Classifications

• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
  • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
  • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
  • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
  • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
  • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
  • A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
  • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
  • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
  • B06B1/067—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface which is used as, or combined with, an impedance matching layer
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
  • G01N29/22—Details, e.g. general constructional or apparatus details
  • G01N29/24—Probes
  • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
  • G01N29/22—Details, e.g. general constructional or apparatus details
  • G01N29/24—Probes
  • G01N29/2437—Piezoelectric probes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
  • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
  • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
  • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
  • H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
  • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
  • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N2291/00—Indexing codes associated with group G01N29/00
  • G01N2291/02—Indexing codes associated with the analysed material
  • G01N2291/023—Solids
  • G01N2291/0231—Composite or layered materials

Definitions

• the disclosed technology relates generally to ultrasound transducers, and more specifically ultrasound transducer assemblies configured for use with ultrasound imaging systems.
• FIG. 1A is a side view of an ultrasound probe having an ultrasound transducer assembly and configured in accordance with an embodiment of the disclosed technology.
• FIG. 1 B is a schematic isometric view of a portion of the ultrasound transducer assembly of FIG. 1 A.
• FIG. 2 is a schematic section view of the ultrasound transducer assembly of FIGS. 1 A and 1 B along the 2-2' line shown in FIG. 1 B.
• FIG. 3 is a schematic section view of the ultrasound transducer assembly of FIGS. 1 A and 1 B along the 3-3' line shown in FIG. 1 B.
• FIG. 4A is a schematic section view of an ultrasound transducer assembly along the 3-3' line shown in FIG. 1 B and configured in accordance with another embodiment of the disclosed technology.
• FIG. 4B is an enlarged view of a portion of FIG. 4A.
• FIG. 5A is schematic section view of an ultrasound transducer assembly along the 3-3' line shown in FIG. 1 B and configured in accordance with another
• FIG. 5B is an enlarged view of a portion of FIG. 5A.
• FIG. 6A is a schematic section view of an ultrasound transducer assembly along the 3-3' line shown in FIG. 1 B and configured in accordance with another embodiment of the disclosed technology.
• FIG. 6B is an enlarged view of a portion of FIG. 6A.
• FIG. 7 is a schematic section view of an ultrasound transducer assembly along the 3-3' line shown in FIG. 1 B and configured in accordance with another embodiment of the disclosed technology.
• FIG. 8 is a flow diagram of a method of constructing an ultrasound transducer assembly configured in accordance with an embodiment of the disclosed technology.
• the present technology is generally directed to ultrasound transducer assemblies configured for use with ultrasound imaging systems.
• ultrasound transducer assemblies configured for use with ultrasound imaging systems.
• one embodiment for example,
• FIGS. 1 A-8 Certain details are set forth in the following description and in FIGS. 1 A-8 to provide a thorough understanding of various embodiments of the invention. Other details describing well-known methods and systems often associated with ultrasound imaging, however, are not set forth below to avoid unnecessarily obscuring the description of the various embodiments of the invention. Many of the details, dimensions, angles and other features shown in the Figures are merely illustrative of particular embodiments of the disclosure. Accordingly, other embodiments can have
• FIG. 1A is a side view of an ultrasound transducer probe 100 having an ultrasound transducer assembly 120 configured in accordance with an embodiment of the disclosed technology.
• FIG. 1 B is a schematic isometric side view of a portion of the transducer assembly 120 showing the azimuthal (e.g., along an x-axis), elevation (e.g. , along a y-axis) and axial (e.g. , along a z-axis) dimensions of the transducer assembly 120.
• the probe 100 includes an enclosure 1 10 extending between a distal end portion 1 12 and a proximal end portion 1 14.
• the enclosure 1 10 is configured to carry or house system electronics 1 16 (e.g., one or more processors, integrated circuits, ASICs, FPGAs, beamformers, batteries and/or other power sources) disposed in an interior portion or cavity of the enclosure 1 10.
• system electronics 1 16 e.g., one or more processors, integrated circuits, ASICs, FPGAs, beamformers, batteries and/or other power sources.
• a transducer assembly 120 having one or more transducer elements is electrically coupled to the system electronics 1 16.
• the transducer assembly 120 transmits ultrasound energy from the one or more transducer elements toward a subject and receives ultrasound echoes from the subject.
