JP2019523561A5 - - Google Patents
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- JP2019523561A5 JP2019523561A5 JP2019504870A JP2019504870A JP2019523561A5 JP 2019523561 A5 JP2019523561 A5 JP 2019523561A5 JP 2019504870 A JP2019504870 A JP 2019504870A JP 2019504870 A JP2019504870 A JP 2019504870A JP 2019523561 A5 JP2019523561 A5 JP 2019523561A5
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- JP
- Japan
- Prior art keywords
- array
- holding device
- droplets
- base plate
- gap
- Prior art date
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- 239000000758 substrate Substances 0.000 claims 25
- 238000007872 degassing Methods 0.000 claims 3
- 230000005670 electromagnetic radiation Effects 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000011358 absorbing material Substances 0.000 claims 1
- 239000013013 elastic material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000000284 resting effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021155021A JP7240463B2 (ja) | 2016-07-28 | 2021-09-24 | 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/222,705 US9829804B1 (en) | 2016-07-28 | 2016-07-28 | Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system |
| US15/222,708 | 2016-07-28 | ||
| US15/222,705 | 2016-07-28 | ||
| US15/222,708 US20180033586A1 (en) | 2016-07-28 | 2016-07-28 | Apparatus and method for processing or imaging a sample |
| PCT/JP2017/028156 WO2018021581A1 (en) | 2016-07-28 | 2017-07-27 | Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021155021A Division JP7240463B2 (ja) | 2016-07-28 | 2021-09-24 | 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019523561A JP2019523561A (ja) | 2019-08-22 |
| JP2019523561A5 true JP2019523561A5 (enExample) | 2020-09-03 |
| JP6951415B2 JP6951415B2 (ja) | 2021-10-20 |
Family
ID=61016195
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504870A Active JP6951415B2 (ja) | 2016-07-28 | 2017-07-27 | 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 |
| JP2021155021A Active JP7240463B2 (ja) | 2016-07-28 | 2021-09-24 | 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021155021A Active JP7240463B2 (ja) | 2016-07-28 | 2021-09-24 | 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6951415B2 (enExample) |
| KR (2) | KR102580712B1 (enExample) |
| CN (1) | CN109844927B (enExample) |
| TW (2) | TWI757314B (enExample) |
| WO (1) | WO2018021581A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI883050B (zh) * | 2019-10-01 | 2025-05-11 | 荷蘭商Ａｓｍｌ荷蘭公司 | 用於對準及接合組件之正反兩用長型元件、用於極紫外線（ｅｕｖ）輻射源之容器、微影系統、及用於將裝置接合至容器之方法 |
| CN114302514B (zh) * | 2021-12-27 | 2022-09-27 | 哈尔滨工业大学 | 集成交叉式双针板热沉的电热耦合温控装置及其控温方法 |
| CN115586710B (zh) * | 2022-11-09 | 2025-09-02 | 浙江大学 | 基于pcm隔绝内部温度波动的温控装置和控制方法 |
| TWI856833B (zh) * | 2023-09-27 | 2024-09-21 | 大陸商鵬鼎控股（深圳）股份有限公司 | 感測模組及其製造方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000252288A (ja) | 1999-03-04 | 2000-09-14 | Komatsu Ltd | 基板保持装置 |
| KR100351049B1 (ko) | 1999-07-26 | 2002-09-09 | 삼성전자 주식회사 | 웨이퍼 가열 방법 및 이를 적용한 장치 |
| US6470108B1 (en) * | 2000-04-26 | 2002-10-22 | Tini Alloy Company | Optical switching device and method |
