JP7049848B2 - How to grind the holding surface - Google Patents

How to grind the holding surface Download PDF

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JP7049848B2
JP7049848B2 JP2018020937A JP2018020937A JP7049848B2 JP 7049848 B2 JP7049848 B2 JP 7049848B2 JP 2018020937 A JP2018020937 A JP 2018020937A JP 2018020937 A JP2018020937 A JP 2018020937A JP 7049848 B2 JP7049848 B2 JP 7049848B2
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grinding
holding
holding surface
center
grinding wheel
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JP2019136806A (en
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健 長井
有希子 木川
将樹 掛札
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Disco Corp
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Disco Corp
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Priority to TW108103795A priority patent/TWI782178B/en
Priority to CN201910103280.1A priority patent/CN110125731B/en
Priority to KR1020190013429A priority patent/KR102662484B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/01—Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Description

本発明は、保持テーブルの保持面を研削する研削方法に関する。 The present invention relates to a grinding method for grinding a holding surface of a holding table.

ウェーハを研削する研削装置は、ウェーハを保持する保持テーブルと、保持テーブルに保持されたウェーハに研削を施す研削砥石が固着された研削ホイールが回転可能に装着された研削手段とを備え、ウェーハを所定の厚みに研削することができる。研削装置において、研削ホイールや保持テーブルを交換等した後は、保持テーブルの保持面と研削砥石の研削面とを平行にするため、研削砥石で保持面を研削するセルフグラインドを実施している（例えば、下記の特許文献１を参照）。 A grinding device for grinding a wafer includes a holding table for holding the wafer and a grinding means for rotatably mounting a grinding wheel to which a grinding wheel for grinding the wafer held on the holding table is fixed. It can be ground to a predetermined thickness. After replacing the grinding wheel or holding table in the grinding device, self-grinding is performed to grind the holding surface with the grinding wheel in order to make the holding surface of the holding table parallel to the grinding surface of the grinding wheel (). For example, see Patent Document 1 below).

特開２０１４－２３７２１０号公報Japanese Unexamined Patent Publication No. 2014-237210

上記のセルフグラインドでは、保持テーブルの半径範囲に研削砥石の研削面を接触させて研削を行っていることから、保持テーブルの保持面が円錐形状に形成される。保持テーブルによって保持されるウェーハが厚い場合、ウェーハが保持面の形状にならわずに保持面の円錐面の頂点付近で保持面とウェーハの中央下面とに隙間が生じ、ウェーハの中央が研削され過ぎて薄くなるという問題がある。 In the above self-grinding, since the grinding surface of the grinding wheel is brought into contact with the radius range of the holding table for grinding, the holding surface of the holding table is formed in a conical shape. When the wafer held by the holding table is thick, the wafer does not follow the shape of the holding surface, and a gap is created between the holding surface and the lower center of the wafer near the apex of the conical surface of the holding surface, and the center of the wafer is ground. There is a problem that it becomes too thin.

本発明は、上記の事情に鑑みてなされたもので、研削後のウェーハの中央が薄くなりすぎないように保持テーブルを保持できるようにすることを目的としている The present invention has been made in view of the above circumstances, and an object of the present invention is to be able to hold a holding table so that the center of the wafer after grinding does not become too thin.

本発明は、環状に研削砥石を配設した研削ホイールの中心を軸に回転させる研削手段と、ウェーハを保持する保持面の中心を軸に保持テーブルを回転させる保持手段とを備えた研削装置を用いて、該保持面の中心を通過する該研削砥石で該保持面を研削する保持面の研削方法であって、該研削砥石は、ビトリファイドボンドとダイヤモンド砥粒とを混合させ焼結させて固形化し研削面に気孔を有するビトリファイド砥石であり、該研削面に隙間を備えず環状に形成され、該保持テーブルを回転させ、該保持面の半径領域に該研削面を接触させ、該半径領域の外周から中心に向かって該研削砥石を移動させているときに該気孔に該ダイヤモンド砥粒を進入させ、該保持面の中心を通過した該研削面の該気孔から該ダイヤモンド砥粒を押し出し該保持面の中央部分を研削して平坦な凹み部を形成し該保持面を研削する。 The present invention provides a grinding device including a grinding means for rotating a grinding wheel in which a grinding wheel is arranged in an annular shape around the center of a grinding wheel and a holding means for rotating a holding table around the center of a holding surface for holding a wafer. It is a method of grinding a holding surface by grinding the holding surface with the grinding wheel passing through the center of the holding surface. The grinding wheel is a solid body obtained by mixing and sintering a vitrified bond and diamond abrasive grains. It is a vitrified grindstone having pores on the ground surface, which is formed in an annular shape without a gap on the ground surface, and the holding table is rotated to bring the ground surface into contact with the radial region of the holding surface . When the grinding wheel is being moved from the outer periphery toward the center, the diamond abrasive grains are allowed to enter the pores, and the diamond abrasive grains are extruded from the pores of the grinding surface that have passed through the center of the holding surface to hold the diamond abrasive grains. The central portion of the surface is ground to form a flat recess and the holding surface is ground.

