JP7132207B2 - トレンチ下部にオフセットを有するSiC半導体デバイス - Google Patents
トレンチ下部にオフセットを有するSiC半導体デバイス Download PDFInfo
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- JP7132207B2 JP7132207B2 JP2019237054A JP2019237054A JP7132207B2 JP 7132207 B2 JP7132207 B2 JP 7132207B2 JP 2019237054 A JP2019237054 A JP 2019237054A JP 2019237054 A JP2019237054 A JP 2019237054A JP 7132207 B2 JP7132207 B2 JP 7132207B2
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- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
Description
102 トレンチ
104 第1の面
106 第1の側壁
108 第2の側壁
110 トレンチ下部
112 電極
114 トレンチ誘電体
118 本体領域
120 シールド構造
121 ソース領域
122 第2の面
124 領域
126 電流拡散ゾーン
128 ドリフトゾーン
130 接触構造
132 第2の負荷電極
134 トレンチ構造
136 メサ部分
138 第1の負荷電極
140 ハードマスク層
142 レジストマスク
144 ハードマスク
146 第1のトレンチ
148 マスク
150 第2のトレンチ
152 角部
1000 半導体デバイス
1101 トレンチ下部の第1のセクション
1102 トレンチ下部の第2のセクション
1121 電極の下部の第1のセクション
1122 電極の下部の第2のセクション
1201 シールド領域
1202 接続領域
1211 ソース領域の第1の部分
1212 ソース領域の第2の部分
2000 半導体デバイスを製造する方法
d1 第1のトレンチの深さ
dv1 トレンチ下部の第1のセクションとシールド領域のピークとの間の垂直距離
dv2 ソース領域の第1の部分の下部とソース領域の第2の部分の下部との間の垂直距離
h 垂直オフセット
P ピーク
t1 第1の厚さ
t2 第2の厚さ
TC トランジスタセル
y 垂直方向
Claims (15)
- 半導体デバイスであって、
第1の面からSiC半導体本体内に延在するトレンチであって、第1の側壁と、前記第1の側壁に対向する第2の側壁と、トレンチ下部とを有するトレンチと、
前記トレンチ内に配置され、且つゲート誘電体によって前記SiC半導体本体から電気的に絶縁されるゲート電極と、
前記第1の側壁に隣接する第1の導電型の本体領域と、
前記第2の側壁及び前記トレンチ下部の少なくとも一部に隣接する前記第1の導電型のシールド構造と
を含み、
前記第1の面から、前記第1の面に対向する前記SiC半導体本体の第2の面へと延在する垂直方向に沿って、前記トレンチ下部の第1のセクション及び前記トレンチ下部の第2のセクションは、垂直オフセットだけ互いにずれており、
前記ゲート電極の下部の第2のセクションは、前記SiC半導体本体において、前記垂直方向に沿って前記ゲート電極の前記下部の第1のセクションよりも深くに配置され、
前記トレンチ下部の前記第2のセクションは、前記SiC半導体本体において前記トレンチ下部の前記第1のセクションよりも深くに配置され、
前記トレンチ下部の前記第2のセクションは、前記トレンチ下部と前記第2の側壁との遷移部分に位置するトレンチ角部に直接隣接し、
前記シールド構造は、前記トレンチ下部の前記第2のセクションおよび前記トレンチ下部と前記第2の側壁との前記遷移部分に位置する前記トレンチ角部に直接隣接する、半導体デバイス。 - 前記トレンチ下部の前記第1のセクションは、前記トレンチ下部と前記第1の側壁との遷移部分に位置するトレンチ角部に直接隣接する、請求項1に記載の半導体デバイス。
- 前記トレンチ下部の前記第1のセクションは、前記トレンチ下部の前記第2のセクションに直接隣接する、請求項1または2に記載の半導体デバイス。
- 前記トレンチは、ストライプ状であり、かつ、セル領域の一方の側から反対側へと延在する、請求項1から3の何れか一項に記載の半導体デバイス。
- 前記シールド構造は、前記第1の導電型のシールド領域と、前記第1の導電型の接続領域とを含み、前記接続領域は、前記シールド領域と前記第1の面との間に配置され、前記シールド領域のドーピング濃度プロファイルは、前記SiC半導体本体において前記トレンチ下部よりも深くに位置する前記垂直方向に沿ったピークを有する、請求項1から4の何れか一項に記載の半導体デバイス。
- 前記トレンチ下部の前記第1のセクションと、前記シールド領域の前記ピークとの間の垂直距離は、200nm~800nmの範囲である、請求項5に記載の半導体デバイス。
- 前記垂直オフセットは、10nm~100nmの範囲である、請求項1から6の何れか一項に記載の半導体デバイス。
- 前記本体領域と前記第1の面との間に第2の導電型のソース領域をさらに含み、前記ソース領域の第1の部分は、前記トレンチの前記第1の側壁と、前記ソース領域の第2の部分との間に配置され、及び前記第2の部分の下部は、前記SiC半導体本体において、前記垂直方向に沿って前記第1の部分の下部よりも深くに配置される、請求項1から7の何れか一項に記載の半導体デバイス。
- 前記ソース領域の前記第1の部分の前記下部と、前記ソース領域の前記第2の部分の前記下部との間の垂直距離は、前記トレンチ下部の前記第1のセクションと、前記トレンチ下部の前記第2のセクションとの間の垂直距離に対応する、請求項8に記載の半導体デバイス。
- 前記シールド構造は、前記第1の面において前記第2の側壁に隣接する、請求項1から9の何れか一項に記載の半導体デバイス。
- 前記第2の側壁及び前記第1の面に隣接する前記第2の導電型の領域をさらに含む、請求項8または9に記載の半導体デバイス。
- 前記トレンチ下部に隣接する前記ゲート誘電体の第1のパートの厚さは、前記第1及び第2の側壁に隣接する前記ゲート誘電体の第2のパートの厚さよりも大きい、請求項1から11の何れか一項に記載の半導体デバイス。
- 前記第2の導電型の電流拡散ゾーンと、前記第2の導電型のドリフトゾーンとをさらに含み、前記電流拡散ゾーンは、前記本体領域と前記ドリフトゾーンとの間に配置され、且つ前記電流拡散ゾーンは、前記本体領域及び前記シールド構造に隣接し、及び前記電流拡散ゾーンの平均正味ドーピング濃度は、前記ドリフトゾーンの平均正味ドーピング濃度よりも大きい、請求項8、9または11の何れか一項に記載の半導体デバイス。
- 前記SiC半導体本体は、4H-SiC半導体本体であり、及び前記第1の側壁の側壁面は、(11-20)である、請求項1から13の何れか一項に記載の半導体デバイス。
