JP7093693B2 - 熱処理装置及び基板滑り検出方法 - Google Patents

熱処理装置及び基板滑り検出方法 Download PDF

Info

Publication number
JP7093693B2
JP7093693B2 JP2018132992A JP2018132992A JP7093693B2 JP 7093693 B2 JP7093693 B2 JP 7093693B2 JP 2018132992 A JP2018132992 A JP 2018132992A JP 2018132992 A JP2018132992 A JP 2018132992A JP 7093693 B2 JP7093693 B2 JP 7093693B2
Authority
JP
Japan
Prior art keywords
substrate
hot plate
wafer
slip
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018132992A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020013808A (ja
Inventor
優 溝部
和幸 岩男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2018132992A priority Critical patent/JP7093693B2/ja
Priority to KR1020190078581A priority patent/KR20200007657A/ko
Priority to CN201910618989.5A priority patent/CN110718482B/zh
Publication of JP2020013808A publication Critical patent/JP2020013808A/ja
Application granted granted Critical
Publication of JP7093693B2 publication Critical patent/JP7093693B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67103Apparatus for thermal treatment mainly by conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
JP2018132992A 2018-07-13 2018-07-13 熱処理装置及び基板滑り検出方法 Active JP7093693B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018132992A JP7093693B2 (ja) 2018-07-13 2018-07-13 熱処理装置及び基板滑り検出方法
KR1020190078581A KR20200007657A (ko) 2018-07-13 2019-07-01 열처리 장치 및 기판 미끄럼 검출 방법
CN201910618989.5A CN110718482B (zh) 2018-07-13 2019-07-10 热处理装置和基片滑动检测方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018132992A JP7093693B2 (ja) 2018-07-13 2018-07-13 熱処理装置及び基板滑り検出方法

Publications (2)

Publication Number Publication Date
JP2020013808A JP2020013808A (ja) 2020-01-23
JP7093693B2 true JP7093693B2 (ja) 2022-06-30

Family

ID=69170031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018132992A Active JP7093693B2 (ja) 2018-07-13 2018-07-13 熱処理装置及び基板滑り検出方法

Country Status (3)

Country Link
JP (1) JP7093693B2 (zh)
KR (1) KR20200007657A (zh)
CN (1) CN110718482B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306825A (ja) 1999-02-16 2000-11-02 Tokyo Electron Ltd 処理装置、処理システム、判別方法及び検出方法
JP2012151247A (ja) 2011-01-18 2012-08-09 Tokyo Electron Ltd 基板加熱装置、基板加熱方法及び記憶媒体
JP2018107175A (ja) 2016-12-22 2018-07-05 東京エレクトロン株式会社 熱処理装置、熱処理方法及びコンピュータ記憶媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197324A (ja) * 1997-09-18 1999-04-09 Dainippon Screen Mfg Co Ltd 基板熱処理装置
KR100593627B1 (ko) * 1999-02-16 2006-06-28 동경 엘렉트론 주식회사 처리장치, 처리시스템, 판별방법 및 검출방법
US7416632B2 (en) * 2001-09-03 2008-08-26 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP2005174986A (ja) * 2003-12-08 2005-06-30 Matsushita Electric Ind Co Ltd 急速熱処理装置、その製造方法及び温度調整方法
JP5542743B2 (ja) * 2010-10-07 2014-07-09 東京エレクトロン株式会社 熱処理装置および熱処理方法
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
CN104538331B (zh) * 2014-12-12 2018-06-05 通富微电子股份有限公司 一种晶圆翘曲处理的装置及方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306825A (ja) 1999-02-16 2000-11-02 Tokyo Electron Ltd 処理装置、処理システム、判別方法及び検出方法
JP2012151247A (ja) 2011-01-18 2012-08-09 Tokyo Electron Ltd 基板加熱装置、基板加熱方法及び記憶媒体
JP2018107175A (ja) 2016-12-22 2018-07-05 東京エレクトロン株式会社 熱処理装置、熱処理方法及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
CN110718482B (zh) 2024-03-22
CN110718482A (zh) 2020-01-21
KR20200007657A (ko) 2020-01-22
JP2020013808A (ja) 2020-01-23

Similar Documents

Publication Publication Date Title
JP5107372B2 (ja) 熱処理装置、塗布現像処理システム、熱処理方法、塗布現像処理方法及びその熱処理方法又は塗布現像処理方法を実行させるためのプログラムを記録した記録媒体
JP5296022B2 (ja) 熱処理方法及びその熱処理方法を実行させるためのプログラムを記録した記録媒体並びに熱処理装置
JP5174098B2 (ja) 熱処理方法及びその熱処理方法を実行させるためのプログラムを記録した記録媒体並びに熱処理装置
JP6432458B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
TWI794177B (zh) 基板處理裝置、基板處理方法及記錄媒體
TWI610387B (zh) 基板熱處理裝置、基板熱處理方法、記錄媒體及熱處理狀態檢測裝置
US7938587B2 (en) Substrate processing method, computer storage medium and substrate processing system
JP6308967B2 (ja) 熱処理装置、熱処理における異常検出方法及び読み取り可能なコンピュータ記憶媒体
JP3888620B2 (ja) 基板搬送装置における基板の受け渡し位置検知方法及びその教示装置
JPWO2017047355A1 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP2020027915A (ja) 処理条件補正方法及び基板処理システム
US7867674B2 (en) Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program
JP2008084886A (ja) 基板の測定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び基板の測定システム
JP7093693B2 (ja) 熱処理装置及び基板滑り検出方法
JP7154416B2 (ja) 基板処理装置及び処理条件調整方法
KR20210021524A (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
CN115985807A (zh) 基板处理装置
JP3587777B2 (ja) 加熱処理方法及び加熱処理装置
JP4920317B2 (ja) 基板の処理方法、プログラム、コンピュータ読み取り可能な記録媒体及び基板の処理システム
JP5186264B2 (ja) 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
JP6638796B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP6994424B2 (ja) 基板処理装置、基板処理方法、及び記憶媒体
TW202219463A (zh) 翹曲量估算裝置及翹曲量估算方法
JP2011165896A (ja) 基板処理方法

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20190201

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210414

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220121

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220524

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220620

R150 Certificate of patent or registration of utility model

Ref document number: 7093693

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150