上記ダイヤモンド砥粒は、粒度６００を用いることが好ましい。 It is preferable to use a grain size of 600 for the diamond abrasive grains.

本発明に係る保持面の研削方法では、使用される研削砥石が、ビトリファイドボンドとダイヤモンド砥粒とを混合させ焼結させて固形化し研削面に気孔を有するビトリファイド砥石であり、研削面に隙間を備えず環状に形成され、保持テーブルを回転させ、保持面の半径領域に研削面を接触させ保持面を研削するように構成したため、半径領域では、研削面の複数の気孔内にダイヤモンド砥粒を埋め込ませながら保持面を研削できるとともに、保持面の中心を通過して研削面と保持面との間に隙間が生じると、研削面の気孔から押し出されたダイヤモンド砥粒で保持面の中央に平坦な凹み部を形成することができる。これにより、例えば厚みのあるウェーハを保持テーブルで保持する場合、中央に凹み部が形成された保持面でウェーハを隙間無く保持できるため、ウェーハの中央が過度に研削されるのを防ぐことができ、ウェーハを均等の厚さに研削することが可能となる。 In the method for grinding a holding surface according to the present invention, the grinding wheel used is a vitrified grindstone in which a vitrified bond and diamond abrasive grains are mixed and sintered to solidify and have pores on the grinding surface, and a gap is formed in the grinding surface. It is formed in an annular shape without any provision, and the holding table is rotated so that the grinding surface is brought into contact with the radial area of the holding surface to grind the holding surface. The holding surface can be ground while being embedded, and when a gap is created between the grinding surface and the holding surface after passing through the center of the holding surface, the diamond abrasive grains extruded from the pores of the ground surface flatten the center of the holding surface. A dented portion can be formed. As a result, for example, when a thick wafer is held on a holding table, the wafer can be held without a gap on the holding surface having a recess formed in the center, so that the center of the wafer can be prevented from being excessively ground. , The wafer can be ground to a uniform thickness.

上記ダイヤモンド砥粒として、粒度６００を用いることにより、保持面の表面粗さを良好に仕上げることができる。 By using the grain size 600 as the diamond abrasive grains, the surface roughness of the holding surface can be satisfactorily finished.

研削装置の一例の構成を部分的に示す断面図である。It is sectional drawing which shows the structure of an example of a grinding apparatus partially. 研削砥石で保持面を研削する状態を示す断面図である。It is sectional drawing which shows the state of grinding a holding surface with a grinding wheel. 研削砥石の回転軌跡を示すとともに、研削砥石で保持面を研削する半径領域を説明する説明図である。It is explanatory drawing which shows the rotation locus of a grinding wheel and explains the radius region which grinds the holding surface with a grinding wheel. 保持面の半径領域を研削砥石で研削している状態を示す部分拡大図である。It is a partially enlarged view which shows the state which the radial area of a holding surface is ground with a grinding wheel. 保持面の中心を通過した研削面の気孔から押し出されたダイヤモンド砥粒が保持面の中心から径方向外側の領域を研削している状態を示す部分拡大図である。It is a partially enlarged view which shows the state which the diamond abrasive grain extruded from the pore of the grinding surface which passed through the center of a holding surface is grinding the region outside the radial direction from the center of a holding surface. 研削された後の保持テーブルの状態を示す断面図である。It is sectional drawing which shows the state of the holding table after being ground.

図１は、本発明に係る保持面の研削方法に用いられる研削装置１の一例である。研削装置１は、研削ホイール１３の中心を通る回転軸１００を軸に回転させる研削手段１０と、ウェーハを保持する保持面２４ａの中心を通る回転軸２００を軸に保持テーブル２１を回転させる保持手段２０とを少なくとも備えている。 FIG. 1 is an example of a grinding device 1 used in the method for grinding a holding surface according to the present invention. The grinding device 1 is a holding means for rotating the holding table 21 around a rotating shaft 100 passing through the center of the grinding wheel 13 and a rotating shaft 200 passing through the center of the holding surface 24a for holding the wafer. It has at least 20.

