KR102580712B1 - 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 - Google Patents

기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 Download PDF

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Publication number
KR102580712B1
KR102580712B1 KR1020227033553A KR20227033553A KR102580712B1 KR 102580712 B1 KR102580712 B1 KR 102580712B1 KR 1020227033553 A KR1020227033553 A KR 1020227033553A KR 20227033553 A KR20227033553 A KR 20227033553A KR 102580712 B1 KR102580712 B1 KR 102580712B1
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South Korea
Prior art keywords
base plate
substrate
temperature
plate
holding device
Prior art date
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KR1020227033553A
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English (en)
Korean (ko)
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KR20220137160A (ko
Inventor
폴 이머트 셰퍼스
제리 요한네스 마르티누스 페이스터
Original Assignee
에이에스엠엘 네델란즈 비.브이.
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Priority claimed from US15/222,705 external-priority patent/US9829804B1/en
Priority claimed from US15/222,708 external-priority patent/US20180033586A1/en
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20220137160A publication Critical patent/KR20220137160A/ko
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Publication of KR102580712B1 publication Critical patent/KR102580712B1/ko
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020227033553A 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 Active KR102580712B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US15/222,705 US9829804B1 (en) 2016-07-28 2016-07-28 Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
US15/222,708 2016-07-28
US15/222,705 2016-07-28
US15/222,708 US20180033586A1 (en) 2016-07-28 2016-07-28 Apparatus and method for processing or imaging a sample
KR1020197005730A KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법
PCT/JP2017/028156 WO2018021581A1 (en) 2016-07-28 2017-07-27 Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197005730A Division KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20220137160A KR20220137160A (ko) 2022-10-11
KR102580712B1 true KR102580712B1 (ko) 2023-09-21

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227033553A Active KR102580712B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법
KR1020197005730A Active KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020197005730A Active KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Country Status (5)

Country Link
JP (2) JP6951415B2 (enExample)
KR (2) KR102580712B1 (enExample)
CN (1) CN109844927B (enExample)
TW (2) TWI757314B (enExample)
WO (1) WO2018021581A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI883050B (zh) * 2019-10-01 2025-05-11 荷蘭商Ａｓｍｌ荷蘭公司 用於對準及接合組件之正反兩用長型元件、用於極紫外線（ｅｕｖ）輻射源之容器、微影系統、及用於將裝置接合至容器之方法
CN114302514B (zh) * 2021-12-27 2022-09-27 哈尔滨工业大学 集成交叉式双针板热沉的电热耦合温控装置及其控温方法
CN115586710B (zh) * 2022-11-09 2025-09-02 浙江大学 基于pcm隔绝内部温度波动的温控装置和控制方法
TWI856833B (zh) * 2023-09-27 2024-09-21 大陸商鵬鼎控股（深圳）股份有限公司 感測模組及其製造方法

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US20080024743A1 (en) 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
US20140017613A1 (en) 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

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JP2000252288A (ja) 1999-03-04 2000-09-14 Komatsu Ltd 基板保持装置
KR100351049B1 (ko) 1999-07-26 2002-09-09 삼성전자 주식회사 웨이퍼 가열 방법 및 이를 적용한 장치
US6470108B1 (en) * 2000-04-26 2002-10-22 Tini Alloy Company Optical switching device and method
JP2003224180A (ja) * 2002-01-28 2003-08-08 Kyocera Corp ウエハ支持部材
US7195693B2 (en) * 2002-06-05 2007-03-27 Advanced Thermal Sciences Lateral temperature equalizing system for large area surfaces during processing
US7156951B1 (en) * 2002-06-21 2007-01-02 Lam Research Corporation Multiple zone gas distribution apparatus for thermal control of semiconductor wafer
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7532310B2 (en) * 2004-10-22 2009-05-12 Asml Netherlands B.V. Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
JP4761948B2 (ja) 2004-12-01 2011-08-31 京セラ株式会社 炭化珪素質焼結及びそれを用いた半導体製造装置用部品
JP4462143B2 (ja) 2005-07-29 2010-05-12 住友電気工業株式会社 ウェハ保持体及びウェハ保持体を備えたウェハプローバ
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US20080024743A1 (en) 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
US20140017613A1 (en) 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

Also Published As

Publication number Publication date
JP2022008512A (ja) 2022-01-13
TW201812429A (zh) 2018-04-01
KR20190041477A (ko) 2019-04-22
TWI757314B (zh) 2022-03-11
KR20220137160A (ko) 2022-10-11
KR102449579B1 (ko) 2022-10-04
CN109844927A (zh) 2019-06-04
JP7240463B2 (ja) 2023-03-15
JP6951415B2 (ja) 2021-10-20
JP2019523561A (ja) 2019-08-22
TW202234574A (zh) 2022-09-01
CN109844927B (zh) 2024-01-09
WO2018021581A1 (en) 2018-02-01
TWI835063B (zh) 2024-03-11

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