JP7049848B2 - 保持面の研削方法 - Google Patents

保持面の研削方法 Download PDF

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Publication number
JP7049848B2
JP7049848B2 JP2018020937A JP2018020937A JP7049848B2 JP 7049848 B2 JP7049848 B2 JP 7049848B2 JP 2018020937 A JP2018020937 A JP 2018020937A JP 2018020937 A JP2018020937 A JP 2018020937A JP 7049848 B2 JP7049848 B2 JP 7049848B2
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JP
Japan
Prior art keywords
grinding
holding
holding surface
center
grinding wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018020937A
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English (en)
Japanese (ja)
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JP2019136806A (ja
Inventor
健 長井
有希子 木川
将樹 掛札
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018020937A priority Critical patent/JP7049848B2/ja
Priority to TW108103795A priority patent/TWI782178B/zh
Priority to CN201910103280.1A priority patent/CN110125731B/zh
Priority to KR1020190013429A priority patent/KR102662484B1/ko
Publication of JP2019136806A publication Critical patent/JP2019136806A/ja
Application granted granted Critical
Publication of JP7049848B2 publication Critical patent/JP7049848B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/01—Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2018020937A 2018-02-08 2018-02-08 保持面の研削方法 Active JP7049848B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018020937A JP7049848B2 (ja) 2018-02-08 2018-02-08 保持面の研削方法
TW108103795A TWI782178B (zh) 2018-02-08 2019-01-31 保持面的磨削方法
CN201910103280.1A CN110125731B (zh) 2018-02-08 2019-02-01 保持面的磨削方法
KR1020190013429A KR102662484B1 (ko) 2018-02-08 2019-02-01 유지면의 연삭 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018020937A JP7049848B2 (ja) 2018-02-08 2018-02-08 保持面の研削方法

Publications (2)

Publication Number Publication Date
JP2019136806A JP2019136806A (ja) 2019-08-22
JP7049848B2 true JP7049848B2 (ja) 2022-04-07

Family

ID=67568546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018020937A Active JP7049848B2 (ja) 2018-02-08 2018-02-08 保持面の研削方法

Country Status (4)

Country Link
JP (1) JP7049848B2 (zh)
KR (1) KR102662484B1 (zh)
CN (1) CN110125731B (zh)
TW (1) TWI782178B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110315425B (zh) * 2019-07-10 2020-08-28 衢州学院 蓝宝石晶圆游离磨料研磨设备
JP7504537B2 (ja) 2019-09-10 2024-06-24 株式会社ディスコ ウェーハの研削方法
CN115066314B (zh) * 2020-02-17 2024-05-28 东京毅力科创株式会社 加工方法以及加工装置
JP7413103B2 (ja) 2020-03-17 2024-01-15 株式会社ディスコ ウェーハの研削方法
JP7479767B2 (ja) 2020-09-09 2024-05-09 株式会社ディスコ 研削方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136410A (ja) 2001-10-31 2003-05-14 Allied Material Corp 超砥粒ビトリファイドボンド砥石
JP2015131354A (ja) 2014-01-10 2015-07-23 株式会社ディスコ チャックテーブル及び研削装置
JP2016132071A (ja) 2015-01-21 2016-07-25 株式会社ディスコ 研削装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734041B2 (ja) * 2005-06-15 2011-07-27 株式会社ディスコ ビトリファイドボンド砥石の製造方法
CN100429047C (zh) * 2006-11-08 2008-10-29 大连理工大学 一种硬脆晶体基片超精密磨削砂轮
JP2009094326A (ja) * 2007-10-10 2009-04-30 Disco Abrasive Syst Ltd ウェーハの研削方法
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
JP5295731B2 (ja) * 2008-11-21 2013-09-18 株式会社ディスコ ウエーハの研削方法
JP5508120B2 (ja) * 2010-04-28 2014-05-28 株式会社ディスコ 硬質基板の加工方法
JP2012174987A (ja) * 2011-02-23 2012-09-10 Disco Abrasive Syst Ltd 単結晶基板の研削方法
JP2013193156A (ja) * 2012-03-19 2013-09-30 Disco Corp 研削装置、及び、研削方法
JP5640100B2 (ja) * 2012-06-05 2014-12-10 株式会社アライドマテリアル ビトリファイドボンド超砥粒ホイールおよびそれを用いたウエハの製造方法
JP5640064B2 (ja) * 2012-08-29 2014-12-10 株式会社アライドマテリアル ビトリファイドボンド超砥粒ホイールおよびそれを用いてウエハを研削加工する方法
JP6157229B2 (ja) 2013-06-10 2017-07-05 株式会社ディスコ 研削装置及び研削方法
JP6336772B2 (ja) * 2014-02-14 2018-06-06 株式会社ディスコ 研削研磨装置
JP6292958B2 (ja) * 2014-04-18 2018-03-14 株式会社ディスコ 研削装置
JP2016047561A (ja) * 2014-08-27 2016-04-07 株式会社ディスコ 研削装置
JP6475518B2 (ja) * 2015-03-03 2019-02-27 株式会社ディスコ ウエーハの加工方法
JP6574373B2 (ja) * 2015-11-17 2019-09-11 株式会社ディスコ 円板状ワークの研削方法
JP2017185575A (ja) * 2016-04-04 2017-10-12 クレトイシ株式会社 ビトリファイド超砥粒ホイール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136410A (ja) 2001-10-31 2003-05-14 Allied Material Corp 超砥粒ビトリファイドボンド砥石
JP2015131354A (ja) 2014-01-10 2015-07-23 株式会社ディスコ チャックテーブル及び研削装置
JP2016132071A (ja) 2015-01-21 2016-07-25 株式会社ディスコ 研削装置

Also Published As

Publication number Publication date
KR102662484B1 (ko) 2024-04-30
TW201934262A (zh) 2019-09-01
CN110125731A (zh) 2019-08-16
TWI782178B (zh) 2022-11-01
KR20190096289A (ko) 2019-08-19
CN110125731B (zh) 2022-12-16
JP2019136806A (ja) 2019-08-22

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