研削手段１０は、鉛直方向の軸心を有するスピンドル１１と、マウント１２を介してスピンドル１１の下端に装着された研削ホイール１３と、研削ホイール１３の下部に環状の研削砥石１４とを備えている。研削手段２０には、研削手段２０を鉛直方向に昇降させる昇降手段１８と、スピンドル１１を回転させるモータ（図示せず）とが接続されている。 The grinding means 10 includes a spindle 11 having a vertical axis, a grinding wheel 13 mounted at the lower end of the spindle 11 via a mount 12, and an annular grinding wheel 14 under the grinding wheel 13. .. The grinding means 20 is connected to an elevating means 18 for raising and lowering the grinding means 20 in the vertical direction and a motor (not shown) for rotating the spindle 11.

研削砥石１４は、ビトリファイドボンド１５とダイヤモンド砥粒１６とを混合して焼結させて固形化したビトリファイド砥石である。研削砥石１４の下面は、被研削物と接触する研削面１４ａとなっている。また、研削砥石１４は、研削面１４ａに複数の気孔１７を有し、かつ、研削面１４ａに隙間を備えず環状に形成されている。複数の気孔１７は、研削砥石１４の研削面１４ａと保持面２４ａとが実際に接触する研削領域においてダイヤモンド砥粒１６を逃がすためのチップポケットとして機能する。本実施形態に示す研削砥石１４は、環状に一体的に形成されているため、該研削領域で研削面１４ａと保持面２４ａとの間に隙間ができず、通常であれば、研削面１４ａから自生発刃して表出したダイヤモンド砥粒１６の逃げ場がなくなるが、本発明によれば、研削面１４ａの複数の気孔１７にダイヤモンド砥粒１６が埋まり込むため、保持面２４ａの面粗さを良好に形成することが可能となる。研削砥石１４は、例えば、ビトリファイドボンド１５にダイヤモンド砥粒１６を混入し、所定の型枠において混入したダイヤモンド砥粒１６にプレス加工を施し、その後、所定の温度で所定時間焼結することにより直方体形状に固形化されて製造される。 The grinding wheel 14 is a vitrified grindstone obtained by mixing and sintering a vitrified bond 15 and diamond abrasive grains 16 to solidify the grindstone 14. The lower surface of the grinding wheel 14 is a grinding surface 14a that comes into contact with the object to be ground. Further, the grinding wheel 14 has a plurality of pores 17 on the grinding surface 14a and is formed in an annular shape without a gap on the grinding surface 14a. The plurality of pores 17 function as tip pockets for allowing the diamond abrasive grains 16 to escape in the grinding region where the grinding surface 14a and the holding surface 24a of the grinding wheel 14 actually contact. Since the grinding wheel 14 shown in the present embodiment is integrally formed in an annular shape, there is no gap between the grinding surface 14a and the holding surface 24a in the grinding region, and normally, from the grinding surface 14a. Although there is no escape place for the diamond abrasive grains 16 that are self-generated and exposed, according to the present invention, the diamond abrasive grains 16 are embedded in the plurality of pores 17 of the ground surface 14a, so that the surface roughness of the holding surface 24a is reduced. It can be formed well. The grinding wheel 14 is a rectangular parallelepiped, for example, by mixing diamond abrasive grains 16 into a vitrified bond 15, pressing the diamond abrasive grains 16 mixed in a predetermined mold, and then sintering the diamond abrasive grains 16 at a predetermined temperature for a predetermined time. Manufactured by solidifying into a shape.

