JP7128994B2 - 電子部材の取外し方法及びその装置 - Google Patents

電子部材の取外し方法及びその装置 Download PDF

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Publication number
JP7128994B2
JP7128994B2 JP2021562245A JP2021562245A JP7128994B2 JP 7128994 B2 JP7128994 B2 JP 7128994B2 JP 2021562245 A JP2021562245 A JP 2021562245A JP 2021562245 A JP2021562245 A JP 2021562245A JP 7128994 B2 JP7128994 B2 JP 7128994B2
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Japan
Prior art keywords
circuit board
heating
suction nozzle
electronic
heating element
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JP2021562245A
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Japanese (ja)
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JPWO2021111538A1 (https=
JPWO2021111538A5 (https=
Inventor
和弘 杉山
彰 佐藤
光樹 福田
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WONDER FUTURE CORPORATION
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WONDER FUTURE CORPORATION
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Publication of JPWO2021111538A1 publication Critical patent/JPWO2021111538A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2021562245A 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置 Active JP7128994B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/047349 WO2021111538A1 (ja) 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置

Publications (3)

Publication Number Publication Date
JPWO2021111538A1 JPWO2021111538A1 (https=) 2021-06-10
JPWO2021111538A5 JPWO2021111538A5 (https=) 2022-07-01
JP7128994B2 true JP7128994B2 (ja) 2022-09-01

Family

ID=76222601

Family Applications (1)

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JP2021562245A Active JP7128994B2 (ja) 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置

Country Status (5)

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JP (1) JP7128994B2 (https=)
KR (1) KR102498034B1 (https=)
CN (1) CN114762466A (https=)
TW (1) TWI808356B (https=)
WO (1) WO2021111538A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024195162A1 (ja) 2023-03-17 2024-09-26 株式会社弘輝テック 噴流はんだ装置の予熱機構及び噴流はんだ装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115706040A (zh) * 2021-08-10 2023-02-17 重庆康佳光电技术研究院有限公司 芯片移除头、芯片移除系统及移除芯片的方法
CN114641147B (zh) * 2022-02-25 2025-02-18 广东粤灿半导体设备有限公司 一种定点感应加热的电路板返修方法
CN115116902B (zh) * 2022-07-05 2025-07-22 深圳市锐博自动化设备有限公司 一种适用芯片独立共晶的吸嘴加热精准固晶头
KR102842306B1 (ko) 2023-11-03 2025-08-05 주식회사 비에스테크닉스 유도가열을 이용한 전자기기의 디스플레이 리워크 장비

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298268A (ja) 2000-04-14 2001-10-26 Miyaden Co Ltd 高周波加熱式半田鏝
JP2007510548A (ja) 2003-11-07 2007-04-26 デラウェア キャピタル フォーメーション インコーポレイテッド 脱着可能なチップ付き温度自己制御式はんだごて
JP2009164310A (ja) 2007-12-28 2009-07-23 Sharp Corp 電子部品リペア装置および電子部品リペア方法
JP2009200170A (ja) 2008-02-20 2009-09-03 Fanuc Ltd 端子用加熱装置
WO2019108006A1 (en) 2017-11-30 2019-06-06 Saint-Gobain Glass France An apparatus for soldering a terminal on window glass for a vehicle and a method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765771U (https=) * 1980-09-30 1982-04-20
JPS6120790Y2 (https=) * 1980-11-28 1986-06-21
US4877944A (en) * 1987-06-08 1989-10-31 Metcal, Inc. Self regulating heater
JP2809207B2 (ja) * 1996-06-13 1998-10-08 日本電気株式会社 半導体装置のリペア方法とリペア装置
JP3470953B2 (ja) 1999-08-02 2003-11-25 アオイ電子株式会社 プリント配線板に電子部品を着脱する方法
JP2004186491A (ja) 2002-12-04 2004-07-02 Murata Mfg Co Ltd 電子部品のリペア用吸着ノズルおよびリペア方法
TW200850092A (en) * 2004-11-29 2008-12-16 Heetronix Platen for use with a thermal attach and detach system which holds components by vacuum suction
KR101751335B1 (ko) * 2015-04-30 2017-06-28 주식회사 다원시스 유도가열 디솔더링 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298268A (ja) 2000-04-14 2001-10-26 Miyaden Co Ltd 高周波加熱式半田鏝
JP2007510548A (ja) 2003-11-07 2007-04-26 デラウェア キャピタル フォーメーション インコーポレイテッド 脱着可能なチップ付き温度自己制御式はんだごて
JP2009164310A (ja) 2007-12-28 2009-07-23 Sharp Corp 電子部品リペア装置および電子部品リペア方法
JP2009200170A (ja) 2008-02-20 2009-09-03 Fanuc Ltd 端子用加熱装置
WO2019108006A1 (en) 2017-11-30 2019-06-06 Saint-Gobain Glass France An apparatus for soldering a terminal on window glass for a vehicle and a method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024195162A1 (ja) 2023-03-17 2024-09-26 株式会社弘輝テック 噴流はんだ装置の予熱機構及び噴流はんだ装置

Also Published As

Publication number Publication date
KR102498034B1 (ko) 2023-02-10
KR20220112748A (ko) 2022-08-11
CN114762466A (zh) 2022-07-15
JPWO2021111538A1 (https=) 2021-06-10
TWI808356B (zh) 2023-07-11
WO2021111538A1 (ja) 2021-06-10
TW202139806A (zh) 2021-10-16

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