JP7033992B2 - セラミック板および電子装置 - Google Patents
セラミック板および電子装置 Download PDFInfo
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Description
る熱伝導率は、非定常法による各種の測定装置で測定することができる。
材の厚みは、例えば約100μm程度に設定される。また、例えば樹脂接着剤(熱伝導率が
約20~23W/m・K程度のもの)を接合材として用いたときに、その接合材の厚みが約30μm以下になるようにすればよい。
素結晶21の最大粒径よりも小さく、希土類シリケート結晶22の最大粒径も、窒化ケイ素結晶21の最大粒径よりも小さい。また、この実施形態の電子装置30は、前述したように、上記構成のセラミック板3と、セラミック板3に熱的に接続された電子部品4とを含んでいる。
を構成するセラミック板3における熱抵抗を効果的に低減することができる。したがって、放熱性が高い電子装置30の製作が容易なセラミック板3を提供することができる。また、放熱性が高い電子装置30を提供することができる。
に構成している部分である。すなわち、複数の窒化ケイ素結晶11のうち隣り合うもの同士が互いに焼結して、セラミック板3における一定の機械的強度が確保されている。また、互いに隣り合う窒化ケイ素結晶11の間で順次熱が伝導され、セラミック板1としての基本的な熱伝導が行なわれる。
としての熱伝導率および機械的な強度の確保が容易になっている。また、窒化ケイ素結晶11の含有率が97質量%以下であることで、焼結助材としてのシリケート相2の効果的な分散が容易になり、焼結性の向上に有利である。
に、シリケート相2を介して効果的に熱的および機械的に接合される。
位置にしている場合には、希土類シリケート相22による窒化ケイ素結晶11間の焼結性向上の効果を得る上で有利である。また、複数の粒界12において、窒化ケイ素結晶11間の熱伝導性確保の効果をマグネシウムシリケート結晶21によって有効に得ることができる。
また、シリケーと相2がErMgSi2O5NおよびMo5Si3以外のもの(第3成分)を含んでいてもよい。第3成分としては、例えばケイ酸系ガラスが挙げられる。このガラスは、エルビウムを含有するガラスであってもよい。
の結晶の大きさは、図5に示す例のように断面を観察して、個々の結晶の大きさを測定する方法で知ることができる。
続は、例えば、樹脂材料等の粘着材を介して行なうことができる。また、セラミック板3の下面に凸部分(図示せず)を設けて、凸部分のアンカー効果によって電子装置3と放熱体5との接続強度を高めるようにしてもよい。
11・・・窒化ケイ素結晶
12・・・粒界
2・・・シリケート相
21・・・マグネシウムシリケート結晶
21a・・・最小粒径のマグネシウムシリケート結晶
22・・・希土類シリケート結晶
22a・・・最小粒径の希土類シリケート結晶
23・・・ErMgSi2O5N結晶
24・・・Mo5Si3結晶
3・・・セラミック板
4・・・電子部品
5・・・放熱体
6・・・リード端子
6A・・・リード端子(リードフレーム)
7・・・ボンディングワイヤ
8・・・モールド樹脂
30・・・電子装置
Claims (7)
- 複数の窒化ケイ素結晶および該窒化ケイ素結晶間の粒界を含む窒化ケイ素結晶相と前記窒化ケイ素結晶よりも最大粒径が小さいマグネシウムシリケート結晶および希土類シリケート結晶を含んでいるとともに前記粒界に位置しているシリケート相とを備え、
前記希土類シリケート結晶が、最小粒径が前記マグネシウムシリケート結晶よりも小さいエルビウムシリケート結晶およびイットリウムシリケート結晶の少なくとも一方を含んでいるセラミック板。 - 前記シリケート相の含有率が3~20質量%である請求項1記載のセラミック板。
- 前記シリケート相における前記マグネシウムシリケート結晶の含有率が20~90質量%である請求項1または2記載のセラミック板。
- 前記マグネシウムシリケート結晶と前記希土類シリケート結晶とが、前記粒界のうち互いに異なる部分に位置している請求項1~3のいずれか1項記載のセラミック板。
- 複数の窒化ケイ素結晶および該窒化ケイ素結晶間の粒界を含む窒化ケイ素結晶相と前記窒化ケイ素結晶よりも最大粒径が小さいマグネシウムシリケート結晶および希土類シリケート結晶を含んでいるとともに前記粒界に位置しているシリケート相とを備え、
前記シリケート相がErMgSi 2 O 5 N結晶およびMo 5 Si 3 結晶を含んでいるセラミック板。 - 前記シリケート相の含有率が3~20質量%である請求項5記載のセラミック板。
- 請求項1~請求項6のいずれか1項記載のセラミック板と、
該セラミック板に熱的に接続された電子部品とを備える電子装置。
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JP2017085516 | 2017-04-24 | ||
JP2017085516 | 2017-04-24 |
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JP2018184337A JP2018184337A (ja) | 2018-11-22 |
