JP6990038B2 - 基板の離脱方法および基板の離脱装置 - Google Patents

基板の離脱方法および基板の離脱装置 Download PDF

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JP6990038B2
JP6990038B2 JP2017087111A JP2017087111A JP6990038B2 JP 6990038 B2 JP6990038 B2 JP 6990038B2 JP 2017087111 A JP2017087111 A JP 2017087111A JP 2017087111 A JP2017087111 A JP 2017087111A JP 6990038 B2 JP6990038 B2 JP 6990038B2
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substrate
wafer
holding table
holding
restraining member
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Japanese (ja)
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JP2018186194A (ja
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聡洋 村山
伸一郎 森
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2017087111A priority Critical patent/JP6990038B2/ja
Priority to TW107106733A priority patent/TW201838898A/zh
Priority to KR1020180035718A priority patent/KR102491550B1/ko
Priority to CN201810291920.1A priority patent/CN108807220A/zh
Publication of JP2018186194A publication Critical patent/JP2018186194A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017087111A 2017-04-26 2017-04-26 基板の離脱方法および基板の離脱装置 Active JP6990038B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017087111A JP6990038B2 (ja) 2017-04-26 2017-04-26 基板の離脱方法および基板の離脱装置
TW107106733A TW201838898A (zh) 2017-04-26 2018-03-01 基板的脫離方法及基板的脫離裝置
KR1020180035718A KR102491550B1 (ko) 2017-04-26 2018-03-28 기판의 이탈 방법 및 기판의 이탈 장치
CN201810291920.1A CN108807220A (zh) 2017-04-26 2018-04-03 基板的脱离方法和基板的脱离装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017087111A JP6990038B2 (ja) 2017-04-26 2017-04-26 基板の離脱方法および基板の離脱装置

Publications (2)

Publication Number Publication Date
JP2018186194A JP2018186194A (ja) 2018-11-22
JP6990038B2 true JP6990038B2 (ja) 2022-01-12

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JP2017087111A Active JP6990038B2 (ja) 2017-04-26 2017-04-26 基板の離脱方法および基板の離脱装置

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JP (1) JP6990038B2 (zh)
KR (1) KR102491550B1 (zh)
CN (1) CN108807220A (zh)
TW (1) TW201838898A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110024102B (zh) 2019-02-26 2020-10-30 长江存储科技有限责任公司 用于在晶圆表面贴黏胶膜的方法和装置
CN110228003B (zh) * 2019-05-23 2021-08-10 南京驭逡通信科技有限公司 基于双位定位原理的半导体晶片机械抛光加工装置
JP7402672B2 (ja) * 2019-12-20 2023-12-21 キヤノン株式会社 保持装置、リソグラフィ装置、および物品製造方法
JP7485523B2 (ja) * 2020-03-13 2024-05-16 株式会社東京精密 チャックテーブル

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148415A (ja) 1999-11-22 2001-05-29 Sony Corp 吸着ユニット
JP2003234392A (ja) 2001-12-03 2003-08-22 Nitto Denko Corp 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
JP2004114234A (ja) 2002-09-26 2004-04-15 Hitachi Via Mechanics Ltd 薄板ワークの固定装置および固定方法
JP2011199157A (ja) 2010-03-23 2011-10-06 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置
JP2016171292A (ja) 2015-03-16 2016-09-23 株式会社ディスコ 減圧処理装置
JP2017011076A (ja) 2015-06-19 2017-01-12 リンテック株式会社 保持装置および離間方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4090416B2 (ja) 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148415A (ja) 1999-11-22 2001-05-29 Sony Corp 吸着ユニット
JP2003234392A (ja) 2001-12-03 2003-08-22 Nitto Denko Corp 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
JP2004114234A (ja) 2002-09-26 2004-04-15 Hitachi Via Mechanics Ltd 薄板ワークの固定装置および固定方法
JP2011199157A (ja) 2010-03-23 2011-10-06 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置
JP2016171292A (ja) 2015-03-16 2016-09-23 株式会社ディスコ 減圧処理装置
JP2017011076A (ja) 2015-06-19 2017-01-12 リンテック株式会社 保持装置および離間方法

Also Published As

Publication number Publication date
KR20180120079A (ko) 2018-11-05
KR102491550B1 (ko) 2023-01-20
CN108807220A (zh) 2018-11-13
JP2018186194A (ja) 2018-11-22
TW201838898A (zh) 2018-11-01

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