JP7083911B2 - 裏側の基板接触を減少させる基板移送機構 - Google Patents
裏側の基板接触を減少させる基板移送機構 Download PDFInfo
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- JP7083911B2 JP7083911B2 JP2020542451A JP2020542451A JP7083911B2 JP 7083911 B2 JP7083911 B2 JP 7083911B2 JP 2020542451 A JP2020542451 A JP 2020542451A JP 2020542451 A JP2020542451 A JP 2020542451A JP 7083911 B2 JP7083911 B2 JP 7083911B2
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description
Claims (15)
- 基板処理システムであって、
移送チャンバ、
前記移送チャンバに連結された基板インプット/アウトプットチャンバ、及び
前記移送チャンバに連結された処理チャンバ
を備え、
前記基板インプット/アウトプットチャンバが、複数の積み重ねられたキャリアホルダを含み、
前記複数の積み重ねられたキャリアホルダの各々が、垂直方向に延在する第1のスタンドオフ及び第2のスタンドオフと、前記第1のスタンドオフから水平方向に延在する第1の部材であって、基板キャリアを支持する第1の湾曲内側部分を有する第1の部材と、前記第2のスタンドオフから水平方向に延在する第2の部材であって、前記基板キャリアを支持する第2の湾曲内側部分を有する第2の部材とを含む、基板処理システム。 - 基板処理システムであって、
移送チャンバ、
前記移送チャンバに連結された基板インプット/アウトプットチャンバ、及び
前記移送チャンバに連結された処理チャンバ
を備え、
前記基板インプット/アウトプットチャンバが、複数の積み重ねられたキャリアホルダを含み、
前記複数の積み重ねられたキャリアホルダの各々が、垂直方向に延在する第1のスタンドオフ及び第2のスタンドオフと、前記第1のスタンドオフから水平方向に延在して基板キャリアを支持する複数の第1の支持部材と、前記第2のスタンドオフから水平方向に延在して前記基板キャリアを支持する複数の第2の支持部材とを含む、基板処理システム。 - 前記基板インプット/アウトプットチャンバが、複数のリフトピンを有するプラテンを含み、前記複数のリフトピンは、前記プラテンを貫通して移動可能に配置されている、請求項1または2に記載の基板処理システム。
- 前記複数のリフトピンの各々が、先端部及びシャフトを含み、前記先端部が、前記シャフトの材料より柔らかい材料で作られている、請求項3に記載の基板処理システム。
- 前記複数のリフトピンの各々が、専用アクチュエータに動作可能に連結されている、請求項3に記載の基板処理システム。
- 前記複数のリフトピンの各々が、前記プラテンにおいて形成された開口内に配置され、前記開口がそれぞれ真空システムに流体連結されている、請求項3に記載の基板処理システム。
- 前記複数のリフトピンの各々が、基部及びモータを備えた基板リフト機構に連結されている、請求項3に記載の基板処理システム。
- 前記プラテンが、前記プラテン内に埋め込まれた熱伝達素子を含む、請求項3に記載の基板処理システム。
- 前記プラテンが、前記基板キャリアを中央配置するための複数の位置合わせパッドを含む、請求項3に記載の基板処理システム。
- 前記処理チャンバがそれぞれ、溝を有するサセプタを含み、前記溝は、前記基板キャリアを受け入れるために前記サセプタにおいて形成されている、請求項1または2に記載の基板処理システム。
- 前記サセプタが、サセプタ支持構造体によって支持されている、請求項10に記載の基板処理システム。
- 前記サセプタ支持構造体が、複数のキャリアリフトピンを含む、請求項11に記載の基板処理システム。
- 前記複数のキャリアリフトピンがそれぞれ、前記溝に隣接する開口内に受け入れられる、請求項12に記載の基板処理システム。
- ロードロックチャンバであって、
内部に熱伝達素子が埋め込まれたプラテン、及び
前記プラテンの周りに位置付けされた複数の積み重ねられたキャリアホルダ
を備え、
前記複数の積み重ねられたキャリアホルダの各々が、垂直方向に延在する第1のスタンドオフ及び第2のスタンドオフと、前記第1のスタンドオフから水平方向に延在する第1の部材であって、基板キャリアを支持する第1の湾曲内側部分を有する第1の部材と、前記第2のスタンドオフから水平方向に延在する第2の部材であって、前記基板キャリアを支持する第2の湾曲内側部分を有する第2の部材とを含む、ロードロックチャンバ。 - ロードロックチャンバであって、
内部に熱伝達素子が埋め込まれたプラテン、及び
前記プラテンの周りに位置付けされた複数の積み重ねられたキャリアホルダ
を備え、
前記複数の積み重ねられたキャリアホルダの各々が、垂直方向に延在する第1のスタンドオフ及び第2のスタンドオフと、前記第1のスタンドオフから水平方向に延在して基板キャリアを支持する複数の第1の支持部材と、前記第2のスタンドオフから水平方向に延在して前記基板キャリアを支持する複数の第2の支持部材とを含む、ロードロックチャンバ。
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JP2024083570A JP2024119851A (ja) | 2018-02-12 | 2024-05-22 | 裏側の基板接触を減少させる基板移送機構 |
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US15/894,735 US10755955B2 (en) | 2018-02-12 | 2018-02-12 | Substrate transfer mechanism to reduce back-side substrate contact |
PCT/US2019/014033 WO2019156793A1 (en) | 2018-02-12 | 2019-01-17 | Substrate transfer mechanism to reduce back-side substrate contact |
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