• the ultrasound echoes are converted into electrical signals by the one or more transducer elements and electrically transmitted to the system electronics 1 16 and to electronics (e.g., one or more processors, memory modules, beamformers, FPGAs) in the ultrasound imaging system
• 1 17 configured to process the electrical signals and form one or more ultrasound images.
• Capturing ultrasound data from a subject using an exemplary transducer assembly (e.g., the transducer assembly 120) generally includes generating ultrasound,
• 132592299.1 transmitting ultrasound into the subject, and receiving ultrasound reflected by the subject.
• a wide range of frequencies of ultrasound may be used to capture ultrasound data, such as, for example, low frequency ultrasound (e.g., less than 15 MHz) and/or high frequency ultrasound (e.g., greater than or equal to 15 MHz) can be used.
• low frequency ultrasound e.g., less than 15 MHz
• high frequency ultrasound e.g., greater than or equal to 15 MHz
• Those of ordinary skill in the art can readily determine which frequency range to use based on factors such as, for example, but not limited to, depth of imaging and/or desired resolution.
• FIG. 2 is a schematic section view of the transducer assembly 120 of FIGS. 1 A and 1 B shown along the 2-2' line shown in FIG. 1 B.
• a transducer layer 230 includes one or more transducer elements configured to emit ultrasound energy at a center operating frequency (e.g., between 1 MHz and about 10 MHz).
• the transducer layer 230 is comprises a piezoelectric material (e.g. , lead zirconate titanate, i.e. PZT).
• the transducer layer 230 comprises a piezoelectric micromachined ultrasound transducer (PMUT) or a capacitive micromachined ultrasound transducer (CMUT).
• the transducer layer 230 comprises an electrostrictive ceramic material.
• the transducer layer 230 comprises another suitable transducer material.
• An acoustic lens 222 overlies the transducer layer 230 and comprises an acoustically transparent material such as, for example, room temperature vulcanization silicone (RTV) or another suitable acoustic material.
• RTV room temperature vulcanization silicone
• a plurality of matching layers 224 is positioned between the lens 222 and the transducer layer 230.
• a backing layer 240 underlies the transducer layer 230 and is configured to absorb and dissipate acoustic and thermal energy produced by transducer elements of the transducer layer 230.
• the backing layer 240 comprises a loaded epoxy (e.g., an epoxy loaded with tungsten particles) and/or another suitable material having one or more plates (not shown) extending therethrough.
• a dematching layer 234 is positioned between the transducer layer 230 and the backing layer 240.
• the dematching layer 234 is configured to reflect rearward propagating ultrasound energy from the transducer layer 230 (i.e. , toward the backing layer 240) back toward the front of the transducer assembly 120 (i.e., toward the lens 222) and away from the backing layer 240.
• the dematching layer 234 comprises a material that has an acoustic impedance significantly different
• the dematching layer 234 comprises tungsten carbide (WC), which has an acoustic impedance of approximately 100 MRayls-significantly greater than the acoustic impedance of PZT (approximately 34 MRayls).
• WC tungsten carbide
• the dematching layer 234 includes one or more materials having a lower acoustic impedance than the acoustic impedance of WC (e.g., approximately 100 MRayls) and the transducer layer 230.
• the dematching layer 234 comprises aluminum nitride (AIN), which has an acoustical impedance of approximately 33 MRayls.
• the dematching layer 234 comprises polycrystalline silicon, which has an acoustical impedance of approximately 22 MRayls.
• the dematching layer 234 comprises copper loaded graphite having an acoustical impedance between about 8MRayls and about 15MRayls, or about 10.7MRayls. In some embodiments, another suitable dematching layer can be used.
• a plurality of matching layers 224 are positioned between the transducer layer 230 and the lens 222.
• an acoustical impedance e.g., between about 20 MRayls and about 35 MRayls
• an acoustical impedance e.g., between about 10 MRayls and about 20 MRayls
• the acoustic impedance of the first matching layer 224A is greater than an acoustical impedance (e.g., between about 5 MRayls and about 10 MRayls) of the second matching layer 224B. In some embodiments, the acoustical impedance of the second matching layer 224B is greater than an acoustical impedance (between about 2 MRayls and about 5 MRayls) of the third matching layer 224C.
