JP6989493B2 - 誘電体基板を加工するための方法及び組成物 - Google Patents

誘電体基板を加工するための方法及び組成物 Download PDF

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JP6989493B2
JP6989493B2 JP2018511737A JP2018511737A JP6989493B2 JP 6989493 B2 JP6989493 B2 JP 6989493B2 JP 2018511737 A JP2018511737 A JP 2018511737A JP 2018511737 A JP2018511737 A JP 2018511737A JP 6989493 B2 JP6989493 B2 JP 6989493B2
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particles
weight percent
ppm
composition
polishing composition
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JP2018532828A5 (enExample
JP2018532828A (ja
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チー ツイ
ベト ラム
グランビーン スティーブン
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シーエムシー マテリアルズ，インコーポレイティド
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H10P52/402—
    • H10P52/403—
    • H10P95/062—

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018511737A 2015-09-03 2016-08-31 誘電体基板を加工するための方法及び組成物 Active JP6989493B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562213955P 2015-09-03 2015-09-03
US62/213,955 2015-09-03
PCT/US2016/049563 WO2017040571A1 (en) 2015-09-03 2016-08-31 Methods and compositions for processing dielectric substrate

Publications (3)

Publication Number Publication Date
JP2018532828A JP2018532828A (ja) 2018-11-08
JP2018532828A5 JP2018532828A5 (enExample) 2019-09-19
JP6989493B2 true JP6989493B2 (ja) 2022-01-05

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JP2018511737A Active JP6989493B2 (ja) 2015-09-03 2016-08-31 誘電体基板を加工するための方法及び組成物

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US (1) US20170066944A1 (enExample)
EP (1) EP3344716A4 (enExample)
JP (1) JP6989493B2 (enExample)
KR (1) KR102670778B1 (enExample)
CN (1) CN108026412B (enExample)
TW (1) TWI605114B (enExample)
WO (1) WO2017040571A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10619075B2 (en) 2015-07-13 2020-04-14 Cabot Microelectronics Corporation Self-stopping polishing composition and method for bulk oxide planarization
JP6646062B2 (ja) * 2015-11-10 2020-02-14 信越化学工業株式会社 合成石英ガラス基板用研磨剤及びその製造方法、並びに合成石英ガラス基板の研磨方法
TWI663231B (zh) * 2017-04-17 2019-06-21 Cabot Microelectronics Corporation 自停止性拋光組合物及用於大塊氧化物平坦化之方法
KR102628802B1 (ko) * 2018-11-15 2024-01-24 엔테그리스, 아이엔씨. 질화규소 에칭 조성물 및 방법
KR102814738B1 (ko) * 2019-08-06 2025-05-30 삼성디스플레이 주식회사 연마 슬러리, 이를 이용한 표시 장치의 제조방법 및 표시 장치
CN113004798B (zh) * 2019-12-19 2024-04-12 安集微电子（上海）有限公司 一种化学机械抛光液
KR20210079573A (ko) * 2019-12-20 2021-06-30 주식회사 케이씨텍 유기막 연마용 슬러리 조성물
JP7489250B2 (ja) * 2020-07-15 2024-05-23 花王株式会社 エッチング液
JPWO2022065022A1 (enExample) * 2020-09-24 2022-03-31
CN114621684A (zh) * 2020-12-11 2022-06-14 安集微电子（上海）有限公司 一种化学机械抛光液及其使用方法
CN114621683A (zh) * 2020-12-11 2022-06-14 安集微电子（上海）有限公司 一种化学机械抛光液及其使用方法
CN117120563A (zh) * 2020-12-21 2023-11-24 Cmc材料有限责任公司 用于高形貌选择性的自停止性抛光组合物与方法
US12199091B2 (en) * 2021-05-13 2025-01-14 Texas Instruments Incorporated Shallow trench isolation processing with local oxidation of silicon
WO2022240842A1 (en) * 2021-05-13 2022-11-17 Araca, Inc. Silicon carbide (sic) wafer polishing with slurry formulation and process
KR20240051190A (ko) * 2021-08-25 2024-04-19 씨엠씨 머티리얼즈 엘엘씨 음이온성 연마제를 포함하는 cmp 조성물
CN115160933B (zh) * 2022-07-27 2023-11-28 河北工业大学 一种用于钴互连集成电路钴cmp的碱性抛光液及其制备方法
TWI873734B (zh) * 2022-07-29 2025-02-21 美商聖高拜陶器塑膠公司 用於進行材料移除操作之組成物及方法
KR20240062236A (ko) * 2022-10-28 2024-05-09 솔브레인 주식회사 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
US20250277134A1 (en) * 2024-03-04 2025-09-04 Cmc Materials Llc Silane modification of ceria nanoparticles in colloidally stable solutions
WO2025188728A1 (en) * 2024-03-04 2025-09-12 Entegris, Inc. Silane modification of ceria nanoparticles in colloidally stable solutions

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030176151A1 (en) * 2002-02-12 2003-09-18 Applied Materials, Inc. STI polish enhancement using fixed abrasives with amino acid additives
US7071105B2 (en) * 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
US20050279733A1 (en) * 2004-06-18 2005-12-22 Cabot Microelectronics Corporation CMP composition for improved oxide removal rate
US7955520B2 (en) * 2007-11-27 2011-06-07 Cabot Microelectronics Corporation Copper-passivating CMP compositions and methods
US8247327B2 (en) * 2008-07-30 2012-08-21 Cabot Microelectronics Corporation Methods and compositions for polishing silicon-containing substrates
JP2012069785A (ja) 2010-09-24 2012-04-05 Fujimi Inc 研磨用組成物および研磨方法
KR101546695B1 (ko) * 2010-12-28 2015-08-25 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 지르코니아 입자를 포함하는 폴리싱 슬러리 및 폴리싱 슬러리를 사용하는 방법
EP2663604B1 (en) * 2011-01-11 2020-07-01 Cabot Microelectronics Corporation Metal-passivating cmp compositions and methods
EP2693459A4 (en) * 2011-03-30 2015-04-22 Fujimi Inc POLISHING COMPOSITION AND POLISHING METHOD
KR101385043B1 (ko) * 2011-12-30 2014-04-15 제일모직주식회사 Ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
US8778212B2 (en) * 2012-05-22 2014-07-15 Cabot Microelectronics Corporation CMP composition containing zirconia particles and method of use
US9340706B2 (en) * 2013-10-10 2016-05-17 Cabot Microelectronics Corporation Mixed abrasive polishing compositions
WO2017011451A1 (en) * 2015-07-13 2017-01-19 Cabot Microelectronics Corporation Methods and compositions for processing dielectric substrate

Also Published As

Publication number Publication date
CN108026412B (zh) 2021-08-31
TWI605114B (zh) 2017-11-11
KR102670778B1 (ko) 2024-05-29
CN108026412A (zh) 2018-05-11
TW201718817A (zh) 2017-06-01
KR20180038051A (ko) 2018-04-13
WO2017040571A1 (en) 2017-03-09
US20170066944A1 (en) 2017-03-09
EP3344716A4 (en) 2019-04-10
JP2018532828A (ja) 2018-11-08
EP3344716A1 (en) 2018-07-11

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