CN109844927B - 基板保持装置、用于制造这种装置的方法、以及用于处理或成像样品的设备和方法 - Google Patents
基板保持装置、用于制造这种装置的方法、以及用于处理或成像样品的设备和方法 Download PDFInfo
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- CN109844927B CN109844927B CN201780059072.5A CN201780059072A CN109844927B CN 109844927 B CN109844927 B CN 109844927B CN 201780059072 A CN201780059072 A CN 201780059072A CN 109844927 B CN109844927 B CN 109844927B
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electron Beam Exposure (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/222,705 US9829804B1 (en) | 2016-07-28 | 2016-07-28 | Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system |
| US15/222,708 | 2016-07-28 | ||
| US15/222,705 | 2016-07-28 | ||
| US15/222,708 US20180033586A1 (en) | 2016-07-28 | 2016-07-28 | Apparatus and method for processing or imaging a sample |
| PCT/JP2017/028156 WO2018021581A1 (en) | 2016-07-28 | 2017-07-27 | Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109844927A CN109844927A (zh) | 2019-06-04 |
| CN109844927B true CN109844927B (zh) | 2024-01-09 |
Family
ID=61016195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780059072.5A Active CN109844927B (zh) | 2016-07-28 | 2017-07-27 | 基板保持装置、用于制造这种装置的方法、以及用于处理或成像样品的设备和方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6951415B2 (enExample) |
| KR (2) | KR102580712B1 (enExample) |
| CN (1) | CN109844927B (enExample) |
| TW (2) | TWI757314B (enExample) |
| WO (1) | WO2018021581A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI883050B (zh) * | 2019-10-01 | 2025-05-11 | 荷蘭商Ａｓｍｌ荷蘭公司 | 用於對準及接合組件之正反兩用長型元件、用於極紫外線（ｅｕｖ）輻射源之容器、微影系統、及用於將裝置接合至容器之方法 |
| CN114302514B (zh) * | 2021-12-27 | 2022-09-27 | 哈尔滨工业大学 | 集成交叉式双针板热沉的电热耦合温控装置及其控温方法 |
| CN115586710B (zh) * | 2022-11-09 | 2025-09-02 | 浙江大学 | 基于pcm隔绝内部温度波动的温控装置和控制方法 |
| TWI856833B (zh) * | 2023-09-27 | 2024-09-21 | 大陸商鵬鼎控股（深圳）股份有限公司 | 感測模組及其製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6470108B1 (en) * | 2000-04-26 | 2002-10-22 | Tini Alloy Company | Optical switching device and method |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000252288A (ja) | 1999-03-04 | 2000-09-14 | Komatsu Ltd | 基板保持装置 |
| KR100351049B1 (ko) | 1999-07-26 | 2002-09-09 | 삼성전자 주식회사 | 웨이퍼 가열 방법 및 이를 적용한 장치 |
| JP2003224180A (ja) * | 2002-01-28 | 2003-08-08 | Kyocera Corp | ウエハ支持部材 |
| US7195693B2 (en) * | 2002-06-05 | 2007-03-27 | Advanced Thermal Sciences | Lateral temperature equalizing system for large area surfaces during processing |
| US7156951B1 (en) * | 2002-06-21 | 2007-01-02 | Lam Research Corporation | Multiple zone gas distribution apparatus for thermal control of semiconductor wafer |
| US7106416B2 (en) * | 2003-12-10 | 2006-09-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20050128449A1 (en) | 2003-12-12 | 2005-06-16 | Nikon Corporation, A Japanese Corporation | Utilities transfer system in a lithography system |
| US7532310B2 (en) * | 2004-10-22 | 2009-05-12 | Asml Netherlands B.V. | Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck |
