JP2018137341A5 - - Google Patents
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- Publication number
- JP2018137341A5 JP2018137341A5 JP2017030861A JP2017030861A JP2018137341A5 JP 2018137341 A5 JP2018137341 A5 JP 2018137341A5 JP 2017030861 A JP2017030861 A JP 2017030861A JP 2017030861 A JP2017030861 A JP 2017030861A JP 2018137341 A5 JP2018137341 A5 JP 2018137341A5
- Authority
- JP
- Japan
- Prior art keywords
- sealing layer
- electronic device
- semiconductor die
- wiring structure
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims 37
- 239000004065 semiconductor Substances 0.000 claims 22
- 238000004519 manufacturing process Methods 0.000 claims 17
- 238000005538 encapsulation Methods 0.000 claims 14
- 239000002184 metal Substances 0.000 claims 11
- 238000000034 method Methods 0.000 claims 3
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017030861A JP6936584B2 (ja) | 2017-02-22 | 2017-02-22 | 電子デバイス及びその製造方法 |
| JP2021138854A JP7256240B2 (ja) | 2017-02-22 | 2021-08-27 | 電子デバイス及び電子デバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017030861A JP6936584B2 (ja) | 2017-02-22 | 2017-02-22 | 電子デバイス及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021138854A Division JP7256240B2 (ja) | 2017-02-22 | 2021-08-27 | 電子デバイス及び電子デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018137341A JP2018137341A (ja) | 2018-08-30 |
| JP2018137341A5 true JP2018137341A5 (https=) | 2020-08-13 |
| JP6936584B2 JP6936584B2 (ja) | 2021-09-15 |
Family
ID=63365657
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017030861A Active JP6936584B2 (ja) | 2017-02-22 | 2017-02-22 | 電子デバイス及びその製造方法 |
| JP2021138854A Active JP7256240B2 (ja) | 2017-02-22 | 2021-08-27 | 電子デバイス及び電子デバイスの製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021138854A Active JP7256240B2 (ja) | 2017-02-22 | 2021-08-27 | 電子デバイス及び電子デバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP6936584B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11264314B2 (en) * | 2019-09-27 | 2022-03-01 | International Business Machines Corporation | Interconnection with side connection to substrate |
| KR102928946B1 (ko) * | 2021-02-05 | 2026-02-20 | 엘지이노텍 주식회사 | 회로기판 및 이를 포함하는 패키지 기판 |
| US20250002137A1 (en) | 2021-11-15 | 2025-01-02 | Mitsui Chemicals, Inc. | Blade, flying object, and manufacturing method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3726985B2 (ja) * | 1996-12-09 | 2005-12-14 | ソニー株式会社 | 電子部品の製造方法 |
| JP2001156457A (ja) * | 1999-11-30 | 2001-06-08 | Taiyo Yuden Co Ltd | 電子回路装置の製造方法 |
| JP4200812B2 (ja) * | 2003-05-16 | 2008-12-24 | ソニー株式会社 | 半導体装置とその製造方法および電子回路装置 |
| JP4369728B2 (ja) * | 2003-11-12 | 2009-11-25 | 大日本印刷株式会社 | 電子装置の製造方法 |
| JP5183949B2 (ja) * | 2007-03-30 | 2013-04-17 | 日本電気株式会社 | 半導体装置の製造方法 |
| US9496211B2 (en) * | 2012-11-21 | 2016-11-15 | Intel Corporation | Logic die and other components embedded in build-up layers |
| KR102380304B1 (ko) * | 2015-01-23 | 2022-03-30 | 삼성전기주식회사 | 전자부품 내장 기판 및 그 제조방법 |
| JP2017017238A (ja) * | 2015-07-03 | 2017-01-19 | 株式会社ジェイデバイス | 半導体装置及びその製造方法 |
-
2017
- 2017-02-22 JP JP2017030861A patent/JP6936584B2/ja active Active
-
2021
- 2021-08-27 JP JP2021138854A patent/JP7256240B2/ja active Active
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