CN114762466A - 电子部件的移除方法及其装置 - Google Patents

电子部件的移除方法及其装置 Download PDF

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Publication number
CN114762466A
CN114762466A CN201980102763.8A CN201980102763A CN114762466A CN 114762466 A CN114762466 A CN 114762466A CN 201980102763 A CN201980102763 A CN 201980102763A CN 114762466 A CN114762466 A CN 114762466A
Authority
CN
China
Prior art keywords
heating
electronic component
nozzle
circuit substrate
head end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980102763.8A
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English (en)
Chinese (zh)
Inventor
杉山和弘
佐藤彰
福田光树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wonder Future Corp
Original Assignee
Wonder Future Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wonder Future Corp filed Critical Wonder Future Corp
Publication of CN114762466A publication Critical patent/CN114762466A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201980102763.8A 2019-12-04 2019-12-04 电子部件的移除方法及其装置 Pending CN114762466A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/047349 WO2021111538A1 (ja) 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置

Publications (1)

Publication Number Publication Date
CN114762466A true CN114762466A (zh) 2022-07-15

Family

ID=76222601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980102763.8A Pending CN114762466A (zh) 2019-12-04 2019-12-04 电子部件的移除方法及其装置

Country Status (5)

Country Link
JP (1) JP7128994B2 (https=)
KR (1) KR102498034B1 (https=)
CN (1) CN114762466A (https=)
TW (1) TWI808356B (https=)
WO (1) WO2021111538A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115706040A (zh) * 2021-08-10 2023-02-17 重庆康佳光电技术研究院有限公司 芯片移除头、芯片移除系统及移除芯片的方法
CN114641147B (zh) * 2022-02-25 2025-02-18 广东粤灿半导体设备有限公司 一种定点感应加热的电路板返修方法
CN115116902B (zh) * 2022-07-05 2025-07-22 深圳市锐博自动化设备有限公司 一种适用芯片独立共晶的吸嘴加热精准固晶头
JP2024132729A (ja) 2023-03-17 2024-10-01 株式会社弘輝テック 噴流はんだ装置の予熱機構及び噴流はんだ装置
KR102842306B1 (ko) 2023-11-03 2025-08-05 주식회사 비에스테크닉스 유도가열을 이용한 전자기기의 디스플레이 리워크 장비

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164310A (ja) * 2007-12-28 2009-07-23 Sharp Corp 電子部品リペア装置および電子部品リペア方法
KR20160129570A (ko) * 2015-04-30 2016-11-09 주식회사 다원시스 유도가열 디솔더링 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765771U (https=) * 1980-09-30 1982-04-20
JPS6120790Y2 (https=) * 1980-11-28 1986-06-21
US4877944A (en) * 1987-06-08 1989-10-31 Metcal, Inc. Self regulating heater
JP2809207B2 (ja) * 1996-06-13 1998-10-08 日本電気株式会社 半導体装置のリペア方法とリペア装置
JP3470953B2 (ja) 1999-08-02 2003-11-25 アオイ電子株式会社 プリント配線板に電子部品を着脱する方法
JP2001298268A (ja) * 2000-04-14 2001-10-26 Miyaden Co Ltd 高周波加熱式半田鏝
JP2004186491A (ja) 2002-12-04 2004-07-02 Murata Mfg Co Ltd 電子部品のリペア用吸着ノズルおよびリペア方法
US7259356B2 (en) * 2003-11-07 2007-08-21 Delaware Capital Formation, Inc. Temperature self-regulating soldering iron with removable tip
TW200850092A (en) * 2004-11-29 2008-12-16 Heetronix Platen for use with a thermal attach and detach system which holds components by vacuum suction
JP2009200170A (ja) * 2008-02-20 2009-09-03 Fanuc Ltd 端子用加熱装置
KR102480461B1 (ko) * 2017-11-30 2022-12-21 쌩-고벵 글래스 프랑스 차량용 창유리의 터미널 솔더링 장치 및 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164310A (ja) * 2007-12-28 2009-07-23 Sharp Corp 電子部品リペア装置および電子部品リペア方法
KR20160129570A (ko) * 2015-04-30 2016-11-09 주식회사 다원시스 유도가열 디솔더링 장치

Also Published As

Publication number Publication date
KR102498034B1 (ko) 2023-02-10
KR20220112748A (ko) 2022-08-11
JP7128994B2 (ja) 2022-09-01
JPWO2021111538A1 (https=) 2021-06-10
TWI808356B (zh) 2023-07-11
WO2021111538A1 (ja) 2021-06-10
TW202139806A (zh) 2021-10-16

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