- 電気的に並列に接続された複数のトランジスタセルをさらに含み、前記複数のトランジスタセルのそれぞれの1つは、前記トレンチ、前記ゲート誘電体、前記ゲート電極、及び前記シールド構造を含む、請求項1から14の何れか一項に記載の半導体デバイス。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014117780B4 (de) | 2014-12-03 | 2018-06-21 | Infineon Technologies Ag | Halbleiterbauelement mit einer Grabenelektrode und Verfahren zur Herstellung |
DE102014119465B3 (de) | 2014-12-22 | 2016-05-25 | Infineon Technologies Ag | Halbleitervorrichtung mit streifenförmigen trenchgatestrukturen, transistormesas und diodenmesas |
DE102018103973B4 (de) | 2018-02-22 | 2020-12-03 | Infineon Technologies Ag | Siliziumcarbid-halbleiterbauelement |
DE102019111308A1 (de) | 2018-05-07 | 2019-11-07 | Infineon Technologies Ag | Siliziumcarbid halbleiterbauelement |
IT201800007780A1 (it) * | 2018-08-02 | 2020-02-02 | St Microelectronics Srl | Dispositivo mosfet in carburo di silicio e relativo metodo di fabbricazione |
DE102018123164B3 (de) * | 2018-09-20 | 2020-01-23 | Infineon Technologies Ag | Halbleitervorrichtung, die eine graben-gatestruktur enthält, und herstellungsverfahren |
DE102018124740A1 (de) | 2018-10-08 | 2020-04-09 | Infineon Technologies Ag | Halbleiterbauelement mit einem sic halbleiterkörper und verfahren zur herstellung eines halbleiterbauelements |
US10903322B2 (en) | 2018-11-16 | 2021-01-26 | Infineon Technologies Ag | SiC power semiconductor device with integrated body diode |
US10985248B2 (en) | 2018-11-16 | 2021-04-20 | Infineon Technologies Ag | SiC power semiconductor device with integrated Schottky junction |
US10586845B1 (en) | 2018-11-16 | 2020-03-10 | Infineon Technologies Ag | SiC trench transistor device and methods of manufacturing thereof |
DE102019105812B4 (de) * | 2019-03-07 | 2022-08-25 | Infineon Technologies Ag | Grabenstruktur enthaltende halbleitervorrichtung und herstellungsverfahren |
DE102019121859B3 (de) * | 2019-08-14 | 2020-11-26 | Infineon Technologies Ag | Siliziumcarbid-vorrichtung mit graben-gate |
EP3930006A1 (en) * | 2020-06-24 | 2021-12-29 | Infineon Technologies AG | Semiconductor device including trench gate structure and buried shielding region and method of manufacturing |
US11664434B2 (en) | 2020-11-13 | 2023-05-30 | Wolfspeed, Inc. | Semiconductor power devices having multiple gate trenches and methods of forming such devices |
EP4009379A1 (en) * | 2020-12-03 | 2022-06-08 | Hitachi Energy Switzerland AG | Power semiconductor device with an insulated trench gate electrode |
EP4009375B1 (en) * | 2020-12-03 | 2024-03-06 | Hitachi Energy Ltd | Power semiconductor device and a method for producing a power semiconductor device |
WO2023166657A1 (ja) * | 2022-03-03 | 2023-09-07 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
DE102022209808A1 (de) | 2022-09-19 | 2024-03-21 | Robert Bosch Gesellschaft mit beschränkter Haftung | Vertikale Feldeffekttransistorstruktur und Verfahren zum Herstellen einer vertikalen Feldeffekttransistorstruktur |
