JP6929804B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6929804B2 JP6929804B2 JP2018025759A JP2018025759A JP6929804B2 JP 6929804 B2 JP6929804 B2 JP 6929804B2 JP 2018025759 A JP2018025759 A JP 2018025759A JP 2018025759 A JP2018025759 A JP 2018025759A JP 6929804 B2 JP6929804 B2 JP 6929804B2
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- 239000004065 semiconductor Substances 0.000 title claims description 216
- 239000000463 material Substances 0.000 claims description 6
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- 239000012535 impurity Substances 0.000 description 29
- 230000004888 barrier function Effects 0.000 description 28
- 238000010586 diagram Methods 0.000 description 21
- 230000008859 change Effects 0.000 description 20
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- 239000002184 metal Substances 0.000 description 10
- 238000007599 discharging Methods 0.000 description 8
- 230000003071 parasitic effect Effects 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 244000045947 parasite Species 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201810186983.0A CN109524396B (zh) | 2017-09-20 | 2018-03-07 | 半导体装置 |
US15/926,361 US10468512B2 (en) | 2017-09-20 | 2018-03-20 | Semiconductor device with insulated gate bipolar transistor (IGBT) having multiple resistors |
Applications Claiming Priority (2)
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JP2017180287 | 2017-09-20 | ||
JP2017180287 | 2017-09-20 |
Publications (3)
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JP2019057702A JP2019057702A (ja) | 2019-04-11 |
JP2019057702A5 JP2019057702A5 (enrdf_load_stackoverflow) | 2020-03-05 |
JP6929804B2 true JP6929804B2 (ja) | 2021-09-01 |
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JP2018025759A Active JP6929804B2 (ja) | 2017-09-20 | 2018-02-16 | 半導体装置 |
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JP (1) | JP6929804B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7484093B2 (ja) * | 2019-06-24 | 2024-05-16 | 富士電機株式会社 | 半導体装置 |
JP7305589B2 (ja) * | 2020-03-19 | 2023-07-10 | 株式会社東芝 | 半導体装置及び半導体回路 |
JP7447769B2 (ja) | 2020-11-13 | 2024-03-12 | 三菱電機株式会社 | 半導体素子、半導体装置 |
JP2023039138A (ja) * | 2021-09-08 | 2023-03-20 | 富士電機株式会社 | 絶縁ゲート型バイポーラトランジスタ |
JP2023116894A (ja) | 2022-02-10 | 2023-08-23 | 株式会社東芝 | 半導体装置 |
JP7717652B2 (ja) * | 2022-03-22 | 2025-08-04 | 株式会社東芝 | 半導体装置及び半導体回路 |
WO2024014362A1 (ja) * | 2022-07-11 | 2024-01-18 | ローム株式会社 | 半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012164851A (ja) * | 2011-02-08 | 2012-08-30 | Toyota Motor Corp | 半導体装置 |
DE102014119543B4 (de) * | 2014-12-23 | 2018-10-11 | Infineon Technologies Ag | Halbleitervorrichtung mit transistorzellen und anreicherungszellen sowie leistungsmodul |
JP6950186B2 (ja) * | 2017-01-17 | 2021-10-13 | 富士電機株式会社 | 半導体装置 |
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JP2019057702A (ja) | 2019-04-11 |
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