JP7028226B2 - 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 - Google Patents
無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 Download PDFInfo
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- JP7028226B2 JP7028226B2 JP2019158074A JP2019158074A JP7028226B2 JP 7028226 B2 JP7028226 B2 JP 7028226B2 JP 2019158074 A JP2019158074 A JP 2019158074A JP 2019158074 A JP2019158074 A JP 2019158074A JP 7028226 B2 JP7028226 B2 JP 7028226B2
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- Prior art keywords
- melting point
- low melting
- point glass
- glass
- lead
- Prior art date
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- 239000011521 glass Substances 0.000 title claims description 285
- 238000002844 melting Methods 0.000 title claims description 136
- 230000008018 melting Effects 0.000 title claims description 134
- 239000000203 mixture Substances 0.000 title claims description 114
- 239000002131 composite material Substances 0.000 title claims description 70
- 239000002923 metal particle Substances 0.000 claims description 33
- 239000002245 particle Substances 0.000 claims description 30
- 239000000945 filler Substances 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 10
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 229910019142 PO4 Inorganic materials 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 6
- 239000010452 phosphate Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 229910021193 La 2 O 3 Inorganic materials 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910001923 silver oxide Inorganic materials 0.000 claims description 5
- 229910052714 tellurium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910020203 CeO Inorganic materials 0.000 claims description 3
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 claims description 3
- 230000014509 gene expression Effects 0.000 claims description 3
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims description 3
- 229910001947 lithium oxide Inorganic materials 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 229910001935 vanadium oxide Inorganic materials 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 239000013034 phenoxy resin Substances 0.000 claims description 2
- 229920006287 phenoxy resin Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 229910006501 ZrSiO Inorganic materials 0.000 claims 1
- OJLGWNFZMTVNCX-UHFFFAOYSA-N dioxido(dioxo)tungsten;zirconium(4+) Chemical compound [Zr+4].[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O OJLGWNFZMTVNCX-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 44
- 239000000758 substrate Substances 0.000 description 42
- 238000002425 crystallisation Methods 0.000 description 34
- 230000008025 crystallization Effects 0.000 description 34
- 238000004455 differential thermal analysis Methods 0.000 description 18
- 239000000843 powder Substances 0.000 description 18
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- 239000000463 material Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 14
- 239000010410 layer Substances 0.000 description 14
- 239000005361 soda-lime glass Substances 0.000 description 14
- 238000010304 firing Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000011734 sodium Substances 0.000 description 11
- 239000013078 crystal Substances 0.000 description 10
- 239000011777 magnesium Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 230000007704 transition Effects 0.000 description 10
- 238000009413 insulation Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 6
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- 239000000047 product Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
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- 239000004065 semiconductor Substances 0.000 description 5
- 239000007858 starting material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
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- 239000002244 precipitate Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004017 vitrification Methods 0.000 description 3
- 229910003870 O—Li Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
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- 239000000155 melt Substances 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- -1 tellurium ion Chemical class 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
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- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
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- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
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- 238000001739 density measurement Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- VFWRGKJLLYDFBY-UHFFFAOYSA-N silver;hydrate Chemical compound O.[Ag].[Ag] VFWRGKJLLYDFBY-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019158074A JP7028226B2 (ja) | 2019-08-30 | 2019-08-30 | 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 |
