JP7093693B2 - 熱処理装置及び基板滑り検出方法 - Google Patents
熱処理装置及び基板滑り検出方法 Download PDFInfo
- Publication number
- JP7093693B2 JP7093693B2 JP2018132992A JP2018132992A JP7093693B2 JP 7093693 B2 JP7093693 B2 JP 7093693B2 JP 2018132992 A JP2018132992 A JP 2018132992A JP 2018132992 A JP2018132992 A JP 2018132992A JP 7093693 B2 JP7093693 B2 JP 7093693B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hot plate
- wafer
- slip
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018132992A JP7093693B2 (ja) | 2018-07-13 | 2018-07-13 | 熱処理装置及び基板滑り検出方法 |
KR1020190078581A KR20200007657A (ko) | 2018-07-13 | 2019-07-01 | 열처리 장치 및 기판 미끄럼 검출 방법 |
CN201910618989.5A CN110718482B (zh) | 2018-07-13 | 2019-07-10 | 热处理装置和基片滑动检测方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018132992A JP7093693B2 (ja) | 2018-07-13 | 2018-07-13 | 熱処理装置及び基板滑り検出方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020013808A JP2020013808A (ja) | 2020-01-23 |
JP7093693B2 true JP7093693B2 (ja) | 2022-06-30 |
Family
ID=69170031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018132992A Active JP7093693B2 (ja) | 2018-07-13 | 2018-07-13 | 熱処理装置及び基板滑り検出方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7093693B2 (zh) |
KR (1) | KR20200007657A (zh) |
CN (1) | CN110718482B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000306825A (ja) | 1999-02-16 | 2000-11-02 | Tokyo Electron Ltd | 処理装置、処理システム、判別方法及び検出方法 |
JP2012151247A (ja) | 2011-01-18 | 2012-08-09 | Tokyo Electron Ltd | 基板加熱装置、基板加熱方法及び記憶媒体 |
JP2018107175A (ja) | 2016-12-22 | 2018-07-05 | 東京エレクトロン株式会社 | 熱処理装置、熱処理方法及びコンピュータ記憶媒体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197324A (ja) * | 1997-09-18 | 1999-04-09 | Dainippon Screen Mfg Co Ltd | 基板熱処理装置 |
KR100593627B1 (ko) * | 1999-02-16 | 2006-06-28 | 동경 엘렉트론 주식회사 | 처리장치, 처리시스템, 판별방법 및 검출방법 |
US7416632B2 (en) * | 2001-09-03 | 2008-08-26 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
JP2005174986A (ja) * | 2003-12-08 | 2005-06-30 | Matsushita Electric Ind Co Ltd | 急速熱処理装置、その製造方法及び温度調整方法 |
JP5542743B2 (ja) * | 2010-10-07 | 2014-07-09 | 東京エレクトロン株式会社 | 熱処理装置および熱処理方法 |
JP5490741B2 (ja) * | 2011-03-02 | 2014-05-14 | 東京エレクトロン株式会社 | 基板搬送装置の位置調整方法、及び基板処理装置 |
CN104538331B (zh) * | 2014-12-12 | 2018-06-05 | 通富微电子股份有限公司 | 一种晶圆翘曲处理的装置及方法 |
-
2018
- 2018-07-13 JP JP2018132992A patent/JP7093693B2/ja active Active
-
2019
- 2019-07-01 KR KR1020190078581A patent/KR20200007657A/ko not_active Application Discontinuation
- 2019-07-10 CN CN201910618989.5A patent/CN110718482B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000306825A (ja) | 1999-02-16 | 2000-11-02 | Tokyo Electron Ltd | 処理装置、処理システム、判別方法及び検出方法 |
JP2012151247A (ja) | 2011-01-18 | 2012-08-09 | Tokyo Electron Ltd | 基板加熱装置、基板加熱方法及び記憶媒体 |
JP2018107175A (ja) | 2016-12-22 | 2018-07-05 | 東京エレクトロン株式会社 | 熱処理装置、熱処理方法及びコンピュータ記憶媒体 |
Also Published As
Publication number | Publication date |
---|---|
CN110718482B (zh) | 2024-03-22 |
CN110718482A (zh) | 2020-01-21 |
KR20200007657A (ko) | 2020-01-22 |
JP2020013808A (ja) | 2020-01-23 |
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