本実施形態に示す研削砥石１４では、ダイヤモンド砥粒１６を固めるボンド材としてビトリファイドボンド１５を利用していることから、他のボンド材（例えばレジンボンドやメタルボンド）と比べて比較的硬く、研削砥石１４で保持面２４ａを研削すると、保持面２４ａの面状態を良好に仕上げることが可能となる。また、ボンド材としてビトリファイドボンド１５を用いることでダイヤモンド砥粒１６を強固に保持でき、研削効率が向上して研削砥石１４の寿命も長くなる。したがって、研削砥石１４の交換頻度が少なくて済むため、有用である。 In the grinding wheel 14 shown in the present embodiment, since the vitrified bond 15 is used as the bonding material for solidifying the diamond abrasive grains 16, the grinding wheel 14 is relatively hard compared to other bonding materials (for example, resin bond or metal bond) and is ground. When the holding surface 24a is ground with the grindstone 14, the surface condition of the holding surface 24a can be satisfactorily finished. Further, by using the vitrified bond 15 as the bond material, the diamond abrasive grains 16 can be firmly held, the grinding efficiency is improved, and the life of the grinding wheel 14 is extended. Therefore, the grinding wheel 14 needs to be replaced less frequently, which is useful.

ダイヤモンド砥粒１６の粒度は、例えば粒度６００（平均粒径２０μｍ）を用いることが好ましい。ダイヤモンド砥粒１６の粒径が小さすぎると、研削砥石１４で保持面２４ａを研削する際にダイヤモンド砥粒１６が研削面１４ａから表出されず、保持面２４ａを所望の面状態に仕上げることができないし、ダイヤモンド砥粒１６の粒径が大きすぎると、研削面１４ａからのダイヤモンド砥粒１６の突き出し量が大きくなって保持面２４ａの表面粗さが悪化する。したがって、ダイヤモンド砥粒１６の粒度としては、上記した粒度６００が最も好適であり、かかるダイヤモンド砥粒１６によれば、保持面２４ａの表面粗さを良好に仕上げることができる。 As the particle size of the diamond abrasive grains 16, it is preferable to use, for example, a particle size of 600 (average particle size of 20 μm). If the grain size of the diamond abrasive grains 16 is too small, the diamond abrasive grains 16 will not be exposed from the grinding surface 14a when the holding surface 24a is ground by the grinding wheel 14, and the holding surface 24a may be finished in a desired surface state. If the grain size of the diamond abrasive grains 16 is too large, the amount of protrusion of the diamond abrasive grains 16 from the ground surface 14a becomes large and the surface roughness of the holding surface 24a deteriorates. Therefore, as the grain size of the diamond abrasive grains 16, the above-mentioned grain size 600 is the most suitable, and according to the diamond abrasive grains 16, the surface roughness of the holding surface 24a can be satisfactorily finished.

保持手段２０は、ウェーハを吸引保持する保持テーブル２１と、保持テーブル２１の回転軸２００を回転させるモータ２２とを少なくとも備えている。保持テーブル２１は、中央に凹状の嵌合溝２３０を有する枠体２３と、枠体２３に収容されるポーラス部材２４とを備えている。枠体２３は、例えばセラミックス等によって構成されている。ポーラス部材２４が枠体２３の嵌合溝２３０に嵌め込まれることにより、保持テーブル２１として構成される。 The holding means 20 includes at least a holding table 21 for sucking and holding the wafer, and a motor 22 for rotating the rotating shaft 200 of the holding table 21. The holding table 21 includes a frame body 23 having a concave fitting groove 230 in the center, and a porous member 24 housed in the frame body 23. The frame body 23 is made of, for example, ceramics or the like. The porous member 24 is fitted into the fitting groove 230 of the frame body 23 to form a holding table 21.

ポーラス部材２４は、円盤状に形成されており、ポーラスセラミックス等の多孔質部材によって構成されている。ポーラス部材２４の上面がウェーハを保持する保持面２４ａである。保持面２４ａは、例えば直径３００ｍｍに形成されている。また、ポーラス部材２４の保持面２４ａは、保持面２４ａの中心Ｃから保持面２４ａの外周Ｅにかけて傾斜した略円錐面となっており、図示に示す中心Ｃは略円錐面の頂点となっている。保持面２４ａの中心Ｃと外周Ｅの高さ差は、例えば３０μｍ程度に形成されている。なお、図示していないが、保持手段２０には、保持テーブル２１の傾きを調整するための傾き調整手段が配設されている。 The porous member 24 is formed in a disk shape and is made of a porous member such as porous ceramics. The upper surface of the porous member 24 is a holding surface 24a for holding the wafer. The holding surface 24a is formed to have a diameter of, for example, 300 mm. Further, the holding surface 24a of the porous member 24 is a substantially conical surface inclined from the center C of the holding surface 24a to the outer peripheral E of the holding surface 24a, and the center C shown in the figure is the apex of the substantially conical surface. .. The height difference between the center C and the outer circumference E of the holding surface 24a is formed to be, for example, about 30 μm. Although not shown, the holding means 20 is provided with tilt adjusting means for adjusting the tilt of the holding table 21.

