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Electroluminescent Light Sources (AREA)
JP2019521261A 2017-05-31 2018-05-30 接着剤組成物、接着シート、及び封止体 Active JP7138406B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017107483 2017-05-31
JP2017107483 2017-05-31
JP2017131841 2017-07-05
JP2017131841 2017-07-05
PCT/JP2018/020732 WO2018221572A1 (ja) 2017-05-31 2018-05-30 接着剤組成物、接着シート、及び封止体

Publications (2)

Publication Number Publication Date
JPWO2018221572A1 JPWO2018221572A1 (ja) 2020-04-02
JP7138406B2 true JP7138406B2 (ja) 2022-09-16

Family

ID=64456075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019521261A Active JP7138406B2 (ja) 2017-05-31 2018-05-30 接着剤組成物、接着シート、及び封止体

Country Status (4)

Country Link
JP (1) JP7138406B2 (ko)
KR (1) KR102483012B1 (ko)
TW (1) TWI794234B (ko)
WO (1) WO2018221572A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6880134B2 (ja) * 2019-09-20 2021-06-02 リンテック株式会社 表示体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008163344A (ja) 2008-01-22 2008-07-17 Nitto Denko Corp 電子部品固定用反応性接着剤組成物及びその接着シート
WO2011062167A1 (ja) 2009-11-18 2011-05-26 味の素株式会社 樹脂組成物
JP2016040369A (ja) 2014-08-12 2016-03-24 ユニチカ株式会社 ポリオレフィン樹脂水性分散体、およびそれを用いた接着剤、太陽電池バックシート、太陽電池モジュール
WO2016158770A1 (ja) 2015-03-27 2016-10-06 味の素株式会社 封止用樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100927A (ja) * 2009-11-09 2011-05-19 Sony Chemical & Information Device Corp 接着剤組成物
JPWO2015068805A1 (ja) * 2013-11-08 2017-03-09 日本化薬株式会社 封止用樹脂組成物
JP6683194B2 (ja) * 2015-03-27 2020-04-15 日本ゼオン株式会社 非水系二次電池機能層用組成物およびその製造方法、非水系二次電池用機能層、並びに、非水系二次電池
CN105255428A (zh) * 2015-10-09 2016-01-20 烟台德邦先进硅材料有限公司 一种封装用环氧树脂混合物及其制备方法
TWI729034B (zh) * 2015-12-01 2021-06-01 日商琳得科股份有限公司 接著劑組成物、封密用板片以及封密體
TWI751989B (zh) * 2015-12-01 2022-01-11 日商琳得科股份有限公司 接著劑組成物、封密板片及封密體
WO2018047920A1 (ja) * 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体
WO2018047868A1 (ja) * 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体
JP7071279B2 (ja) * 2016-11-18 2022-05-18 リンテック株式会社 接着剤組成物、封止シート、及び封止体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008163344A (ja) 2008-01-22 2008-07-17 Nitto Denko Corp 電子部品固定用反応性接着剤組成物及びその接着シート
WO2011062167A1 (ja) 2009-11-18 2011-05-26 味の素株式会社 樹脂組成物
JP2016040369A (ja) 2014-08-12 2016-03-24 ユニチカ株式会社 ポリオレフィン樹脂水性分散体、およびそれを用いた接着剤、太陽電池バックシート、太陽電池モジュール
WO2016158770A1 (ja) 2015-03-27 2016-10-06 味の素株式会社 封止用樹脂組成物

Also Published As

Publication number Publication date
TWI794234B (zh) 2023-03-01
JPWO2018221572A1 (ja) 2020-04-02
KR102483012B1 (ko) 2022-12-29
KR20200015451A (ko) 2020-02-12
TW201903100A (zh) 2019-01-16
WO2018221572A1 (ja) 2018-12-06

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