JP6911013B2 - 超音波変換器アセンブリ - Google Patents
超音波変換器アセンブリ Download PDFInfo
- Publication number
- JP6911013B2 JP6911013B2 JP2018511677A JP2018511677A JP6911013B2 JP 6911013 B2 JP6911013 B2 JP 6911013B2 JP 2018511677 A JP2018511677 A JP 2018511677A JP 2018511677 A JP2018511677 A JP 2018511677A JP 6911013 B2 JP6911013 B2 JP 6911013B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- groove
- filler
- transducer assembly
- ultrasonic transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/067—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface which is used as, or combined with, an impedance matching layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
- G01N2291/0231—Composite or layered materials
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Molecular Biology (AREA)
- Veterinary Medicine (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Radiology & Medical Imaging (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Public Health (AREA)
- Biomedical Technology (AREA)
- Biophysics (AREA)
- Gynecology & Obstetrics (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562214185P | 2015-09-03 | 2015-09-03 | |
| US62/214,185 | 2015-09-03 | ||
| PCT/US2016/050171 WO2017040979A1 (en) | 2015-09-03 | 2016-09-02 | Ultrasound transducer assembly |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018532307A JP2018532307A (ja) | 2018-11-01 |
| JP2018532307A5 JP2018532307A5 (enExample) | 2019-10-10 |
| JP6911013B2 true JP6911013B2 (ja) | 2021-07-28 |
Family
ID=58188539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018511677A Active JP6911013B2 (ja) | 2015-09-03 | 2016-09-02 | 超音波変換器アセンブリ |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US10716542B2 (enExample) |
| EP (2) | EP3344147B1 (enExample) |
| JP (1) | JP6911013B2 (enExample) |
| KR (1) | KR102633430B1 (enExample) |
| CN (1) | CN107920797B (enExample) |
| WO (1) | WO2017040979A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9808830B2 (en) * | 2013-12-27 | 2017-11-07 | General Electric Company | Ultrasound transducer and ultrasound imaging system with a variable thickness dematching layer |
| KR20170090304A (ko) * | 2016-01-28 | 2017-08-07 | 삼성메디슨 주식회사 | 초음파 트랜스듀서 및 이를 포함하는 초음파 프로브 |
| USD831219S1 (en) * | 2017-07-31 | 2018-10-16 | Edan Instruments, Inc. | Transducer |
| US11678865B2 (en) | 2017-12-29 | 2023-06-20 | Fujifilm Sonosite, Inc. | High frequency ultrasound transducer |
| ES2997785T3 (en) * | 2018-07-31 | 2025-02-18 | Resonant Acoustics Int Inc | Ultrasonic transducer |
| WO2020043898A1 (en) * | 2018-08-31 | 2020-03-05 | Koninklijke Philips N.V. | Non-rectangular transducer arrays and associated devices, systems, and methods |
| WO2020107283A1 (zh) * | 2018-11-28 | 2020-06-04 | 深圳先进技术研究院 | 换能器组件及其制备方法 |
| CN109530196B (zh) * | 2018-11-28 | 2023-10-27 | 深圳先进技术研究院 | 换能器组件及其制备方法 |
| US11583259B2 (en) | 2018-12-19 | 2023-02-21 | Fujifilm Sonosite, Inc. | Thermal conductive layer for transducer face temperature reduction |