| JP4761948B2 (ja) | 2004-12-01 | 2011-08-31 | 京セラ株式会社 | 炭化珪素質焼結及びそれを用いた半導体製造装置用部品 |
| JP4462143B2 (ja) | 2005-07-29 | 2010-05-12 | 住友電気工業株式会社 | ウェハ保持体及びウェハ保持体を備えたウェハプローバ |
| US7528349B1 (en) * | 2006-07-25 | 2009-05-05 | Kla-Tencor Technologies Corporation | Temperature stabilization for substrate processing |
| CN101495922B (zh) * | 2006-07-28 | 2012-12-12 | 迈普尔平版印刷Ip有限公司 | 光刻系统、热消散方法和框架 |
| US8325321B2 (en) * | 2006-07-28 | 2012-12-04 | Mapper Lithography Ip B.V. | Lithography system, method of heat dissipation and frame |
| JP2008311595A (ja) * | 2007-06-18 | 2008-12-25 | Canon Inc | ステージ装置、露光装置およびデバイス製造方法 |
| JP5247175B2 (ja) | 2008-02-06 | 2013-07-24 | 株式会社アルバック | 真空処理装置 |
| SG156564A1 (en) * | 2008-04-09 | 2009-11-26 | Asml Holding Nv | Lithographic apparatus and device manufacturing method |
| EP2196857A3 (en) * | 2008-12-09 | 2010-07-21 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
| JP5607907B2 (ja) * | 2009-09-17 | 2014-10-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置 |
| US8529729B2 (en) * | 2010-06-07 | 2013-09-10 | Lam Research Corporation | Plasma processing chamber component having adaptive thermal conductor |
| JP2012231046A (ja) * | 2011-04-27 | 2012-11-22 | Nikon Corp | 光学装置、露光装置、及びデバイス製造方法 |
| WO2013033315A2 (en) * | 2011-09-01 | 2013-03-07 | Veeco Instruments Inc. | Wafer carrier with thermal features |
| CN103843129B (zh) * | 2011-09-30 | 2017-03-01 | 应用材料公司 | 具有温度控制的静电夹具 |
| JP2014017445A (ja) * | 2012-07-11 | 2014-01-30 | Canon Inc | 保持装置、処理装置、リソグラフィー装置、および物品の製造方法 |
| US9514916B2 (en) * | 2013-03-15 | 2016-12-06 | Varian Semiconductor Equipment Associates, Inc. | Wafer platen thermosyphon cooling system |
| JP6595313B2 (ja) * | 2014-11-20 | 2019-10-23 | 永大産業株式会社 | 蓄熱壁パネル |
-
2017
- 2017-07-26 TW TW106125097A patent/TWI757314B/zh active
- 2017-07-26 TW TW111103697A patent/TWI835063B/zh active
- 2017-07-27 CN CN201780059072.5A patent/CN109844927B/zh active Active
- 2017-07-27 KR KR1020227033553A patent/KR102580712B1/ko active Active
- 2017-07-27 WO PCT/JP2017/028156 patent/WO2018021581A1/en not_active Ceased
- 2017-07-27 KR KR1020197005730A patent/KR102449579B1/ko active Active
- 2017-07-27 JP JP2019504870A patent/JP6951415B2/ja active Active
-
2021
- 2021-09-24 JP JP2021155021A patent/JP7240463B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6470108B1 (en) * | 2000-04-26 | 2002-10-22 | Tini Alloy Company | Optical switching device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022008512A (ja) | 2022-01-13 |
| TW201812429A (zh) | 2018-04-01 |
| KR20190041477A (ko) | 2019-04-22 |
| TWI757314B (zh) | 2022-03-11 |
| KR20220137160A (ko) | 2022-10-11 |
| KR102449579B1 (ko) | 2022-10-04 |
| CN109844927A (zh) | 2019-06-04 |
| KR102580712B1 (ko) | 2023-09-21 |
| JP7240463B2 (ja) | 2023-03-15 |
| JP6951415B2 (ja) | 2021-10-20 |
| JP2019523561A (ja) | 2019-08-22 |
| TW202234574A (zh) | 2022-09-01 |
| WO2018021581A1 (en) | 2018-02-01 |
| TWI835063B (zh) | 2024-03-11 |
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