次に、研削装置１を用いて、保持テーブル２１の保持面２４ａを研削する保持面の研削方法について詳述する。本実施形態では、厚みのあるウェーハを保持テーブル２１の保持面２４ａで保持するために、予め保持面２４ａを研削するものとする。 Next, a method for grinding the holding surface 24a of the holding table 21 using the grinding device 1 will be described in detail. In the present embodiment, in order to hold the thick wafer on the holding surface 24a of the holding table 21, the holding surface 24a is ground in advance.

研削を開始する際には、傾き調整手段によって、図２に示すように、例えば保持テーブル２１の外周右側を上げることにより、研削砥石１４の中心の回転軸１００と保持テーブル２１の中心の回転軸２００とを相対的に所定角度だけ傾けて、研削砥石１４の研削面１４ａを保持面２４ａの円錐面の頂点（中心Ｃ）から外周Ｅに至る面に対して平行となるように調整する。 When starting grinding, as shown in FIG. 2, for example, by raising the outer peripheral right side of the holding table 21, the rotation axis 100 at the center of the grinding wheel 14 and the rotation axis at the center of the holding table 21 are raised by the inclination adjusting means. The grinding wheel 14 is adjusted so that the grinding surface 14a of the grinding wheel 14 is parallel to the surface from the apex (center C) of the conical surface of the holding surface 24a to the outer periphery E by tilting the 200 relatively by a predetermined angle.

次いで、モータ２２によって保持テーブル２１を例えば矢印Ａ方向に回転させる。昇降手段１８により研削手段１０を下降させつつ、研削手段１０は、スピンドル１１を回転させることにより、研削ホイール１３を例えば矢印Ａ方向に回転させ、研削砥石１４で保持面２４ａを押圧しながら研削する。 Next, the holding table 21 is rotated by the motor 22 in the direction of arrow A, for example. While lowering the grinding means 10 by the elevating means 18, the grinding means 10 rotates the grinding wheel 13 in the direction of arrow A, for example, by rotating the spindle 11, and grinds while pressing the holding surface 24a with the grinding wheel 14. ..

ここで、図３に示すように、矢印Ａ方向に回転する研削砥石１４の回転軌跡のうち、研削砥石１４が実際に保持面２４ａに接触して研削を行う円弧状の半径領域（点線で図示）が研削領域Ｐ１となっている。保持面２４ａの研削中、研削砥石１４は常に保持面２４ａの中心Ｃを通過しながら、研削領域Ｐ１において研削砥石１４の研削面１４ａが保持面２４ａに接触して保持面２４ａを研削する。 Here, as shown in FIG. 3, among the rotation loci of the grinding wheel 14 rotating in the direction of arrow A, the arcuate radial region (shown by a dotted line) in which the grinding wheel 14 actually contacts the holding surface 24a to perform grinding. ) Is the grinding area P1. During grinding of the holding surface 24a, the grinding wheel 14 always passes through the center C of the holding surface 24a, and the grinding surface 14a of the grinding wheel 14 comes into contact with the holding surface 24a in the grinding region P1 to grind the holding surface 24a.

図４に示すように、研削砥石１４の研削面１４ａが保持面２４ａに接触しているときは、研削面１４ａから表出したダイヤモンド砥粒１６に研削荷重をかけつつ保持面２４ａの外周Ｅから保持面２４ａの中心Ｃに向かって研削を行うことができる。すなわち、研削荷重がダイヤモンド砥粒１６に作用すると、研削砥石１４の研削面１４ａから表出しているダイヤモンド砥粒１６が複数の気孔１７内に埋まり込み、ダイヤモンド砥粒１６の突き出し量を小さくして保持面２４ａを研削できるため、表面粗さを良好に仕上げることができる。研削砥石１４は、環状に形成され研削面１４ａに隙間がないことから、図３に示した研削領域Ｐ１では、研削面１４ａと保持面２４ａとの間に隙間が生じず、複数の気孔１７内にダイヤモンド砥粒１６が埋まった状態が維持される。 As shown in FIG. 4, when the grinding surface 14a of the grinding wheel 14 is in contact with the holding surface 24a, the diamond abrasive grains 16 exposed from the grinding surface 14a are subjected to a grinding load from the outer circumference E of the holding surface 24a. Grinding can be performed toward the center C of the holding surface 24a. That is, when the grinding load acts on the diamond abrasive grains 16, the diamond abrasive grains 16 exposed from the grinding surface 14a of the grinding wheel 14 are embedded in the plurality of pores 17, and the protrusion amount of the diamond abrasive grains 16 is reduced. Since the holding surface 24a can be ground, the surface roughness can be satisfactorily finished. Since the grinding wheel 14 is formed in an annular shape and there is no gap in the grinding surface 14a, in the grinding region P1 shown in FIG. 3, there is no gap between the grinding surface 14a and the holding surface 24a, and the inside of the plurality of pores 17 The state in which the diamond abrasive grains 16 are buried is maintained.

