KR102744643B1 - 정전 척 및 그 제조 방법 - Google Patents

정전 척 및 그 제조 방법 Download PDF

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Publication number
KR102744643B1
KR102744643B1 KR1020190066516A KR20190066516A KR102744643B1 KR 102744643 B1 KR102744643 B1 KR 102744643B1 KR 1020190066516 A KR1020190066516 A KR 1020190066516A KR 20190066516 A KR20190066516 A KR 20190066516A KR 102744643 B1 KR102744643 B1 KR 102744643B1
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KR
South Korea
Prior art keywords
primer
adhesive layer
electrostatic chuck
mentioned
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020190066516A
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English (en)
Korean (ko)
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KR20190142215A (ko
Inventor
다카마사 요시카와
히로하루 야나기사와
노부유키 이이지마
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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Publication of KR20190142215A publication Critical patent/KR20190142215A/ko
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Publication of KR102744643B1 publication Critical patent/KR102744643B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
KR1020190066516A 2018-06-15 2019-06-05 정전 척 및 그 제조 방법 Active KR102744643B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018114381A JP7090481B2 (ja) 2018-06-15 2018-06-15 静電チャック及びその製造方法
JPJP-P-2018-114381 2018-06-15

Publications (2)

Publication Number Publication Date
KR20190142215A KR20190142215A (ko) 2019-12-26
KR102744643B1 true KR102744643B1 (ko) 2024-12-20

Family

ID=68840316

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190066516A Active KR102744643B1 (ko) 2018-06-15 2019-06-05 정전 척 및 그 제조 방법

Country Status (4)

Country Link
US (1) US11088006B2 (enExample)
JP (1) JP7090481B2 (enExample)
KR (1) KR102744643B1 (enExample)
TW (1) TWI820147B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102441256B1 (ko) * 2018-01-29 2022-09-07 교세라 가부시키가이샤 시료 유지구
CN115244678B (zh) * 2020-03-26 2025-11-18 巴川集团股份有限公司 静电吸盘装置、静电吸盘装置用套筒
KR20220103046A (ko) * 2021-01-14 2022-07-21 신꼬오덴기 고교 가부시키가이샤 기판 고정 장치
KR20250044914A (ko) * 2022-09-14 2025-04-01 교세라 가부시키가이샤 흡착 기판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188321A (ja) 1998-12-14 2000-07-04 Applied Materials Inc 静電チャックコネクタとそのコンビネ―ション
JP2011508419A (ja) 2007-12-19 2011-03-10 ラム リサーチ コーポレーション 半導体真空処理装置用のフィルム接着剤
JP2013143512A (ja) 2012-01-12 2013-07-22 Hitachi High-Technologies Corp プラズマ処理装置
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071630A (en) * 1996-03-04 2000-06-06 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US20050042881A1 (en) * 2003-05-12 2005-02-24 Tokyo Electron Limited Processing apparatus
JP5053696B2 (ja) * 2007-04-26 2012-10-17 信越化学工業株式会社 静電チャック
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
JP6162428B2 (ja) 2013-02-27 2017-07-12 日本特殊陶業株式会社 支持装置
US10923381B2 (en) * 2016-01-19 2021-02-16 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP7259765B2 (ja) * 2017-12-28 2023-04-18 住友大阪セメント株式会社 静電チャック装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188321A (ja) 1998-12-14 2000-07-04 Applied Materials Inc 静電チャックコネクタとそのコンビネ―ション
JP2011508419A (ja) 2007-12-19 2011-03-10 ラム リサーチ コーポレーション 半導体真空処理装置用のフィルム接着剤
JP2013143512A (ja) 2012-01-12 2013-07-22 Hitachi High-Technologies Corp プラズマ処理装置
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Also Published As

Publication number Publication date
JP7090481B2 (ja) 2022-06-24
JP2019220503A (ja) 2019-12-26
KR20190142215A (ko) 2019-12-26
TWI820147B (zh) 2023-11-01
US20190385883A1 (en) 2019-12-19
US11088006B2 (en) 2021-08-10
TW202002154A (zh) 2020-01-01

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