JP6915628B2 - 音叉型振動子の製造方法 - Google Patents
音叉型振動子の製造方法 Download PDFInfo
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- JP6915628B2 JP6915628B2 JP2018557588A JP2018557588A JP6915628B2 JP 6915628 B2 JP6915628 B2 JP 6915628B2 JP 2018557588 A JP2018557588 A JP 2018557588A JP 2018557588 A JP2018557588 A JP 2018557588A JP 6915628 B2 JP6915628 B2 JP 6915628B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
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- 238000003860 storage Methods 0.000 claims description 3
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- 239000010408 film Substances 0.000 description 127
- 230000005284 excitation Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 10
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
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- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
- H03H9/215—Crystal tuning forks consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/026—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the tuning fork type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0421—Modification of the thickness of an element
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0421—Modification of the thickness of an element
- H03H2003/0442—Modification of the thickness of an element of a non-piezoelectric layer
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
ここで、前記hは、本実施形態のパッケージ2の外形寸法、例えば、1.6mm×1.0mmの場合は、3μm≦h≦9μmである。
換言すれば、周波数調整用金属膜19の一部が除去された側の端部における、水晶26の素地から周波数調整用金属膜19の表面までの厚さh3が、前記端部以外の部分における、水晶26の素地から周波数調整用金属膜19の表面までの厚さhよりも厚く、かつ、前記端部における前記厚さh3と前記端部以外の部分における前記厚さhとの差h2が、前記端部以外の部分における前記厚さhの0.5倍以内である。
(1)周波数調整用金属膜19,20の突起部分27に荷重を加えて押し潰す工程は、上記実施形態のように、音叉型水晶振動片3を、ベース4へ実装する工程に限らず、他の工程で行ってもよい。
2 パッケージ
3 音叉型水晶振動片
4 ベース
5 蓋体
7 電極パッド
8 金属バンプ
10 基部
11 第1腕部
12 第2腕部
13 接合部
15 第1励振電極
16 第2励振電極
17,18 引出電極
19,20 周波数調整用金属膜
23 吸引ツール
24,25 腕先電極
26 水晶
27 ささくれ立った状態の突起部分
27a 押し潰された状態の突起部分
Claims (7)
- 基部と、該基部から延出する複数の腕部とを備える音叉型振動片を、収納部を有するパッケージに接合して実装する音叉型振動子の製造方法であって、
前記音叉型振動片の前記腕部の先端領域に、周波数調整用金属膜を形成する第1工程と、
前記音叉型振動片にビームを照射して、前記周波数調整用金属膜の一部を除去して周波数を調整する第2工程と、
前記一部が除去された前記周波数調整用金属膜に荷重を加えて加圧する第3工程と、
を含む音叉型振動子の製造方法。 - 前記第2工程では、前記周波数調整用金属膜の除去を、前記腕部の先端側から開始し、前記基部側へ向かって前記一部を除去し、
前記第3工程では、前記周波数調整用金属膜の内、少なくとも、前記一部が除去された側の端部に荷重を加えて加圧する、
請求項1に記載の音叉型振動子の製造方法。 - 前記第1工程では、前記音叉型振動片の前記腕部の表裏主面の一方の主面の前記先端領域に、前記周波数調整用金属膜を形成し、
前記第2工程では、前記音叉型振動片の前記腕部の他方の主面側から、前記ビームを照射して前記周波数調整用金属膜の前記一部を除去する、
請求項1または2に記載の音叉型振動子の製造方法。 - 前記第3工程では、前記音叉型振動片を、前記パッケージに接合して実装する際に、前記音叉型振動片を保持するツールによって、前記周波数調整用金属膜に荷重を加えて加圧する、
請求項1または2に記載の音叉型振動子の製造方法。 - 前記加圧するときには、前記ツールの保持面を、前記音叉型振動片の長手方向の一端部と、前記長手方向の他端部の前記周波数調整用金属膜とに圧接する、
請求項4に記載の音叉型振動子の製造方法。 - 前記第3工程は、前記周波数調整用金属膜に荷重を加えて加圧すると共に、熱及び超音波の少なくともいずれか一方を印加する、
請求項1または2に記載の音叉型振動子の製造方法。 - 前記周波数調整用金属膜の厚みが、3μm以上である、
請求項1または2に記載の音叉型振動子の製造方法。
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JP2016249756 | 2016-12-22 | ||