• the transducer assembly 120 includes three matching layers 224. In some embodiments, however, the transducer assembly 120 includes two or fewer matching layers 224. In other embodiments, the transducer assembly 120 includes four or more matching layers 224.
• FIG. 3 is a schematic section view of the transducer assembly 120 of FIG. 1 B along the 3-3' line shown in FIG. 1 B (i.e. , parallel to the azimuthal axis), and configured in accordance with various embodiments of the disclosed technology.
• first kerfs 342 and the second kerfs 344 can be configured to isolate individual elements of the transducer layer 230 and/or attenuate acoustic crosstalk between the individual elements.
• the first kerfs 342 and the second kerfs 344 are at least partially filled with a filler 348.
• the first kerfs 342 extend through the matching layers 224 while the second kerfs 344 extend through the matching layers 224, the transducer layer 230 and the dematching layer 234, and extend into the backing layer 240.
• the first kerfs 342 and the second kerfs 344 can extend to lesser or greater depths relative to the axial direction than shown in FIG. 3.
• the first kerfs 342 and the second kerfs 344 have the same depths relative to the axial direction but are filled with different materials.
• the first kerfs 342 and the second kerf 344 have a same or similar width (e.g., between about 0.01 mm and about 0.1 mm). In other embodiments, however, the first kerfs 342 have a first width that differs from a second width of the second kerfs 344.
• the filler 348 comprises one or more materials that fill at least a portion of the first kerfs 342 and the second kerfs 344.
• the depths of the filler 348 in individual first kerfs 342 is substantially the same.
• the depths of the filler 348 in individual second kerfs 344 is also substantially the same.
• the depths of the filler material 348 in the individual first kerfs 342 and in the individual second kerfs vary in an elevation direction.
• an apodized (stepped or curved) depth profile from the edges towards center of the transducer assembly 120 can be utilized.
• the first kerfs 342 and the second kerfs 344 are filled with different filler materials.
• the filler 348 comprises a composite material that includes microballoons suspended in an epoxy or a polymer.
• the microballoons can
• 132592299.1 include glass or plastic microspheres surrounding or encapsulating a gas (e.g., air, or a hydrocarbon gas) or be solid microspheres.
• the microballoons or microspheres can be mixed with an epoxy or polymer in varying ratios to achieve composite materials having varying consistencies and densities.
• a "slurry" composite material is mixed with microballoons and epoxy or a polymer.
• the filler 348 includes a composite material comprising one or more materials, for example, having a density between about 0.0005 g/cm 3 and about 0.1 g/cm 3 or between about 0.001 g/cm 3 and about 0.01 g/cm 3 or about 0.0012 g/cm 3 .
• the filler material comprises a composite material having an acoustical impedance within 10% or less of an acoustical impedance of air.
• the filler 348 comprises microballoons, an aerogel or a foam.
• the filler 348 comprises a composite material that has a graduated acoustical impedance such that the material has an acoustical impedance that varies in the axial direction of the transducer assembly 120.
• the graduated acoustical impedance material has an acoustical impedance that decreases with increasing height in the axial direction.
• conventional transducer assemblies may include piezoelectric transducers, two matching layers, no dematching layer and kerfs filled with conventional material (e.g., a lens material such as RTV). Such conventional transducer assemblies can have a typical -6dB bandwidth of 75%.
• Embodiments of the disclosed technology are expected to provide a benefit of a significant performance increase in bandwidth and efficiency compared to conventional piezoelectric transducer assemblies.
• Certain embodiments of the disclosed technology for example, include transducer assemblies that include a -6dB fractional bandwidth of up to 120% and upto a 8dB sensitivity gain relative to conventional piezoelectric transducer designs.
• Embodiments of the disclosed technology are expected to provide an additional benefit of higher mechanical indices (and thus deeper imaging penetration) with lower transmit voltages with similar or identical surface temperatures as conventional piezoelectric transducer assemblies.
• FIGS 4A, 5A, 6A and 7 are schematic section views along the 3-3' line shown in FIG. 1 B (i.e., parallel to the azimuthal direction) of transducer assemblies
• FIGS. 4B, 5B and 6B are enlarged views of corresponding portions FIGS. 4A, 5A and 6A.