JP7033992B2 true JP7033992B2 (ja) | 2022-03-11 |
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US (1) | US10462899B2 (ja) |
EP (1) | EP3395780B1 (ja) |
JP (1) | JP7033992B2 (ja) |
KR (1) | KR20180119094A (ja) |
CN (1) | CN108727035A (ja) |
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JP2001181053A (ja) | 1999-12-22 | 2001-07-03 | Sumitomo Electric Ind Ltd | 窒化ケイ素焼結体及びその製造方法 |
JP2005082405A (ja) | 2003-09-04 | 2005-03-31 | Isuzu Motors Ltd | 窒化ケイ素複合材及びその製造方法 |
JP2010235335A (ja) | 2009-03-30 | 2010-10-21 | Kyocera Corp | セラミック焼結体、放熱基体および電子装置 |
WO2011111746A1 (ja) | 2010-03-09 | 2011-09-15 | 京セラ株式会社 | セラミック焼結体およびこれを用いた回路基板,電子装置ならびに熱電変換モジュール |
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JPS60145965A (ja) | 1984-01-06 | 1985-08-01 | 宇部興産株式会社 | 窒化珪素質焼結体の製法 |
DE19859119B4 (de) * | 1997-12-22 | 2010-06-02 | Kyocera Corp. | Leiterplatte mit sehr guter Wärmeabstrahlung, Verfahren zu ihrer Herstellung und ihre Verwendung |
JP3561145B2 (ja) * | 1998-04-27 | 2004-09-02 | 京セラ株式会社 | 窒化珪素質放熱部材及びその製造方法 |
JP4346151B2 (ja) | 1998-05-12 | 2009-10-21 | 株式会社東芝 | 高熱伝導性窒化けい素焼結体およびそれを用いた回路基板並びに集積回路 |
EP2107854B1 (en) | 2006-05-18 | 2012-04-11 | NGK Spark Plug Co., Ltd. | Ceramic heater and glow plug |
JP4996283B2 (ja) | 2006-05-18 | 2012-08-08 | 日本特殊陶業株式会社 | セラミックヒータ及びグロープラグ |
JP5477289B2 (ja) * | 2008-07-03 | 2014-04-23 | 日立金属株式会社 | 窒化珪素質焼結体の製造方法 |
JP6147730B2 (ja) * | 2011-04-27 | 2017-06-14 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | 細胞を溶解する方法 |
CN104098336A (zh) * | 2013-04-15 | 2014-10-15 | 中国科学院上海硅酸盐研究所 | 一种制备高热导率、高强度氮化硅陶瓷的方法 |
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JP2001181053A (ja) | 1999-12-22 | 2001-07-03 | Sumitomo Electric Ind Ltd | 窒化ケイ素焼結体及びその製造方法 |
JP2005082405A (ja) | 2003-09-04 | 2005-03-31 | Isuzu Motors Ltd | 窒化ケイ素複合材及びその製造方法 |
JP2010235335A (ja) | 2009-03-30 | 2010-10-21 | Kyocera Corp | セラミック焼結体、放熱基体および電子装置 |
WO2011111746A1 (ja) | 2010-03-09 | 2011-09-15 | 京セラ株式会社 | セラミック焼結体およびこれを用いた回路基板,電子装置ならびに熱電変換モジュール |
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EP3395780A1 (en) | 2018-10-31 |
KR20180119094A (ko) | 2018-11-01 |
US10462899B2 (en) | 2019-10-29 |
EP3395780B1 (en) | 2021-05-12 |
US20180310402A1 (en) | 2018-10-25 |
JP2018184337A (ja) | 2018-11-22 |
CN108727035A (zh) | 2018-11-02 |
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