JP7090481B2 - 静電チャック及びその製造方法 - Google Patents

静電チャック及びその製造方法 Download PDF

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Publication number
JP7090481B2
JP7090481B2 JP2018114381A JP2018114381A JP7090481B2 JP 7090481 B2 JP7090481 B2 JP 7090481B2 JP 2018114381 A JP2018114381 A JP 2018114381A JP 2018114381 A JP2018114381 A JP 2018114381A JP 7090481 B2 JP7090481 B2 JP 7090481B2
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JP
Japan
Prior art keywords
primer
electrostatic chuck
insulating component
adhesive layer
tubular insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018114381A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019220503A5 (enExample
JP2019220503A (ja
Inventor
隆正 吉川
啓晴 柳澤
信行 飯島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2018114381A priority Critical patent/JP7090481B2/ja
Priority to US16/430,569 priority patent/US11088006B2/en
Priority to KR1020190066516A priority patent/KR102744643B1/ko
Priority to TW108119861A priority patent/TWI820147B/zh
Publication of JP2019220503A publication Critical patent/JP2019220503A/ja
Publication of JP2019220503A5 publication Critical patent/JP2019220503A5/ja
Application granted granted Critical
Publication of JP7090481B2 publication Critical patent/JP7090481B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
JP2018114381A 2018-06-15 2018-06-15 静電チャック及びその製造方法 Active JP7090481B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018114381A JP7090481B2 (ja) 2018-06-15 2018-06-15 静電チャック及びその製造方法
US16/430,569 US11088006B2 (en) 2018-06-15 2019-06-04 Electrostatic chuck
KR1020190066516A KR102744643B1 (ko) 2018-06-15 2019-06-05 정전 척 및 그 제조 방법
TW108119861A TWI820147B (zh) 2018-06-15 2019-06-10 靜電夾盤及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018114381A JP7090481B2 (ja) 2018-06-15 2018-06-15 静電チャック及びその製造方法

Publications (3)

Publication Number Publication Date
JP2019220503A JP2019220503A (ja) 2019-12-26
JP2019220503A5 JP2019220503A5 (enExample) 2021-04-22
JP7090481B2 true JP7090481B2 (ja) 2022-06-24

Family

ID=68840316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018114381A Active JP7090481B2 (ja) 2018-06-15 2018-06-15 静電チャック及びその製造方法

Country Status (4)

Country Link
US (1) US11088006B2 (enExample)
JP (1) JP7090481B2 (enExample)
KR (1) KR102744643B1 (enExample)
TW (1) TWI820147B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102441256B1 (ko) * 2018-01-29 2022-09-07 교세라 가부시키가이샤 시료 유지구
JP7465338B2 (ja) * 2020-03-26 2024-04-10 株式会社巴川コーポレーション 静電チャック装置
KR20220103046A (ko) 2021-01-14 2022-07-21 신꼬오덴기 고교 가부시키가이샤 기판 고정 장치
JPWO2024058183A1 (enExample) * 2022-09-14 2024-03-21
CN120341156A (zh) * 2024-01-16 2025-07-18 Toto株式会社 静电吸盘

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011508419A (ja) 2007-12-19 2011-03-10 ラム リサーチ コーポレーション 半導体真空処理装置用のフィルム接着剤
JP2012512953A (ja) 2008-12-19 2012-06-07 アプライド マテリアルズ インコーポレイテッド 高温静電チャック接着剤
JP2013229464A (ja) 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071630A (en) * 1996-03-04 2000-06-06 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US6151203A (en) * 1998-12-14 2000-11-21 Applied Materials, Inc. Connectors for an electrostatic chuck and combination thereof
CN1310285C (zh) * 2003-05-12 2007-04-11 东京毅力科创株式会社 处理装置
JP5053696B2 (ja) * 2007-04-26 2012-10-17 信越化学工業株式会社 静電チャック
JP5936361B2 (ja) * 2012-01-12 2016-06-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6162428B2 (ja) 2013-02-27 2017-07-12 日本特殊陶業株式会社 支持装置
KR102684670B1 (ko) * 2016-01-19 2024-07-15 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
CN111512428A (zh) * 2017-12-28 2020-08-07 住友大阪水泥股份有限公司 静电卡盘装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011508419A (ja) 2007-12-19 2011-03-10 ラム リサーチ コーポレーション 半導体真空処理装置用のフィルム接着剤
JP2012512953A (ja) 2008-12-19 2012-06-07 アプライド マテリアルズ インコーポレイテッド 高温静電チャック接着剤
JP2013229464A (ja) 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Also Published As

Publication number Publication date
TW202002154A (zh) 2020-01-01
KR20190142215A (ko) 2019-12-26
US20190385883A1 (en) 2019-12-19
KR102744643B1 (ko) 2024-12-20
US11088006B2 (en) 2021-08-10
JP2019220503A (ja) 2019-12-26
TWI820147B (zh) 2023-11-01

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