| JP2003224180A (ja) * | 2002-01-28 | 2003-08-08 | Kyocera Corp | ウエハ支持部材 |
| US7195693B2 (en) * | 2002-06-05 | 2007-03-27 | Advanced Thermal Sciences | Lateral temperature equalizing system for large area surfaces during processing |
| US7156951B1 (en) * | 2002-06-21 | 2007-01-02 | Lam Research Corporation | Multiple zone gas distribution apparatus for thermal control of semiconductor wafer |
| US7106416B2 (en) * | 2003-12-10 | 2006-09-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20050128449A1 (en) | 2003-12-12 | 2005-06-16 | Nikon Corporation, A Japanese Corporation | Utilities transfer system in a lithography system |
| US7532310B2 (en) * | 2004-10-22 | 2009-05-12 | Asml Netherlands B.V. | Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck |
| JP4761948B2 (ja) | 2004-12-01 | 2011-08-31 | 京セラ株式会社 | 炭化珪素質焼結及びそれを用いた半導体製造装置用部品 |
| JP4462143B2 (ja) | 2005-07-29 | 2010-05-12 | 住友電気工業株式会社 | ウェハ保持体及びウェハ保持体を備えたウェハプローバ |
| US7528349B1 (en) * | 2006-07-25 | 2009-05-05 | Kla-Tencor Technologies Corporation | Temperature stabilization for substrate processing |
| CN101495922B (zh) * | 2006-07-28 | 2012-12-12 | 迈普尔平版印刷Ip有限公司 | 光刻系统、热消散方法和框架 |
| US8325321B2 (en) * | 2006-07-28 | 2012-12-04 | Mapper Lithography Ip B.V. | Lithography system, method of heat dissipation and frame |
| JP2008311595A (ja) * | 2007-06-18 | 2008-12-25 | Canon Inc | ステージ装置、露光装置およびデバイス製造方法 |
| JP5247175B2 (ja) | 2008-02-06 | 2013-07-24 | 株式会社アルバック | 真空処理装置 |
| SG156564A1 (en) * | 2008-04-09 | 2009-11-26 | Asml Holding Nv | Lithographic apparatus and device manufacturing method |
| EP2196857A3 (en) * | 2008-12-09 | 2010-07-21 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
| JP5607907B2 (ja) * | 2009-09-17 | 2014-10-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置 |
| US8529729B2 (en) * | 2010-06-07 | 2013-09-10 | Lam Research Corporation | Plasma processing chamber component having adaptive thermal conductor |
| JP2012231046A (ja) * | 2011-04-27 | 2012-11-22 | Nikon Corp | 光学装置、露光装置、及びデバイス製造方法 |
| WO2013033315A2 (en) * | 2011-09-01 | 2013-03-07 | Veeco Instruments Inc. | Wafer carrier with thermal features |
| CN103843129B (zh) * | 2011-09-30 | 2017-03-01 | 应用材料公司 | 具有温度控制的静电夹具 |
| JP2014017445A (ja) * | 2012-07-11 | 2014-01-30 | Canon Inc | 保持装置、処理装置、リソグラフィー装置、および物品の製造方法 |
| US9514916B2 (en) * | 2013-03-15 | 2016-12-06 | Varian Semiconductor Equipment Associates, Inc. | Wafer platen thermosyphon cooling system |
| JP6595313B2 (ja) * | 2014-11-20 | 2019-10-23 | 永大産業株式会社 | 蓄熱壁パネル |
-
2017
- 2017-07-26 TW TW106125097A patent/TWI757314B/zh active
- 2017-07-26 TW TW111103697A patent/TWI835063B/zh active
- 2017-07-27 CN CN201780059072.5A patent/CN109844927B/zh active Active
- 2017-07-27 KR KR1020227033553A patent/KR102580712B1/ko active Active
- 2017-07-27 WO PCT/JP2017/028156 patent/WO2018021581A1/en not_active Ceased
- 2017-07-27 KR KR1020197005730A patent/KR102449579B1/ko active Active
- 2017-07-27 JP JP2019504870A patent/JP6951415B2/ja active Active
-
2021
- 2021-09-24 JP JP2021155021A patent/JP7240463B2/ja active Active