一方、図３に示した研削砥石１４が保持面２４ａの中心Ｃを通過すると、中心Ｃを通過した研削砥石１４の研削面１４ａと保持面２４ａとが非接触の状態となる。すなわち、研削砥石１４の研削面１４ａが保持面２４ａに接触していないときは、図５に示すように、研削面１４ａと保持面２４ａとの間に隙間が生じるため、保持面２４ａの中心Ｃを通過した研削面１４ａの研削荷重を受けていないダイヤモンド砥粒１６が複数の気孔１７から外側へ押し出された状態となる。複数の気孔１７から押し出されたダイヤモンド砥粒１６によって保持面２４ａの中心Ｃから径方向外側のわずかな領域（例えば図３に示す中央研削領域Ｐ２）を研削することで、図６に示すように、保持面２４ａの中央に平坦な凹み部２５を形成する。このように、研削砥石１４と保持テーブル２１との傾き関係を調整することなく、厚みのあるウェーハに対応可能な保持面２４ａを形成することが可能となる。凹み部２５の矢印で示す径は、例えば直径３０ｍｍである。保持面２４ａの研削が完了したら、ウェーハを保持テーブル２１で保持し、ウェーハに対して研削を施す。 On the other hand, when the grinding wheel 14 shown in FIG. 3 passes through the center C of the holding surface 24a, the grinding surface 14a of the grinding wheel 14 that has passed through the center C and the holding surface 24a are in a non-contact state. That is, when the grinding surface 14a of the grinding wheel 14 is not in contact with the holding surface 24a, as shown in FIG. 5, a gap is formed between the grinding surface 14a and the holding surface 24a, so that the center C of the holding surface 24a The diamond abrasive grains 16 that have not received the grinding load of the grinding surface 14a that has passed through the above are pushed out from the plurality of pores 17. As shown in FIG. 6, a small region (for example, the central grinding region P2 shown in FIG. 3) outside the center C of the holding surface 24a is ground by the diamond abrasive grains 16 extruded from the plurality of pores 17. , A flat recess 25 is formed in the center of the holding surface 24a. In this way, it is possible to form the holding surface 24a that can be used for a thick wafer without adjusting the inclination relationship between the grinding wheel 14 and the holding table 21. The diameter indicated by the arrow of the recess 25 is, for example, a diameter of 30 mm. When the grinding of the holding surface 24a is completed, the wafer is held by the holding table 21 and the wafer is ground.

