JP7043346B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP7043346B2
JP7043346B2 JP2018096174A JP2018096174A JP7043346B2 JP 7043346 B2 JP7043346 B2 JP 7043346B2 JP 2018096174 A JP2018096174 A JP 2018096174A JP 2018096174 A JP2018096174 A JP 2018096174A JP 7043346 B2 JP7043346 B2 JP 7043346B2
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JP
Japan
Prior art keywords
holding
cutting
jig
face
cutting blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018096174A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019198944A (ja
Inventor
欣浩 楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018096174A priority Critical patent/JP7043346B2/ja
Priority to KR1020190045283A priority patent/KR20190132203A/ko
Priority to TW108116728A priority patent/TWI797333B/zh
Priority to CN201910426869.5A priority patent/CN110497270B/zh
Publication of JP2019198944A publication Critical patent/JP2019198944A/ja
Application granted granted Critical
Publication of JP7043346B2 publication Critical patent/JP7043346B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/02Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage
    • B23D45/021Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042Devices for removing chips
    • B23Q11/0046Devices for removing chips by sucking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0092Grinding attachments for lathes or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/068Table-like supports for panels, sheets or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00Means for securing grinding wheels on rotary arbors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/01Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor for combined grinding of surfaces of revolution and of adjacent plane surfaces on work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Dicing (AREA)
  • Confectionery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2018096174A 2018-05-18 2018-05-18 切削装置 Active JP7043346B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018096174A JP7043346B2 (ja) 2018-05-18 2018-05-18 切削装置
KR1020190045283A KR20190132203A (ko) 2018-05-18 2019-04-18 절삭 장치
TW108116728A TWI797333B (zh) 2018-05-18 2019-05-15 切割裝置
CN201910426869.5A CN110497270B (zh) 2018-05-18 2019-05-16 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018096174A JP7043346B2 (ja) 2018-05-18 2018-05-18 切削装置

Publications (2)

Publication Number Publication Date
JP2019198944A JP2019198944A (ja) 2019-11-21
JP7043346B2 true JP7043346B2 (ja) 2022-03-29

Family

ID=68585726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018096174A Active JP7043346B2 (ja) 2018-05-18 2018-05-18 切削装置

Country Status (4)

Country Link
JP (1) JP7043346B2 (zh)
KR (1) KR20190132203A (zh)
CN (1) CN110497270B (zh)
TW (1) TWI797333B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7361595B2 (ja) * 2019-12-19 2023-10-16 株式会社ディスコ 保持テーブル
CN113017241B (zh) * 2021-03-17 2023-08-25 安徽三和刷业股份有限公司 一种刷板自动分切打磨一体化装置
CN113909579A (zh) * 2021-11-04 2022-01-11 扬州市金马机电制造有限公司 一种具有工件固定结构的切割机

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050268763A1 (en) 2001-08-24 2005-12-08 Peng Neo C Method and apparatus for cutting semiconductor wafers
JP2009297855A (ja) 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd フランジの端面修正方法
JP2011011299A (ja) 2009-07-02 2011-01-20 Disco Abrasive Syst Ltd マウントフランジの端面修正方法
JP2011255458A (ja) 2010-06-09 2011-12-22 Disco Corp 切削加工装置
JP2012223848A (ja) 2011-04-19 2012-11-15 Disco Corp フランジの端面修正方法
JP2013198944A (ja) 2012-03-23 2013-10-03 Toshiba Corp ダイシング装置及びダイシング方法
JP2016162973A (ja) 2015-03-04 2016-09-05 Towa株式会社 製造装置及び製造方法
JP2017152442A (ja) 2016-02-22 2017-08-31 株式会社ディスコ 加工方法
JP2018037511A (ja) 2016-08-31 2018-03-08 株式会社ディスコ 基板の分割方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350908B2 (ja) * 2009-06-24 2013-11-27 株式会社ディスコ ドレスボード保持テーブルおよび切削装置
JP5285672B2 (ja) * 2010-09-07 2013-09-11 三菱重工業株式会社 歯車研削盤
JP6087565B2 (ja) * 2012-10-03 2017-03-01 株式会社ディスコ 研削装置および研削方法
JP6527034B2 (ja) * 2015-06-29 2019-06-05 株式会社ディスコ 端面接触確認器具
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050268763A1 (en) 2001-08-24 2005-12-08 Peng Neo C Method and apparatus for cutting semiconductor wafers
JP2009297855A (ja) 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd フランジの端面修正方法
JP2011011299A (ja) 2009-07-02 2011-01-20 Disco Abrasive Syst Ltd マウントフランジの端面修正方法
JP2011255458A (ja) 2010-06-09 2011-12-22 Disco Corp 切削加工装置
JP2012223848A (ja) 2011-04-19 2012-11-15 Disco Corp フランジの端面修正方法
JP2013198944A (ja) 2012-03-23 2013-10-03 Toshiba Corp ダイシング装置及びダイシング方法
JP2016162973A (ja) 2015-03-04 2016-09-05 Towa株式会社 製造装置及び製造方法
JP2017152442A (ja) 2016-02-22 2017-08-31 株式会社ディスコ 加工方法
JP2018037511A (ja) 2016-08-31 2018-03-08 株式会社ディスコ 基板の分割方法

Also Published As

Publication number Publication date
CN110497270B (zh) 2023-04-25
TWI797333B (zh) 2023-04-01
TW202003149A (zh) 2020-01-16
CN110497270A (zh) 2019-11-26
KR20190132203A (ko) 2019-11-27
JP2019198944A (ja) 2019-11-21

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