JP6936584B2 - 電子デバイス及びその製造方法 - Google Patents

電子デバイス及びその製造方法 Download PDF

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JP6936584B2
JP6936584B2 JP2017030861A JP2017030861A JP6936584B2 JP 6936584 B2 JP6936584 B2 JP 6936584B2 JP 2017030861 A JP2017030861 A JP 2017030861A JP 2017030861 A JP2017030861 A JP 2017030861A JP 6936584 B2 JP6936584 B2 JP 6936584B2
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sealing layer
electronic device
wiring
semiconductor die
manufacturing
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JP2018137341A (ja
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高橋　知子
知子 高橋
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株式会社アムコー・テクノロジー・ジャパン
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JP2017030861A 2017-02-22 2017-02-22 電子デバイス及びその製造方法 Active JP6936584B2 (ja)

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JP2017030861A JP6936584B2 (ja) 2017-02-22 2017-02-22 電子デバイス及びその製造方法
JP2021138854A JP7256240B2 (ja) 2017-02-22 2021-08-27 電子デバイス及び電子デバイスの製造方法

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JP2018137341A JP2018137341A (ja) 2018-08-30
JP2018137341A5 JP2018137341A5 (https=) 2020-08-13
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Publication number Priority date Publication date Assignee Title
US11264314B2 (en) * 2019-09-27 2022-03-01 International Business Machines Corporation Interconnection with side connection to substrate
KR102928946B1 (ko) * 2021-02-05 2026-02-20 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
US20250002137A1 (en) 2021-11-15 2025-01-02 Mitsui Chemicals, Inc. Blade, flying object, and manufacturing method thereof

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JP3726985B2 (ja) * 1996-12-09 2005-12-14 ソニー株式会社 電子部品の製造方法
JP2001156457A (ja) * 1999-11-30 2001-06-08 Taiyo Yuden Co Ltd 電子回路装置の製造方法
JP4200812B2 (ja) * 2003-05-16 2008-12-24 ソニー株式会社 半導体装置とその製造方法および電子回路装置
JP4369728B2 (ja) * 2003-11-12 2009-11-25 大日本印刷株式会社 電子装置の製造方法
JP5183949B2 (ja) * 2007-03-30 2013-04-17 日本電気株式会社 半導体装置の製造方法
US9496211B2 (en) * 2012-11-21 2016-11-15 Intel Corporation Logic die and other components embedded in build-up layers
KR102380304B1 (ko) * 2015-01-23 2022-03-30 삼성전기주식회사 전자부품 내장 기판 및 그 제조방법
JP2017017238A (ja) * 2015-07-03 2017-01-19 株式会社ジェイデバイス 半導体装置及びその製造方法

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JP7256240B2 (ja) 2023-04-11
JP2018137341A (ja) 2018-08-30
JP2021185621A (ja) 2021-12-09

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