| CN113710164A (zh) * | 2019-03-15 | 2021-11-26 | 安科诺思公司 | 具有低粘度切口填充材料的超声换能器组件 |
| KR20230116960A (ko) * | 2019-03-25 | 2023-08-04 | 엑소 이미징, 인크. | 핸드헬드 초음파 영상 장치 |
| TWI869258B (zh) * | 2019-08-01 | 2025-01-01 | 加拿大商共振聲學國際股份有限公司 | 超音波傳感器 |
| TWI840394B (zh) * | 2019-08-01 | 2024-05-01 | 加拿大商共振聲學國際股份有限公司 | 超音波傳感器 |
| US20240017294A1 (en) * | 2019-11-18 | 2024-01-18 | Resonant Acoustics International Inc. | Ultrasonic transducers, backing structures and related methods |
| JP2021136675A (ja) * | 2020-02-28 | 2021-09-13 | 学校法人早稲田大学 | 圧電素子 |
| CN113180727B (zh) * | 2021-03-29 | 2023-03-03 | 聚融医疗科技(杭州)有限公司 | 一种填缝材料可自由选择的超声换能器及其制备方法 |
| CN115414068B (zh) * | 2022-09-26 | 2025-07-18 | 武汉联影医疗科技有限公司 | 一种用于超声换能器的匹配层和制备方法 |
| US20230201876A1 (en) * | 2021-12-23 | 2023-06-29 | Fujifilm Sonosite, Inc. | Array architecture and interconnection for transducers |
| CN116553469A (zh) * | 2022-03-24 | 2023-08-08 | 台湾积体电路制造股份有限公司 | 混合超声换能器系统 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5315486U (enExample) | 1976-07-21 | 1978-02-08 | ||
| JPS6029731B2 (ja) * | 1977-04-26 | 1985-07-12 | 旭化成株式会社 | 重縮合方法 |
| JPS5925500A (ja) * | 1982-08-02 | 1984-02-09 | Matsushita Electric Ind Co Ltd | 超音波探触子の製造方法 |
| JPS6139700A (ja) * | 1984-07-30 | 1986-02-25 | Shimadzu Corp | 超音波探触子の製造方法 |
| JPS6139700U (ja) | 1984-08-15 | 1986-03-13 | 三菱重工業株式会社 | 機関室給気装置 |
| EP0379229B1 (en) | 1985-05-20 | 1994-07-27 | Matsushita Electric Industrial Co., Ltd. | Ultrasonic probe |
| JP2794720B2 (ja) | 1988-08-23 | 1998-09-10 | 松下電器産業株式会社 | 複合圧電振動子 |
| US5311095A (en) * | 1992-05-14 | 1994-05-10 | Duke University | Ultrasonic transducer array |
| US5553035A (en) * | 1993-06-15 | 1996-09-03 | Hewlett-Packard Company | Method of forming integral transducer and impedance matching layers |
| US5648942A (en) * | 1995-10-13 | 1997-07-15 | Advanced Technology Laboratories, Inc. | Acoustic backing with integral conductors for an ultrasonic transducer |
| JP3673035B2 (ja) * | 1996-10-25 | 2005-07-20 | 株式会社東芝 | 超音波トランスジューサ |
| US6359375B1 (en) * | 1998-05-06 | 2002-03-19 | Siemens Medical Solutions Usa, Inc. | Method to build a high bandwidth, low crosstalk, low EM noise transducer |
| JP2003175036A (ja) * | 2001-12-11 | 2003-06-24 | Aloka Co Ltd | 超音波探触子及び超音波診断装置 |
| JP3908595B2 (ja) * | 2002-05-17 | 2007-04-25 | アロカ株式会社 | 超音波探触子 |
| US20040190377A1 (en) * | 2003-03-06 | 2004-09-30 | Lewandowski Robert Stephen | Method and means for isolating elements of a sensor array |
| US7368852B2 (en) * | 2003-08-22 | 2008-05-06 | Siemens Medical Solutions Usa, Inc. | Electrically conductive matching layers and methods |
| US7285897B2 (en) * | 2003-12-31 | 2007-10-23 | General Electric Company | Curved micromachined ultrasonic transducer arrays and related methods of manufacture |
| US20070222339A1 (en) * | 2004-04-20 | 2007-09-27 | Mark Lukacs | Arrayed ultrasonic transducer |
