JP6951415B2 - 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 - Google Patents

基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 Download PDF

Info

Publication number
JP6951415B2
JP6951415B2 JP2019504870A JP2019504870A JP6951415B2 JP 6951415 B2 JP6951415 B2 JP 6951415B2 JP 2019504870 A JP2019504870 A JP 2019504870A JP 2019504870 A JP2019504870 A JP 2019504870A JP 6951415 B2 JP6951415 B2 JP 6951415B2
Authority
JP
Japan
Prior art keywords
substrate
base plate
array
plate
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019504870A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019523561A5 (enExample
JP2019523561A (ja
Inventor
シェフェルス、パウル・エイメルト
ペイステル、イェリー・ヨハンネス・マルティヌス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/222,705 external-priority patent/US9829804B1/en
Priority claimed from US15/222,708 external-priority patent/US20180033586A1/en
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of JP2019523561A publication Critical patent/JP2019523561A/ja
Publication of JP2019523561A5 publication Critical patent/JP2019523561A5/ja
Priority to JP2021155021A priority Critical patent/JP7240463B2/ja
Application granted granted Critical
Publication of JP6951415B2 publication Critical patent/JP6951415B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2019504870A 2016-07-28 2017-07-27 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 Active JP6951415B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021155021A JP7240463B2 (ja) 2016-07-28 2021-09-24 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/222,705 US9829804B1 (en) 2016-07-28 2016-07-28 Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
US15/222,708 2016-07-28
US15/222,705 2016-07-28
US15/222,708 US20180033586A1 (en) 2016-07-28 2016-07-28 Apparatus and method for processing or imaging a sample
PCT/JP2017/028156 WO2018021581A1 (en) 2016-07-28 2017-07-27 Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021155021A Division JP7240463B2 (ja) 2016-07-28 2021-09-24 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法

Publications (3)

Publication Number Publication Date
JP2019523561A JP2019523561A (ja) 2019-08-22
JP2019523561A5 JP2019523561A5 (enExample) 2020-09-03
JP6951415B2 true JP6951415B2 (ja) 2021-10-20

Family

ID=61016195

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019504870A Active JP6951415B2 (ja) 2016-07-28 2017-07-27 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法
JP2021155021A Active JP7240463B2 (ja) 2016-07-28 2021-09-24 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021155021A Active JP7240463B2 (ja) 2016-07-28 2021-09-24 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法

Country Status (5)

Country Link
JP (2) JP6951415B2 (enExample)
KR (2) KR102580712B1 (enExample)
CN (1) CN109844927B (enExample)
TW (2) TWI757314B (enExample)
WO (1) WO2018021581A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI883050B (zh) * 2019-10-01 2025-05-11 荷蘭商Ａｓｍｌ荷蘭公司 用於對準及接合組件之正反兩用長型元件、用於極紫外線（ｅｕｖ）輻射源之容器、微影系統、及用於將裝置接合至容器之方法
CN114302514B (zh) * 2021-12-27 2022-09-27 哈尔滨工业大学 集成交叉式双针板热沉的电热耦合温控装置及其控温方法
CN115586710B (zh) * 2022-11-09 2025-09-02 浙江大学 基于pcm隔绝内部温度波动的温控装置和控制方法
TWI856833B (zh) * 2023-09-27 2024-09-21 大陸商鵬鼎控股（深圳）股份有限公司 感測模組及其製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252288A (ja) 1999-03-04 2000-09-14 Komatsu Ltd 基板保持装置
KR100351049B1 (ko) 1999-07-26 2002-09-09 삼성전자 주식회사 웨이퍼 가열 방법 및 이를 적용한 장치
US6470108B1 (en) * 2000-04-26 2002-10-22 Tini Alloy Company Optical switching device and method
JP2003224180A (ja) * 2002-01-28 2003-08-08 Kyocera Corp ウエハ支持部材
US7195693B2 (en) * 2002-06-05 2007-03-27 Advanced Thermal Sciences Lateral temperature equalizing system for large area surfaces during processing
US7156951B1 (en) * 2002-06-21 2007-01-02 Lam Research Corporation Multiple zone gas distribution apparatus for thermal control of semiconductor wafer
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
US7532310B2 (en) * 2004-10-22 2009-05-12 Asml Netherlands B.V. Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
JP4761948B2 (ja) 2004-12-01 2011-08-31 京セラ株式会社 炭化珪素質焼結及びそれを用いた半導体製造装置用部品
JP4462143B2 (ja) 2005-07-29 2010-05-12 住友電気工業株式会社 ウェハ保持体及びウェハ保持体を備えたウェハプローバ
US7528349B1 (en) * 2006-07-25 2009-05-05 Kla-Tencor Technologies Corporation Temperature stabilization for substrate processing
CN101495922B (zh) * 2006-07-28 2012-12-12 迈普尔平版印刷Ip有限公司 光刻系统、热消散方法和框架
US8325321B2 (en) * 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP2008311595A (ja) * 2007-06-18 2008-12-25 Canon Inc ステージ装置、露光装置およびデバイス製造方法
JP5247175B2 (ja) 2008-02-06 2013-07-24 株式会社アルバック 真空処理装置
SG156564A1 (en) * 2008-04-09 2009-11-26 Asml Holding Nv Lithographic apparatus and device manufacturing method
EP2196857A3 (en) * 2008-12-09 2010-07-21 ASML Netherlands BV Lithographic apparatus and device manufacturing method
JP5607907B2 (ja) * 2009-09-17 2014-10-15 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置
US8529729B2 (en) * 2010-06-07 2013-09-10 Lam Research Corporation Plasma processing chamber component having adaptive thermal conductor
JP2012231046A (ja) * 2011-04-27 2012-11-22 Nikon Corp 光学装置、露光装置、及びデバイス製造方法
WO2013033315A2 (en) * 2011-09-01 2013-03-07 Veeco Instruments Inc. Wafer carrier with thermal features
CN103843129B (zh) * 2011-09-30 2017-03-01 应用材料公司 具有温度控制的静电夹具
JP2014017445A (ja) * 2012-07-11 2014-01-30 Canon Inc 保持装置、処理装置、リソグラフィー装置、および物品の製造方法
US9514916B2 (en) * 2013-03-15 2016-12-06 Varian Semiconductor Equipment Associates, Inc. Wafer platen thermosyphon cooling system
JP6595313B2 (ja) * 2014-11-20 2019-10-23 永大産業株式会社 蓄熱壁パネル