JP2016249756 | 2016-12-22 | ||
PCT/JP2017/039577 WO2018116651A1 (ja) | 2016-12-22 | 2017-11-01 | 音叉型振動片、音叉型振動子及びその製造方法 |
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JP2021007725A Pending JP2021073787A (ja) | 2016-12-22 | 2021-01-21 | 音叉型振動片及び音叉型振動子 |
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US (2) | US11563413B2 (ja) |
JP (2) | JP6915628B2 (ja) |
CN (2) | CN116318022A (ja) |
TW (1) | TWI741101B (ja) |
WO (1) | WO2018116651A1 (ja) |
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JP7180302B2 (ja) * | 2018-11-16 | 2022-11-30 | 株式会社大真空 | 圧電振動子 |
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JPH02220508A (ja) * | 1989-02-21 | 1990-09-03 | Matsushima Kogyo Co Ltd | 圧電振動子の周波数調整方法 |
JPH07120914B2 (ja) * | 1989-03-07 | 1995-12-20 | ミヨタ株式会社 | 音叉型圧電振動子の周波数調整方法 |
JPH10256409A (ja) * | 1997-03-10 | 1998-09-25 | Toyo Commun Equip Co Ltd | 圧電デバイスのパッケージの製造方法 |
JP2001284963A (ja) * | 2000-03-28 | 2001-10-12 | Toyo Commun Equip Co Ltd | 圧電発振器 |
JP3714228B2 (ja) | 2001-10-29 | 2005-11-09 | セイコーエプソン株式会社 | 圧電振動子及び圧電デバイスの製造方法 |
JP2003332872A (ja) * | 2002-05-14 | 2003-11-21 | Seiko Instruments Inc | 圧電振動子およびその製造方法 |
JP4375334B2 (ja) * | 2003-03-28 | 2009-12-02 | 株式会社大真空 | 音叉型振動子の周波数調整方法並びにその方法によって周波数調整された音叉型振動子 |
JP4406251B2 (ja) * | 2003-09-29 | 2010-01-27 | 京セラキンセキ株式会社 | 圧電振動子の製造方法 |
JP2006086702A (ja) * | 2004-09-15 | 2006-03-30 | Citizen Miyota Co Ltd | 音叉型振動子の周波数調整装置及び周波数調整方法、並びにその方法によって周波数調整された音叉型振動子 |
JP2007049434A (ja) * | 2005-08-10 | 2007-02-22 | Daishinku Corp | 圧電振動片および圧電振動デバイス |
US8330560B2 (en) * | 2007-08-06 | 2012-12-11 | Nihon Dempa Kogyo Co., Ltd. | Tuning-fork type crystal resonator and method of frequency adjustment thereof |
JP5170405B2 (ja) * | 2008-03-25 | 2013-03-27 | セイコーエプソン株式会社 | 圧電振動子の製造方法 |
JP2012120014A (ja) | 2010-12-02 | 2012-06-21 | Seiko Epson Corp | 圧電振動素子、その製造方法、圧電振動子及び圧電発振器 |
EP2624450B1 (en) * | 2011-02-25 | 2015-02-11 | Daishinku Corporation | Piezoelectric vibrating reed, piezoelectric vibrator, method for manufacturing piezoelectric vibrating reed, and method for manufacturing piezoelectric vibrator |
JP5799641B2 (ja) * | 2011-07-29 | 2015-10-28 | 株式会社村田製作所 | 弾性波装置 |
JP2013077911A (ja) * | 2011-09-29 | 2013-04-25 | Seiko Instruments Inc | 圧電振動子の製造方法及び圧電振動子、発振器、電子機器並びに電波時計 |
JP2016157892A (ja) * | 2015-02-26 | 2016-09-01 | 株式会社ディスコ | ウエーハの加工方法 |
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US11563413B2 (en) | 2023-01-24 |
WO2018116651A1 (ja) | 2018-06-28 |
US20220263492A1 (en) | 2022-08-18 |
CN116318022A (zh) | 2023-06-23 |
US20200067485A1 (en) | 2020-02-27 |
TW201830853A (zh) | 2018-08-16 |
CN109891743B (zh) | 2023-12-01 |
JPWO2018116651A1 (ja) | 2019-10-24 |
US11824509B2 (en) | 2023-11-21 |
CN109891743A (zh) | 2019-06-14 |
JP2021073787A (ja) | 2021-05-13 |
TWI741101B (zh) | 2021-10-01 |
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