JP7075123B2 - 熱可塑性物質表面上でシリコーンの付着性を改善するための方法 - Google Patents
熱可塑性物質表面上でシリコーンの付着性を改善するための方法 Download PDFInfo
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Description
2 表面
3 熱可塑性物質
4 UV-C放射
5 放射源
6 照射チャンバ
7 活性化済み表面
8 オゾン
9 ハウジング
10 加工物マウント
100 複合物
Claims (7)
- 熱可塑性物質(3)の表面(2)上でシリコーン(1)の付着性を改善するための方法であって、
前記熱可塑性物質(3)の表面(2)はUV-C放射(4)によって照射され、
液状シリコーンゴム又は高粘度シリコーンゴムが前記シリコーン(1)として設けられ、
前記熱可塑性物質(3)の表面(2)の照射は、外部に対して暗くされた照射チャンバ(6)内で実施され、前記熱可塑性物質(3)の表面(2)の照射は、オゾン(8)を形成している間に実施され、前記オゾン(8)は、前記照射チャンバ(6)によって前記表面(2)と接触状態に保たれて、照射中に前記表面(2)と相互作用し、
ガラス繊維強化ポリアミド、ポリカーボネート、ポリプロピレン、メチルメタクリレートアクリロニトリルブタジエンスチレン、メチルメタクリレート、又はアクリロニトリルブタジエンスチレンが、前記熱可塑性物質(3)として設けられることを特徴とする、方法。 - 前記UV-C放射(4)は、100nm~280nmの、150nm~200nmの、又は180nm~190nmの波長で提供されることを特徴とする、請求項1に記載の方法。
- 前記UV-C放射(4)は、放射源(5)によって生成され、前記放射源(5)は、照射中に前記熱可塑性物質(3)の表面(2)にわたって移動されることを特徴とする、請求項1又は請求項2に記載の方法。
- 照射は、2W~1,000Wの放射パワーで実施されること、及び/又は、照射は、前記放射源(5)として低圧ランプを使用して実施されることを特徴とする、請求項1~3のいずれか1項に記載の方法。
- 照射は、3秒~15分の照射持続時間で実施されることを特徴とする、請求項1~4のいずれか1項に記載の方法。
- 熱可塑性物質(3)及び前記熱可塑性物質(3)の表面(2)上に配置されたシリコーン(1)からなる化合物(100)であって、前記表面(2)は、請求項1~5のいずれか1項による方法を使用して活性化されており、
前記熱可塑性物質(3)の前記表面(2)上の前記シリコーン(1)の付着性は、UV-C放射(4)による、前記熱可塑性物質(3)の前記表面(2)への照射によって酸素ラジカルの発生に基づく、化合物(100)。 - 前記シリコーン(1)は、射出成形プロセスによって前記活性化済み表面(7)に塗布されたことを特徴とする、請求項6に記載の化合物(100)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102016002011.3 | 2016-02-20 | ||
DE102016002011.3A DE102016002011A1 (de) | 2016-02-20 | 2016-02-20 | Verfahren zur Haftverbesserung von Silikon auf einer thermoplastischen Oberfläche |
PCT/DE2016/100581 WO2017140288A1 (de) | 2016-02-20 | 2016-12-13 | Verfahren zur haftverbesserung von silikon auf einer thermoplastischen oberfläche |
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JP2019509373A JP2019509373A (ja) | 2019-04-04 |
JP7075123B2 true JP7075123B2 (ja) | 2022-05-25 |
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US (1) | US20200039195A1 (ja) |
EP (1) | EP3417025B1 (ja) |
JP (1) | JP7075123B2 (ja) |
KR (1) | KR102167846B1 (ja) |
CN (1) | CN108779369A (ja) |
CA (1) | CA3014826C (ja) |
DE (1) | DE102016002011A1 (ja) |
WO (1) | WO2017140288A1 (ja) |
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DE102018202449A1 (de) * | 2018-02-19 | 2019-02-21 | Conti Temic Microelectronic Gmbh | Leadframe einer elektronischen Komponente und Verfahren zur Ummantelung eines Leadframes einer elektronischen Komponente |
CN114446513A (zh) * | 2020-11-04 | 2022-05-06 | 进营全球株式会社 | 柔性扁平电缆与包含柔性扁平电缆的叠层母排 |
CN116997623B (zh) | 2021-03-30 | 2024-04-09 | 美国陶氏有机硅公司 | 将硅酮橡胶粘合到热塑性塑料 |
DE102022125594A1 (de) | 2022-10-05 | 2024-04-11 | Rico Group Gmbh | Verfahren zur lokalen Haftungsbeeinflussung zwischen einem Silikonwerkstoff und einem Thermoplasten |
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WO2015053405A1 (ja) | 2013-10-10 | 2015-04-16 | コニカミノルタ株式会社 | ガスバリア性フィルムの製造方法 |
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JP3185311B2 (ja) * | 1992-02-03 | 2001-07-09 | 東レ株式会社 | エアバッグの製造方法 |
DE69314997T2 (de) * | 1992-06-19 | 1998-03-05 | Fuji Polymertech Co Ltd | Verfahren zur Herstellung einer Fingertaste für einen Handhabeschalter |
US6015759A (en) * | 1997-12-08 | 2000-01-18 | Quester Technology, Inc. | Surface modification of semiconductors using electromagnetic radiation |
JP3509615B2 (ja) * | 1999-03-31 | 2004-03-22 | 株式会社ダスキン | マット |
US8293061B2 (en) * | 2008-03-06 | 2012-10-23 | University Of Maryland College Park | Low temperature polymer bonding using UV/ozone surface treatment |
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JP2014186232A (ja) | 2013-03-25 | 2014-10-02 | Mitsubishi Chemicals Corp | 端部部材の製造方法、及び感光体ドラムユニットの製造方法 |
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EP3417025B1 (de) | 2020-07-08 |
CN108779369A (zh) | 2018-11-09 |
KR20190017722A (ko) | 2019-02-20 |
US20200039195A1 (en) | 2020-02-06 |
CA3014826A1 (en) | 2017-08-24 |
CA3014826C (en) | 2021-01-19 |
KR102167846B1 (ko) | 2020-10-20 |
JP2019509373A (ja) | 2019-04-04 |
DE102016002011A1 (de) | 2017-08-24 |
WO2017140288A1 (de) | 2017-08-24 |
EP3417025A1 (de) | 2018-12-26 |
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