JP6995815B2 - 積層装置およびそれを用いた積層方法 - Google Patents

積層装置およびそれを用いた積層方法 Download PDF

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JP6995815B2
JP6995815B2 JP2019187666A JP2019187666A JP6995815B2 JP 6995815 B2 JP6995815 B2 JP 6995815B2 JP 2019187666 A JP2019187666 A JP 2019187666A JP 2019187666 A JP2019187666 A JP 2019187666A JP 6995815 B2 JP6995815 B2 JP 6995815B2
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press plate
central portion
press
heating
laminating
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JP2021062522A5 (enExample
JP2021062522A (ja
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和敏 岩田
善明 本間
健 山口
太平 松本
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Nippon Mining Holdings Inc
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Nikko Materials Co Ltd
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11485124B1 (en) 2021-07-29 2022-11-01 Nikko-Materials Co., Ltd. Laminating apparatus and laminating method using same
JP2023095447A (ja) * 2021-12-24 2023-07-06 株式会社日本製鋼所 積層装置および積層方法
JP2023095448A (ja) * 2021-12-24 2023-07-06 株式会社日本製鋼所 積層装置および積層方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995012966A1 (de) 1993-11-03 1995-05-11 Robert Bürkle Gmbh & Co. Verfahren zum dimensionsgenauen laminieren von mehrlagenleiterplatten und vorrichtung hierzu
JP2003217799A (ja) 2002-01-25 2003-07-31 Nippon Dennetsu Co Ltd 加熱体およびその製造方法
WO2016199687A1 (ja) 2015-06-08 2016-12-15 ニッコー・マテリアルズ株式会社 積層装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262740A (ja) * 1985-09-14 1987-03-19 Meiki Co Ltd ホツトプレス装置
JPS62234695A (ja) * 1986-04-02 1987-10-14 Meiki Co Ltd 電熱型ホツトプレス装置
JPH0193313A (ja) * 1987-10-06 1989-04-12 Matsushita Electric Works Ltd 積層板の製造方法
JPH04182100A (ja) * 1990-11-16 1992-06-29 Kitagawa Elaborate Mach Co Ltd ホットプレス装置に於ける熱板の温度制御構造
JPH0521956A (ja) * 1991-07-11 1993-01-29 Mitsubishi Electric Corp 多層プリント配線板の製造方法
JPH05121876A (ja) * 1991-10-29 1993-05-18 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
JP3217117B2 (ja) * 1992-04-20 2001-10-09 大日本印刷株式会社 真空プレス積層成形装置及び方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995012966A1 (de) 1993-11-03 1995-05-11 Robert Bürkle Gmbh & Co. Verfahren zum dimensionsgenauen laminieren von mehrlagenleiterplatten und vorrichtung hierzu
JP2003217799A (ja) 2002-01-25 2003-07-31 Nippon Dennetsu Co Ltd 加熱体およびその製造方法
WO2016199687A1 (ja) 2015-06-08 2016-12-15 ニッコー・マテリアルズ株式会社 積層装置

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