Also Published As

Publication number Publication date
JP2022008512A (ja) 2022-01-13
TW201812429A (zh) 2018-04-01
KR20190041477A (ko) 2019-04-22
TWI757314B (zh) 2022-03-11
KR20220137160A (ko) 2022-10-11
KR102449579B1 (ko) 2022-10-04
CN109844927A (zh) 2019-06-04
KR102580712B1 (ko) 2023-09-21
JP7240463B2 (ja) 2023-03-15
JP2019523561A (ja) 2019-08-22
TW202234574A (zh) 2022-09-01
CN109844927B (zh) 2024-01-09
WO2018021581A1 (en) 2018-02-01
TWI835063B (zh) 2024-03-11

Similar Documents

Publication Publication Date Title
JP7240463B2 (ja) 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法
JP7584593B2 (ja) インプリントリソグラフィ
US8325322B2 (en) Optical correction device
JP3814598B2 (ja) 温度調整装置、露光装置及びデバイス製造方法
TWI420258B (zh) 微影裝置及元件製造方法
KR101486407B1 (ko) 리소그래피 시스템, 방열 방법 및 프레임
TW201207573A (en) Lithographic apparatus and lithographic apparatus cooling method
NL2019356B1 (en) Method for manufacturing a substrate holding device, substrate holding device, and apparatus and method for processing or imaging a sample
CN102428408B (zh) 包括光学校正布置的用于半导体光刻的投射曝光设备
JP2005175490A (ja) リソグラフィ装置及びデバイス製造方法
US20140017613A1 (en) Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article
NL2019355B1 (en) Method and apparatus for exposing a sample
WO2017110032A1 (en) Imprint apparatus, method of imprinting, and method of fabricating product
JP4651372B2 (ja) 熱補償ヒーターモジュールを有するレーザー熱処理用チャック
US20140118709A1 (en) Holding apparatus, lithography apparatus, and method of manufacturing article
JP4995478B2 (ja) ナノインプリント用スペーサ、及びこれを用いた電子顕微鏡調整用試料の製造方法、並びに電子顕微鏡調整用試料、及びこれを備えた電子顕微鏡
US20150029484A1 (en) Stage apparatus, lithography apparatus and method of manufacturing article
US20130149647A1 (en) Holding apparatus, drawing apparatus, and method of manufacturing article
JP2005203522A (ja) 露光方法及び装置、並びにデバイス製造方法
JP4559137B2 (ja) 真空機器の製造装置及び製造方法
JP2023044361A (ja) ステージ装置、荷電粒子線装置および真空装置
JPH0547663A (ja) 分子線結晶成長装置

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20190607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200720

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200720

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210524

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210618

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210827

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210924

R150 Certificate of patent or registration of utility model

Ref document number: 6951415

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250