| JP2005340903A (ja) * | 2004-05-24 | 2005-12-08 | Olympus Corp | 超音波トランスデューサとその製造方法 |
| US20060028099A1 (en) * | 2004-08-05 | 2006-02-09 | Frey Gregg W | Composite acoustic matching layer |
| JP4933392B2 (ja) * | 2007-04-02 | 2012-05-16 | 富士フイルム株式会社 | 超音波探触子及びその製造方法 |
| JP5002402B2 (ja) * | 2007-10-03 | 2012-08-15 | 株式会社東芝 | 超音波探触子及び超音波診断装置 |
| US8378557B2 (en) * | 2010-07-09 | 2013-02-19 | General Electric Company | Thermal transfer and acoustic matching layers for ultrasound transducer |
| JP5643667B2 (ja) * | 2011-01-28 | 2014-12-17 | 株式会社東芝 | 超音波トランスデューサ、超音波プローブおよび超音波トランスデューサの製造方法 |
| JP5468564B2 (ja) * | 2011-03-30 | 2014-04-09 | 富士フイルム株式会社 | 超音波探触子および超音波診断装置 |
| JP6548201B2 (ja) * | 2011-09-16 | 2019-07-24 | ゼネラル・エレクトリック・カンパニイ | 超音波変換器のための熱移動および音響整合層 |
| KR101269459B1 (ko) * | 2011-12-13 | 2013-05-30 | 삼성전자주식회사 | 초음파 프로브 및 그 제조방법 |
| KR101477544B1 (ko) * | 2012-01-02 | 2014-12-31 | 삼성전자주식회사 | 초음파 트랜스듀서, 초음파 프로브, 및 초음파 진단장치 |
| EP2671515A4 (en) * | 2012-01-30 | 2015-11-11 | Olympus Corp | ULTRASONIC TRANSMITTER GROUP, METHOD FOR PRODUCING THE ULTRASONIC TRANSMITTER GROUP AND ULTRASOUND DOSCOPE |
| JP6029731B2 (ja) | 2012-02-07 | 2016-11-24 | 富士フイルム株式会社 | 超音波探触子 |
| JP5924298B2 (ja) * | 2013-03-19 | 2016-05-25 | コニカミノルタ株式会社 | 超音波探触子及び超音波画像診断装置 |
| JP2014188009A (ja) * | 2013-03-26 | 2014-10-06 | Konica Minolta Inc | 超音波探触子、超音波画像診断装置及び超音波探触子の製造方法 |
| JP6214333B2 (ja) * | 2013-10-23 | 2017-10-18 | 三菱鉛筆株式会社 | 音響整合層とその製造方法 |
| JP5665948B1 (ja) * | 2013-11-14 | 2015-02-04 | 株式会社フジクラ | 携帯型電子機器の冷却構造 |
| CN105917157B (zh) | 2013-12-02 | 2019-08-16 | 株式会社东芝 | 漏水抑制装置、漏水抑制系统及计算机可读取的存储介质 |
| JP6641723B2 (ja) | 2015-05-08 | 2020-02-05 | コニカミノルタ株式会社 | 超音波振動子およびその製造方法、超音波探触子ならびに超音波撮像装置 |
-
2016
- 2016-09-02 JP JP2018511677A patent/JP6911013B2/ja active Active
- 2016-09-02 KR KR1020187005215A patent/KR102633430B1/ko active Active
- 2016-09-02 CN CN201680049560.3A patent/CN107920797B/zh active Active
- 2016-09-02 EP EP16843099.9A patent/EP3344147B1/en active Active
- 2016-09-02 EP EP23163129.2A patent/EP4219026A1/en active Pending
- 2016-09-02 US US15/256,029 patent/US10716542B2/en active Active
- 2016-09-02 WO PCT/US2016/050171 patent/WO2017040979A1/en not_active Ceased
-
2020
- 2020-07-20 US US16/933,822 patent/US11890140B2/en active Active
-
2024
- 2024-01-26 US US18/424,618 patent/US20240164754A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20170065253A1 (en) | 2017-03-09 |
| WO2017040979A1 (en) | 2017-03-09 |
| US20240164754A1 (en) | 2024-05-23 |
| US11890140B2 (en) | 2024-02-06 |
| US10716542B2 (en) | 2020-07-21 |
| EP3344147A1 (en) | 2018-07-11 |
| EP3344147A4 (en) | 2019-05-22 |
| US20200345328A1 (en) | 2020-11-05 |
| CN107920797B (zh) | 2021-02-12 |
| JP2018532307A (ja) | 2018-11-01 |
| KR102633430B1 (ko) | 2024-02-02 |
| CN107920797A (zh) | 2018-04-17 |
| KR20180038467A (ko) | 2018-04-16 |
| EP3344147B1 (en) | 2023-11-01 |
| EP4219026A1 (en) | 2023-08-02 |
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