JP6942211B2 - 計測センサ用パッケージおよび計測センサ - Google Patents
計測センサ用パッケージおよび計測センサ Download PDFInfo
- Publication number
- JP6942211B2 JP6942211B2 JP2020019170A JP2020019170A JP6942211B2 JP 6942211 B2 JP6942211 B2 JP 6942211B2 JP 2020019170 A JP2020019170 A JP 2020019170A JP 2020019170 A JP2020019170 A JP 2020019170A JP 6942211 B2 JP6942211 B2 JP 6942211B2
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- accommodating recess
- main surface
- measurement sensor
- light
- substrate
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020019170A JP6942211B2 (ja) | 2016-01-25 | 2020-02-06 | 計測センサ用パッケージおよび計測センサ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016011936A JP6659377B2 (ja) | 2016-01-25 | 2016-01-25 | 計測センサ用パッケージおよび計測センサ |
JP2020019170A JP6942211B2 (ja) | 2016-01-25 | 2020-02-06 | 計測センサ用パッケージおよび計測センサ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016011936A Division JP6659377B2 (ja) | 2016-01-25 | 2016-01-25 | 計測センサ用パッケージおよび計測センサ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020075170A JP2020075170A (ja) | 2020-05-21 |
JP2020075170A5 JP2020075170A5 (enrdf_load_stackoverflow) | 2020-08-06 |
JP6942211B2 true JP6942211B2 (ja) | 2021-09-29 |
Family
ID=70724811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020019170A Expired - Fee Related JP6942211B2 (ja) | 2016-01-25 | 2020-02-06 | 計測センサ用パッケージおよび計測センサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6942211B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7300730B2 (ja) * | 2020-04-21 | 2023-06-30 | 株式会社ユニバーサルエンターテインメント | 遊技機 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06327658A (ja) * | 1993-03-26 | 1994-11-29 | Nippon Koden Corp | 酸素飽和度計用プローブ |
JP2002100721A (ja) * | 2000-09-21 | 2002-04-05 | Mitsui Chemicals Inc | 電子部品搭載用基板及びその製造方法 |
JP2005050974A (ja) * | 2003-07-31 | 2005-02-24 | Toshiba Corp | 半導体パッケージおよび光通信モジュール並びに半導体装置 |
JP4794874B2 (ja) * | 2005-03-07 | 2011-10-19 | ローム株式会社 | 光通信モジュール |
KR100945621B1 (ko) * | 2005-03-07 | 2010-03-04 | 로무 가부시키가이샤 | 광 통신 모듈 및 그 제조 방법 |
US8692992B2 (en) * | 2011-09-22 | 2014-04-08 | Covidien Lp | Faraday shield integrated into sensor bandage |
JP5985843B2 (ja) * | 2012-03-15 | 2016-09-06 | ローム株式会社 | 光半導体装置 |
JP2015060998A (ja) * | 2013-09-19 | 2015-03-30 | パナソニック株式会社 | センサモジュールおよび当該センサモジュールに用いられる立体配線回路基板 |
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2020
- 2020-02-06 JP JP2020019170A patent/JP6942211B2/ja not_active Expired - Fee Related
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JP2020075170A (ja) | 2020-05-21 |
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