JP7053055B2 - 光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用 - Google Patents

光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用 Download PDF

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JP7053055B2
JP7053055B2 JP2019541084A JP2019541084A JP7053055B2 JP 7053055 B2 JP7053055 B2 JP 7053055B2 JP 2019541084 A JP2019541084 A JP 2019541084A JP 2019541084 A JP2019541084 A JP 2019541084A JP 7053055 B2 JP7053055 B2 JP 7053055B2
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islands
group
layer
relaxation
island
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JP2020512684A (ja
Inventor
デイビッド ソッタ，
オリビア ルドゥー，
オリビア ボニン，
ジーン―マーク ベソウ，
モルゲン ロギオウ，
ラファエル カルミロン，
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Soitec SA
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Soitec SA
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Priority claimed from FR1752230A external-priority patent/FR3064108B1/fr
Priority claimed from FR1852155A external-priority patent/FR3079070B1/fr
Priority claimed from FR1852156A external-priority patent/FR3079071B1/fr
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/8215—Bodies characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials

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  • Recrystallisation Techniques (AREA)
  • Led Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2019541084A 2017-03-17 2018-03-14 光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用 Active JP7053055B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022048947A JP7322329B2 (ja) 2017-03-17 2022-03-24 光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
FR1752230A FR3064108B1 (fr) 2017-03-17 2017-03-17 Substrat de croissance pour la formation de dispositifs optoelectroniques, procede de fabrication d'un tel susbstrat, et utilisation du susbtrat notamment dans le domaine des micro-ecrans d'affichage
FR1752230 2017-03-17
FR1852155 2018-03-13
FR1852156 2018-03-13
FR1852155A FR3079070B1 (fr) 2018-03-13 2018-03-13 Procede de fabrication d'une pluralite d'ilots semi-conducteurs cristallins presentant une variete de parametres de maille
FR1852156A FR3079071B1 (fr) 2018-03-13 2018-03-13 Procede de fabrication d'une pluralite d'ilots semi-conducteurs cristallins prensentant une variete de parametres de maille
PCT/FR2018/050606 WO2018167426A2 (fr) 2017-03-17 2018-03-14 Substrat de croissance pour la formation de dispositifs optoelectroniques, procede de fabrication d'un tel substrat, et utilisation du substrat notamment dans le domaine des micro-ecrans d'affichage

Related Child Applications (1)

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JP2022048947A Division JP7322329B2 (ja) 2017-03-17 2022-03-24 光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用

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JP2020512684A JP2020512684A (ja) 2020-04-23
JP7053055B2 true JP7053055B2 (ja) 2022-04-12

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JP2019541084A Active JP7053055B2 (ja) 2017-03-17 2018-03-14 光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用
JP2022048947A Active JP7322329B2 (ja) 2017-03-17 2022-03-24 光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用

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US (1) US20210210653A1 (enExample)
EP (2) EP3596756B1 (enExample)
JP (2) JP7053055B2 (enExample)
KR (1) KR102456048B1 (enExample)
CN (1) CN110447100B (enExample)
SG (1) SG11201908017RA (enExample)
TW (1) TWI740015B (enExample)
WO (1) WO2018167426A2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3103627B1 (fr) * 2019-11-25 2023-03-24 Soitec Silicon On Insulator Procede de production d'un substrat comprenant une etape de traitement thermique de relaxation
TWI905261B (zh) * 2021-09-09 2025-11-21 晶元光電股份有限公司 光電元件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049673A (ja) 2004-08-06 2006-02-16 Seiko Epson Corp 半導体基板、半導体装置、半導体基板の製造方法および半導体装置の製造方法
US20080169508A1 (en) 2007-01-11 2008-07-17 International Business Machines Corporation Stressed soi fet having doped glass box layer
JP2009055016A (ja) 2007-08-16 2009-03-12 Sharp Corp 半導体デバイスおよびその製造方法
JP2011530181A (ja) 2008-08-06 2011-12-15 エス． オー． アイ． テック シリコン オン インシュレーター テクノロジーズ 歪み層の緩和