CN115513299A (zh) * | 2022-11-11 | 2022-12-23 | 广东芯粤能半导体有限公司 | 沟槽型晶体管及其形成方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014122919A1 (ja) | 2013-02-05 | 2014-08-14 | 三菱電機株式会社 | 絶縁ゲート型炭化珪素半導体装置及びその製造方法 |
JP2014207326A (ja) | 2013-04-12 | 2014-10-30 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2015226060A (ja) | 2014-05-23 | 2015-12-14 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体装置 |
JP2016136618A (ja) | 2014-12-22 | 2016-07-28 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | ストライプ状トレンチゲート構造、トランジスタメサおよびダイオードメサを有する半導体素子 |
JP2017063182A (ja) | 2015-08-06 | 2017-03-30 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 広禁止帯幅半導体装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4192281B2 (ja) * | 1997-11-28 | 2008-12-10 | 株式会社デンソー | 炭化珪素半導体装置 |
US6291298B1 (en) * | 1999-05-25 | 2001-09-18 | Advanced Analogic Technologies, Inc. | Process of manufacturing Trench gate semiconductor device having gate oxide layer with multiple thicknesses |
US6348712B1 (en) * | 1999-10-27 | 2002-02-19 | Siliconix Incorporated | High density trench-gated power MOSFET |
US6800899B2 (en) * | 2001-08-30 | 2004-10-05 | Micron Technology, Inc. | Vertical transistors, electrical devices containing a vertical transistor, and computer systems containing a vertical transistor |
KR100564434B1 (ko) * | 2004-12-03 | 2006-03-28 | 주식회사 하이닉스반도체 | 리세스 게이트 및 그 제조 방법 |
KR101296922B1 (ko) * | 2005-06-10 | 2013-08-14 | 페어차일드 세미컨덕터 코포레이션 | 전하 균형 전계 효과 트랜지스터 |
KR100826650B1 (ko) * | 2006-12-28 | 2008-05-06 | 주식회사 하이닉스반도체 | 변형된 리세스채널 게이트를 갖는 반도체소자 및 그제조방법 |
JP4798119B2 (ja) * | 2007-11-06 | 2011-10-19 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
US8264033B2 (en) * | 2009-07-21 | 2012-09-11 | Infineon Technologies Austria Ag | Semiconductor device having a floating semiconductor zone |
US8637922B1 (en) * | 2012-07-19 | 2014-01-28 | Infineon Technologies Ag | Semiconductor device |
US9293558B2 (en) * | 2012-11-26 | 2016-03-22 | Infineon Technologies Austria Ag | Semiconductor device |
US9577073B2 (en) * | 2014-12-11 | 2017-02-21 | Infineon Technologies Ag | Method of forming a silicon-carbide device with a shielded gate |
-
2017
- 2017-04-24 DE DE102017108738.9A patent/DE102017108738B4/de active Active
-
2018
- 2018-04-23 US US15/959,661 patent/US10553685B2/en active Active
- 2018-04-23 JP JP2018081936A patent/JP6640904B2/ja active Active
- 2018-04-24 CN CN201810371838.XA patent/CN108735817B/zh active Active
-
2019
- 2019-12-26 JP JP2019237054A patent/JP7132207B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014122919A1 (ja) | 2013-02-05 | 2014-08-14 | 三菱電機株式会社 | 絶縁ゲート型炭化珪素半導体装置及びその製造方法 |
JP2014207326A (ja) | 2013-04-12 | 2014-10-30 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2015226060A (ja) | 2014-05-23 | 2015-12-14 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体装置 |
JP2016136618A (ja) | 2014-12-22 | 2016-07-28 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | ストライプ状トレンチゲート構造、トランジスタメサおよびダイオードメサを有する半導体素子 |
JP2017063182A (ja) | 2015-08-06 | 2017-03-30 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 広禁止帯幅半導体装置 |
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