• a transducer assembly 420 includes the first kerfs 342 and the second kerfs 344 having a groove 452 formed in the filler 348.
• the groove 452 has a width in the azimuthal direction substantially similar to widths of the first kerfs 342 and the second kerfs 344.
• the first kerfs 342 and the second kerfs 344 can have different groove depths.
• the groove 452 is filled with the same material (e.g., RTV) as the lens 222. In other embodiments, however, another material may be used.
• a transducer assembly 520 includes the first kerfs 342 and the second kerfs having a portion or groove 554 formed in the filler 348.
• the groove 554 has a smaller width in the azimuthal direction (e.g., 1/2 as wide, 1/4 as wide, 1/8 as wide) than the widths of the first kerfs 342 and the second kerfs 344.
• the first kerfs 342 and the second kerfs 344 can have differing groove depths.
• the groove 554 is filled with the same material (e.g., RTV) as the lens 222. In other embodiments, however, another material may be used.
• an ultrasound transducer assembly 620 includes the first kerfs 342 and the second kerfs having a portion or groove 656 formed in the filler 348.
• the groove 656 has a smaller width in the azimuthal direction (e.g., 1/2 as wide, 1/4 as wide, 1/8 as wide) than the widths of the first kerfs 342 and the second kerfs 344.
• the first kerfs 342 and the second kerfs 344 can have differing groove depths.
• the groove 656 is filled with the same material (e.g., RTV) as the lens 222. In other embodiments, however, another material may be used.
• an ultrasound transducer assembly 720 includes the first kerfs 342 and the second kerfs having a first filler material 752 (e.g. , a polymer) above a second filler material 754 (e.g., a composite material comprising microballoons).
• first filler material 752 e.g. , a polymer
• second filler material 754 e.g., a composite material comprising microballoons.
• grooves can be formed in the first filler material 752 as described above in reference to FIGS. 4A-6B.
• FIG. 8 is a flow diagram of a process 800 of constructing an ultrasound transducer assembly in accordance with an embodiment of the disclosed technology.
• the process 800 begins.
• the process 800 bonds a lower surface of a transducer layer (e.g., the transducer layer 230 of FIG. 2) to an upper surface of the dematching layer using an adhesive (e.g., an epoxy, a polymer).
• the process 800 bonds a first matching layer to the transducer layer and bonds one or more additional matching layer to the first matching layer.
• the process 800 can optionally bond a lower surface of a dematching layer (e.g., the dematching layer 234 of FIG. 2) to an upper surface of a backing layer (e.g., the backing layer 240 of FIG. 2) using an epoxy.
• the process 800 performs one or more cuts to form one or more kerfs (e.g., the first kerfs 342 or the second kerfs 344 of FIG. 3) in the transducer assembly.
• the process 800 inserts or otherwise fills at least a portion of the kerfs formed at block 850 with a filler material (e.g., a filler material comprising microballoons).
• the process 800 determines whether one or more grooves is to be formed in the filler material inserted into the kerfs formed at block 860. If so, then the process 800 proceeds to block 875 and one or more kerfs are formed in the filler material inserted into the kerfs at block 860 (e.g., the grooves 452 of FIGS. 4A and 4B, the grooves 554 of FIGS. 5A and 5B and/or the grooves 656 of FIGS. 6A and 6B).
• a lens material e.g., RTV or another suitable lens material
• transducer assemblies configured in accordance with the disclosed technology may include fewer than three matching layers or four or more matching layers. In other implementations, transducer assemblies can be configured in accordance with the disclosed technology without a dematching layer.

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• 2016
  • 2016-09-02 JP JP2018511677A patent/JP6911013B2/ja active Active
  • 2016-09-02 KR KR1020187005215A patent/KR102633430B1/ko active Active
  • 2016-09-02 CN CN201680049560.3A patent/CN107920797B/zh active Active
  • 2016-09-02 EP EP16843099.9A patent/EP3344147B1/en active Active
  • 2016-09-02 EP EP23163129.2A patent/EP4219026A1/en active Pending
  • 2016-09-02 US US15/256,029 patent/US10716542B2/en active Active
  • 2016-09-02 WO PCT/US2016/050171 patent/WO2017040979A1/en not_active Ceased
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