TW201613026A - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
TW201613026A
TW201613026A TW104115711A TW104115711A TW201613026A TW 201613026 A TW201613026 A TW 201613026A TW 104115711 A TW104115711 A TW 104115711A TW 104115711 A TW104115711 A TW 104115711A TW 201613026 A TW201613026 A TW 201613026A
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
support platform
spacer
processing apparatus
substrate processing
Prior art date
Application number
TW104115711A
Other languages
Chinese (zh)
Inventor
Koji Yamagishi
Hiroshi Kaneko
Jouji Oshikiri
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201613026A publication Critical patent/TW201613026A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

To prevent breakage of an electrostatic chuck due to thermal expansion. A substrate processing apparatus 1 comprises: an electrostatic chuck 18 which has a heater 21 therein and heats a wafer W placed on a top face; a support platform 14 provided below the electrostatic chuck 18, for radiating heat from the electrostatic chuck 18; a spacer 16 provided between the electrostatic chuck 18 and the support platform 14, for forming a space between the electrostatic chuck 18 and the support platform 14; and a fixing member 13 which surrounds a periphery of the electrostatic chuck 18 to fix the electrostatic chuck 18 and the spacer 16 to the support platform 14. At least part of the spacer 16 contacts the electrostatic chuck 18 and the support platform 14. The fixing member 13 has an elastic member 132, and the electrostatic chuck 18 and the spacer 16 are fixed to the support platform 14 by energizing power applied by the elastic member 132 in a direction from the electrostatic chuck 18 to the support platform 14.
TW104115711A 2014-05-20 2015-05-18 Substrate processing apparatus TW201613026A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014104690A JP2015220413A (en) 2014-05-20 2014-05-20 Substrate processing apparatus

Publications (1)

Publication Number Publication Date
TW201613026A true TW201613026A (en) 2016-04-01

Family

ID=54553902

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104115711A TW201613026A (en) 2014-05-20 2015-05-18 Substrate processing apparatus

Country Status (3)

Country Link
JP (1) JP2015220413A (en)
TW (1) TW201613026A (en)
WO (1) WO2015178229A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI832059B (en) * 2020-08-25 2024-02-11 南韓商杰宜斯科技有限公司 Wafer processing apparatus and controlling method thereof

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6961025B2 (en) * 2016-06-24 2021-11-05 東京エレクトロン株式会社 Board processing system
JP6948822B2 (en) * 2017-04-25 2021-10-13 東京エレクトロン株式会社 Board processing device and board removal method
JP7110828B2 (en) * 2018-08-29 2022-08-02 住友大阪セメント株式会社 Electrostatic chuck device
JP6681522B1 (en) * 2018-09-13 2020-04-15 日本碍子株式会社 Wafer loading device
JP2021012928A (en) * 2019-07-04 2021-02-04 住友大阪セメント株式会社 Electrostatic chuck device
KR102363304B1 (en) * 2020-10-05 2022-02-16 (주)원세미콘 Plasma focus ring connection structure of semiconductor etching apparatus
KR102363312B1 (en) * 2020-10-05 2022-02-16 (주)원세미콘 Plasma focus ring of semiconductor etching apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3374033B2 (en) * 1997-02-05 2003-02-04 東京エレクトロン株式会社 Vacuum processing equipment
JP3078506B2 (en) * 1997-06-26 2000-08-21 芝浦メカトロニクス株式会社 Electrostatic chuck device and mounting table
JP2010021510A (en) * 2008-06-13 2010-01-28 Canon Anelva Corp Substrate support device and plasma processing apparatus
JP5989593B2 (en) * 2012-04-27 2016-09-07 日本碍子株式会社 Components for semiconductor manufacturing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI832059B (en) * 2020-08-25 2024-02-11 南韓商杰宜斯科技有限公司 Wafer processing apparatus and controlling method thereof

Also Published As

Publication number Publication date
JP2015220413A (en) 2015-12-07
WO2015178229A1 (en) 2015-11-26

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