以上のとおり、本発明に係る保持面の研削方法では、使用される研削砥石１４が、ビトリファイドボンド１５とダイヤモンド砥粒１６とを混合させ焼結させて固形化し研削面１４ａに気孔１７を有するビトリファイド砥石であり、研削面１４ａに隙間を備えず環状に形成され、保持テーブル２１を回転させ、保持面２４ａの半径領域である研削領域Ｐ１に研削面１４ａを接触させ保持面２４ａを研削するように構成したため、研削領域Ｐ１では、研削面１４ａの複数の気孔１７内にダイヤモンド砥粒１６を埋め込ませながら保持面２４ａを研削できるとともに、保持面２４ａの中心Ｃを通過して研削面１４ａと保持面２４ａとの間に隙間が生じると、研削面１４ａの気孔１７から押し出されたダイヤモンド砥粒１６で保持面２４ａの中央に平坦な凹み部２５を形成することができる。
保持面２４ａの中央に凹み部２５が形成された保持テーブル２１では、例えば厚みのあるウェーハを吸引保持する際、凹み部２５にならってウェーハの中央部分も吸引保持できるため、保持面２４ａの中央とウェーハの中央部分との間に隙間が生じることはなくなる。したがって、保持面２４ａでウェーハを隙間無く保持できるため、ウェーハの中央が過度に研削されるのを防ぐことができ、ウェーハを均等の厚さに研削することが可能となる。 As described above, in the method for grinding the holding surface according to the present invention, the grinding wheel 14 used is a vitrified grindstone having pores 17 on the grinding surface 14a, which is solidified by mixing and sintering the vitrified bond 15 and the diamond abrasive grains 16. It is a grindstone and is formed in an annular shape without a gap on the grinding surface 14a. The holding table 21 is rotated so that the grinding surface 14a is brought into contact with the grinding region P1 which is the radial region of the holding surface 24a to grind the holding surface 24a. Therefore, in the grinding region P1, the holding surface 24a can be ground while the diamond abrasive grains 16 are embedded in the plurality of pores 17 of the grinding surface 14a, and the grinding surface 14a and the holding surface pass through the center C of the holding surface 24a. When a gap is formed between the ground surface 14a and the ground surface 14a, the diamond abrasive grains 16 extruded from the pores 17 of the grinding surface 14a can form a flat recessed portion 25 in the center of the holding surface 24a.
In the holding table 21 in which the recessed portion 25 is formed in the center of the holding surface 24a, for example, when sucking and holding a thick wafer, the central portion of the wafer can be sucked and held in accordance with the recessed portion 25, so that the center of the holding surface 24a is held. There will be no gap between the wafer and the center of the wafer. Therefore, since the wafer can be held without a gap by the holding surface 24a, it is possible to prevent the center of the wafer from being excessively ground, and it is possible to grind the wafer to a uniform thickness.

１：研削装置
１０：研削手段 １１：スピンドル １２：マウント １３：研削ホイール
１４：研削砥石 １５：ビトリファイドボンド １６：ダイヤモンド砥粒
１７：気孔 １８：昇降手段
２０：保持手段 ２１：保持テーブル ２２：モータ ２３：枠体
２４：ポーラス部材 ２５：凹み部 1: Grinding device 10: Grinding means 11: Spindle 12: Mount 13: Grinding wheel 14: Grinding wheel 15: Vitrified bond 16: Diamond abrasive grains 17: Pore 18: Elevating means 20: Holding means 21: Holding table 22: Motor 23 : Frame body 24: Porous member 25: Recessed part

Claims (2)

環状に研削砥石を配設した研削ホイールの中心を軸に回転させる研削手段と、ウェーハを保持する保持面の中心を軸に保持テーブルを回転させる保持手段とを備えた研削装置を用いて、該保持面の中心を通過する該研削砥石で該保持面を研削する保持面の研削方法であって、
該研削砥石は、ビトリファイドボンドとダイヤモンド砥粒とを混合させ焼結させて固形化し研削面に気孔を有するビトリファイド砥石であり、該研削面に隙間を備えず環状に形成され、
該保持テーブルを回転させ、該保持面の半径領域に該研削面を接触させ、該半径領域の外周から中心に向かって該研削砥石を移動させているときに該気孔に該ダイヤモンド砥粒を進入させ、該保持面の中心を通過した該研削面の該気孔から該ダイヤモンド砥粒を押し出し該保持面の中央部分を研削して平坦な凹み部を形成し該保持面を研削する保持面の研削方法。 Using a grinding device provided with a grinding means for rotating the center of the grinding wheel in which the grinding wheels are arranged in an annular shape around the center of the grinding wheel and a holding means for rotating the holding table around the center of the holding surface for holding the wafer. A method for grinding a holding surface by grinding the holding surface with the grinding wheel that passes through the center of the holding surface.
The grinding wheel is a vitrified grindstone in which a vitrified bond and diamond abrasive grains are mixed and sintered to solidify and have pores on the grinding surface, and the grinding wheel is formed in an annular shape without a gap.
The diamond abrasive grains enter the pores when the holding table is rotated, the grinding surface is brought into contact with the radial region of the holding surface, and the grinding wheel is moved from the outer periphery of the radial region toward the center. Then, the diamond abrasive grains are extruded from the pores of the grinding surface that have passed through the center of the holding surface, and the central portion of the holding surface is ground to form a flat recessed portion, and the holding surface is ground. Method. 該ダイヤモンド砥粒は、粒度６００を用いた請求項１記載の保持面の研削方法。 The method for grinding a holding surface according to claim 1, wherein the diamond abrasive grains have a particle size of 600.
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