| PCT/JP2020/003922 WO2021038908A1 (fr) | 2019-08-30 | 2020-02-03 | Composition de verre à bas point de fusion sans plomb, matériau composite de verre à bas point de fusion, pâte de verre et produit appliqué |
| JP2021198336A JP7375804B2 (ja) | 2019-08-30 | 2021-12-07 | 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019158074A JP7028226B2 (ja) | 2019-08-30 | 2019-08-30 | 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021198336A Division JP7375804B2 (ja) | 2019-08-30 | 2021-12-07 | 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021035896A JP2021035896A (ja) | 2021-03-04 |
| JP7028226B2 true JP7028226B2 (ja) | 2022-03-02 |
Family
ID=74684409
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019158074A Active JP7028226B2 (ja) | 2019-08-30 | 2019-08-30 | 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 |
| JP2021198336A Active JP7375804B2 (ja) | 2019-08-30 | 2021-12-07 | 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021198336A Active JP7375804B2 (ja) | 2019-08-30 | 2021-12-07 | 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品 |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP7028226B2 (fr) |
| WO (1) | WO2021038908A1 (fr) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010184852A (ja) | 2009-01-16 | 2010-08-26 | Hitachi Powdered Metals Co Ltd | 低融点ガラス組成物、それを用いた低温封着材料及び電子部品 |
| JP2013032255A (ja) | 2011-07-04 | 2013-02-14 | Hitachi Ltd | ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品 |
| WO2014102915A1 (fr) | 2012-12-26 | 2014-07-03 | 株式会社 日立製作所 | Matériau composite verre-résine à bas point de fusion et appareil électronique/électrique utilisant celui-ci |
| JP2015230995A (ja) | 2014-06-05 | 2015-12-21 | 株式会社ノリタケカンパニーリミテド | 太陽電池受光面電極用ペースト、その製造方法、および太陽電池セル |
| JP2016050136A (ja) | 2014-08-29 | 2016-04-11 | 日立化成株式会社 | 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 |
| JP2016135733A (ja) | 2015-01-15 | 2016-07-28 | セントラル硝子株式会社 | 無鉛ガラス及び封着材料 |
| WO2017126378A1 (fr) | 2016-01-18 | 2017-07-27 | 株式会社日立製作所 | Composition de verre sans plomb, matériau composite en verre, pâte de verre, structure d'étanchéité, composant électrique/électronique et composant revêtu |
| JP2018058709A (ja) | 2016-10-03 | 2018-04-12 | 日立化成株式会社 | 真空断熱部材、それに用いる封止材料、及び真空断熱部材の製造方法 |
| JP2018109073A (ja) | 2015-03-31 | 2018-07-12 | 株式会社日立製作所 | 複合材組成物、及びそれを用いたペースト剤 |
| CN108298822A (zh) | 2018-04-08 | 2018-07-20 | 武汉理工大学 | 一种真空玻璃封接用低熔点玻璃粉及其阳极键合增强封装方法 |
| JP2019094250A (ja) | 2017-11-28 | 2019-06-20 | 日立化成株式会社 | 封止材料及びこれを用いた複層ガラスパネル |
| JP2019123637A (ja) | 2018-01-16 | 2019-07-25 | 日立化成株式会社 | 接合材 |
| JP2019206458A (ja) | 2018-05-30 | 2019-12-05 | 日立化成株式会社 | 無鉛ガラス組成物ならびにそれを含むガラス複合材料、ガラスペーストおよび封止構造体 |
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| JPH08259262A (ja) * | 1995-03-20 | 1996-10-08 | Nippon Electric Glass Co Ltd | 低融点封着用組成物 |
| JP5041323B2 (ja) | 2005-05-09 | 2012-10-03 | 日本電気硝子株式会社 | 粉末材料及びペースト材料 |
| JP2019089689A (ja) | 2017-11-14 | 2019-06-13 | 日本電気硝子株式会社 | ガラス組成物及び封着材料 |
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| JP2010184852A (ja) | 2009-01-16 | 2010-08-26 | Hitachi Powdered Metals Co Ltd | 低融点ガラス組成物、それを用いた低温封着材料及び電子部品 |
| JP2013032255A (ja) | 2011-07-04 | 2013-02-14 | Hitachi Ltd | ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品 |
| WO2014102915A1 (fr) | 2012-12-26 | 2014-07-03 | 株式会社 日立製作所 | Matériau composite verre-résine à bas point de fusion et appareil électronique/électrique utilisant celui-ci |
| JP2015230995A (ja) | 2014-06-05 | 2015-12-21 | 株式会社ノリタケカンパニーリミテド | 太陽電池受光面電極用ペースト、その製造方法、および太陽電池セル |
| JP2016050136A (ja) | 2014-08-29 | 2016-04-11 | 日立化成株式会社 | 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 |
| JP2016135733A (ja) | 2015-01-15 | 2016-07-28 | セントラル硝子株式会社 | 無鉛ガラス及び封着材料 |
| JP2018109073A (ja) | 2015-03-31 | 2018-07-12 | 株式会社日立製作所 | 複合材組成物、及びそれを用いたペースト剤 |
| WO2017126378A1 (fr) | 2016-01-18 | 2017-07-27 | 株式会社日立製作所 | Composition de verre sans plomb, matériau composite en verre, pâte de verre, structure d'étanchéité, composant électrique/électronique et composant revêtu |
| JP2018058709A (ja) | 2016-10-03 | 2018-04-12 | 日立化成株式会社 | 真空断熱部材、それに用いる封止材料、及び真空断熱部材の製造方法 |
| JP2019094250A (ja) | 2017-11-28 | 2019-06-20 | 日立化成株式会社 | 封止材料及びこれを用いた複層ガラスパネル |
| JP2019123637A (ja) | 2018-01-16 | 2019-07-25 | 日立化成株式会社 | 接合材 |
| CN108298822A (zh) | 2018-04-08 | 2018-07-20 | 武汉理工大学 | 一种真空玻璃封接用低熔点玻璃粉及其阳极键合增强封装方法 |
| JP2019206458A (ja) | 2018-05-30 | 2019-12-05 | 日立化成株式会社 | 無鉛ガラス組成物ならびにそれを含むガラス複合材料、ガラスペーストおよび封止構造体 |
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| JP2022022329A (ja) | 2022-02-03 |
| JP7375804B2 (ja) | 2023-11-08 |
| WO2021038908A1 (fr) | 2021-03-04 |
| JP2021035896A (ja) | 2021-03-04 |
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