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Publication number Priority date Publication date Assignee Title
JP2751963B2 (ja) * 1992-06-10 1998-05-18 日亜化学工業株式会社 窒化インジウムガリウム半導体の成長方法
JPH10500535A (ja) * 1994-10-11 1998-01-13 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 複数の波長で光を発生するための発光ダイオードのモノリシック・アレイ及びそれをマルチカラー・デイスプレイに応用するための使用方法
US20020136932A1 (en) * 2001-03-21 2002-09-26 Seikoh Yoshida GaN-based light emitting device
JP2004022969A (ja) 2002-06-19 2004-01-22 Nippon Telegr & Teleph Corp <Ntt> 半導体発光素子
CN101540357B (zh) * 2008-03-19 2010-09-01 中国科学院半导体研究所 控制自组织铟镓砷量子点成核的生长方法
EP2151856A1 (en) 2008-08-06 2010-02-10 S.O.I. TEC Silicon Relaxation of strained layers
EP2151852B1 (en) 2008-08-06 2020-01-15 Soitec Relaxation and transfer of strained layers
FR2936903B1 (fr) 2008-10-07 2011-01-14 Soitec Silicon On Insulator Relaxation d'une couche de materiau contraint avec application d'un raidisseur
KR101408475B1 (ko) * 2008-10-30 2014-06-19 소이텍 감소된 격자 변형을 갖는 반도체 재료층들, 반도체 구조들, 디바이스들 및 이를 포함하는 가공된 기판을 형성하는 방법들
KR101081169B1 (ko) * 2010-04-05 2011-11-07 엘지이노텍 주식회사 발광 소자 및 그 제조방법, 발광 소자 패키지, 조명 시스템
JP5789782B2 (ja) 2010-05-20 2015-10-07 パナソニックＩｐマネジメント株式会社 窒化物半導体発光素子および窒化物半導体発光素子の製造方法
FR2992465B1 (fr) 2012-06-22 2015-03-20 Soitec Silicon On Insulator Procede de fabrication collective de leds et structure pour la fabrication collective de leds
FR2992466A1 (fr) 2012-06-22 2013-12-27 Soitec Silicon On Insulator Procede de realisation de contact pour led et structure resultante
CN105051921A (zh) 2013-03-15 2015-11-11 索泰克公司 具有包含InGaN的有源区的发光二极管半导体结构体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049673A (ja) 2004-08-06 2006-02-16 Seiko Epson Corp 半導体基板、半導体装置、半導体基板の製造方法および半導体装置の製造方法
US20080169508A1 (en) 2007-01-11 2008-07-17 International Business Machines Corporation Stressed soi fet having doped glass box layer
JP2009055016A (ja) 2007-08-16 2009-03-12 Sharp Corp 半導体デバイスおよびその製造方法
JP2011530181A (ja) 2008-08-06 2011-12-15 エス． オー． アイ． テック シリコン オン インシュレーター テクノロジーズ 歪み層の緩和

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Publication number Publication date
WO2018167426A2 (fr) 2018-09-20
WO2018167426A3 (fr) 2018-11-22
TWI740015B (zh) 2021-09-21
KR102456048B1 (ko) 2022-10-19
SG11201908017RA (en) 2019-10-30
JP2022087136A (ja) 2022-06-09
KR20190123347A (ko) 2019-10-31
TW201903830A (zh) 2019-01-16
JP7322329B2 (ja) 2023-08-08
US20210210653A1 (en) 2021-07-08
EP4033531B1 (fr) 2023-08-02
EP3596756B1 (fr) 2023-02-15
CN110447100A (zh) 2019-11-12
EP4033531A1 (fr) 2022-07-27
EP3596756A2 (fr) 2020-01-22
JP2020512684A (ja) 2020-04-23
CN110447100B (zh) 2023-07-18

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