CN110315425B - 蓝宝石晶圆游离磨料研磨设备 - Google Patents
蓝宝石晶圆游离磨料研磨设备 Download PDFInfo
- Publication number
- CN110315425B CN110315425B CN201910620970.4A CN201910620970A CN110315425B CN 110315425 B CN110315425 B CN 110315425B CN 201910620970 A CN201910620970 A CN 201910620970A CN 110315425 B CN110315425 B CN 110315425B
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- Prior art keywords
- gear
- driving
- ring
- disc
- sapphire wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 41
- 239000010980 sapphire Substances 0.000 title claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 239000012530 fluid Substances 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 20
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005498 polishing Methods 0.000 description 14
- 239000002002 slurry Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910620970.4A CN110315425B (zh) | 2019-07-10 | 2019-07-10 | 蓝宝石晶圆游离磨料研磨设备 |
Applications Claiming Priority (1)
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CN201910620970.4A CN110315425B (zh) | 2019-07-10 | 2019-07-10 | 蓝宝石晶圆游离磨料研磨设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110315425A CN110315425A (zh) | 2019-10-11 |
CN110315425B true CN110315425B (zh) | 2020-08-28 |
Family
ID=68121833
Family Applications (1)
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CN201910620970.4A Active CN110315425B (zh) | 2019-07-10 | 2019-07-10 | 蓝宝石晶圆游离磨料研磨设备 |
Country Status (1)
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CN (1) | CN110315425B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117245520B (zh) * | 2023-11-17 | 2024-01-26 | 苏州博宏源机械制造有限公司 | 一种晶圆抛光研磨设备及工艺 |
CN118404494B (zh) * | 2024-06-27 | 2024-09-10 | 北京特思迪半导体设备有限公司 | 一种回转上片结构及晶圆加工系统 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101223006A (zh) * | 2005-07-19 | 2008-07-16 | 信越半导体股份有限公司 | 晶片的双面研磨方法 |
CN101249634A (zh) * | 2008-04-02 | 2008-08-27 | 万向硅峰电子股份有限公司 | 改善半导体单晶硅研磨硅片平行度的方法及其装置 |
CN201776703U (zh) * | 2010-04-21 | 2011-03-30 | 云南中科鑫圆晶体材料有限公司 | 可以修整抛光晶片平整度的抛光头 |
CN104858773A (zh) * | 2015-04-29 | 2015-08-26 | 盐城工学院 | 可调节晶片研磨平面度的修正盘和蓝宝石晶片研磨方法 |
CN106926113A (zh) * | 2017-04-22 | 2017-07-07 | 湖南磨王科技智造有限责任公司 | 一种高精度双面研磨抛光机 |
CN107214582A (zh) * | 2017-07-04 | 2017-09-29 | 希尔维斯特·本杰明 | 一种研磨齿轮盘及光学研磨抛光机 |
CN107756232A (zh) * | 2017-11-10 | 2018-03-06 | 北京鼎泰芯源科技发展有限公司 | 一种晶片研磨装置 |
CN207696312U (zh) * | 2017-10-07 | 2018-08-07 | 南安紫鲸铃工业设计有限公司 | 一种用于减少制造半导体器件时缺陷的晶片抛光系统 |
CN208215087U (zh) * | 2018-06-01 | 2018-12-11 | 锦州神工半导体股份有限公司 | 一种用于单晶硅筒外周研磨的卡具 |
CN110125731A (zh) * | 2018-02-08 | 2019-08-16 | 株式会社迪思科 | 保持面的磨削方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5914462A (ja) * | 1982-07-15 | 1984-01-25 | Toshiba Corp | 砥石摩耗補正装置 |
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2019
- 2019-07-10 CN CN201910620970.4A patent/CN110315425B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101223006A (zh) * | 2005-07-19 | 2008-07-16 | 信越半导体股份有限公司 | 晶片的双面研磨方法 |
CN101249634A (zh) * | 2008-04-02 | 2008-08-27 | 万向硅峰电子股份有限公司 | 改善半导体单晶硅研磨硅片平行度的方法及其装置 |
CN201776703U (zh) * | 2010-04-21 | 2011-03-30 | 云南中科鑫圆晶体材料有限公司 | 可以修整抛光晶片平整度的抛光头 |
CN104858773A (zh) * | 2015-04-29 | 2015-08-26 | 盐城工学院 | 可调节晶片研磨平面度的修正盘和蓝宝石晶片研磨方法 |
CN106926113A (zh) * | 2017-04-22 | 2017-07-07 | 湖南磨王科技智造有限责任公司 | 一种高精度双面研磨抛光机 |
CN107214582A (zh) * | 2017-07-04 | 2017-09-29 | 希尔维斯特·本杰明 | 一种研磨齿轮盘及光学研磨抛光机 |
CN207696312U (zh) * | 2017-10-07 | 2018-08-07 | 南安紫鲸铃工业设计有限公司 | 一种用于减少制造半导体器件时缺陷的晶片抛光系统 |
CN107756232A (zh) * | 2017-11-10 | 2018-03-06 | 北京鼎泰芯源科技发展有限公司 | 一种晶片研磨装置 |
CN110125731A (zh) * | 2018-02-08 | 2019-08-16 | 株式会社迪思科 | 保持面的磨削方法 |
CN208215087U (zh) * | 2018-06-01 | 2018-12-11 | 锦州神工半导体股份有限公司 | 一种用于单晶硅筒外周研磨的卡具 |
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CN110315425A (zh) | 2019-10-11 |
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TR01 | Transfer of patent right |
Effective date of registration: 20240108 Address after: No.58, Chengnan Road, Nanming street, Xinchang County, Shaoxing City, Zhejiang Province Patentee after: XINCHANG LIANHANG MACHINERY Co.,Ltd. Address before: 324000 North China Road No. 78, Quzhou, Quzhou, Zhejiang Patentee before: QUZHOU University |
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Effective date of registration: 20240906 Address after: No. 36, Weier Second Road, Wanchun Street, Wuhu Economic and Technological Development Zone, Wuhu City, Anhui Province 241000 Patentee after: Wuhu Zhongpu Intelligent Equipment Co.,Ltd. Country or region after: China Address before: No.58, Chengnan Road, Nanming street, Xinchang County, Shaoxing City, Zhejiang Province Patentee before: XINCHANG LIANHANG MACHINERY Co.,Ltd. Country or region before: China |