JP6905778B2 - ボンディングヘッド - Google Patents
ボンディングヘッド Download PDFInfo
- Publication number
- JP6905778B2 JP6905778B2 JP2020535813A JP2020535813A JP6905778B2 JP 6905778 B2 JP6905778 B2 JP 6905778B2 JP 2020535813 A JP2020535813 A JP 2020535813A JP 2020535813 A JP2020535813 A JP 2020535813A JP 6905778 B2 JP6905778 B2 JP 6905778B2
- Authority
- JP
- Japan
- Prior art keywords
- arm
- bonding head
- base
- load sensor
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001514 detection method Methods 0.000 claims description 14
- 230000005484 gravity Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 4
- 230000004043 responsiveness Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Description
Claims (6)
- 上下方向に移動するベースと、
一端にボンディングツールが取り付けられ、前記ベースに対して水平軸の回りに回転自在に取りつけられるアームと、
前記アームの他端と前記ベースとの間に取り付けられた初期張力付きのばねと、
前記ばねの付勢力に対抗して前記アームの回転を拘束するストッパと、
前記ボンディングツールに印加される上方向の接地荷重を検出する荷重センサと、を備え、
前記荷重センサは、前記ストッパにより前記アームの回転が拘束されている状態で接地検出を行うこと、
を特徴とするボンディングヘッド。 - 請求項1に記載のボンディングヘッドであって、
前記水平軸は、軸方向の中心線が前記アームの重心を通るように配置されていること、
を特徴とするボンディングヘッド。 - 請求項1または2に記載のボンディングヘッドであって、
前記ストッパは、前記アームの他端側が当接する前記ベースの部分であり、
前記荷重センサは、前記ベースと前記アームとの間に前記ばねと直列に接続されていること、
を特徴とするボンディングヘッド。 - 請求項3に記載のボンディングヘッドであって、
前記荷重センサは、引張荷重を検出すること、
を特徴とするボンディングヘッド。 - 請求項1に記載のボンディングヘッドであって、
前記アームは、前記ベースから下方向に突出したブラケットに回転自在に取り付けられ、
前記ストッパは、前記ブラケットから前記アームの先端側に向かって突出した部材であり、
前記荷重センサは、前記ブラケットと前記ベースとの間に挟みこまれていること、
を特徴とするボンディングヘッド。 - 請求項5に記載のボンディングヘッドであって、
前記荷重センサは、圧縮荷重を検出すること、
を特徴とするボンディングヘッド。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018147318 | 2018-08-06 | ||
JP2018147318 | 2018-08-06 | ||
PCT/JP2019/030995 WO2020032068A1 (ja) | 2018-08-06 | 2019-08-06 | ボンディングヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020032068A1 JPWO2020032068A1 (ja) | 2021-01-07 |
JP6905778B2 true JP6905778B2 (ja) | 2021-07-21 |
Family
ID=69413497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020535813A Active JP6905778B2 (ja) | 2018-08-06 | 2019-08-06 | ボンディングヘッド |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6905778B2 (ja) |
KR (1) | KR102399934B1 (ja) |
CN (1) | CN112585732A (ja) |
TW (1) | TWI711089B (ja) |
WO (1) | WO2020032068A1 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085842U (ja) * | 1983-11-18 | 1985-06-13 | 株式会社新川 | ダイボンダ−のコレツトタツチ検出機構 |
GB8826488D0 (en) * | 1988-11-11 | 1988-12-14 | Emhart Deutschland | Quality control for wire bonding |
JP2501946B2 (ja) * | 1990-09-26 | 1996-05-29 | 三菱電機株式会社 | ダイボンド装置およびその制御方法 |
JPH086352Y2 (ja) * | 1991-06-03 | 1996-02-21 | 光洋電子工業株式会社 | 非接触検出器の取付構造 |
JP3005786B2 (ja) | 1993-07-26 | 2000-02-07 | 株式会社新川 | チップボンデイング方法及び装置 |
JP2002110706A (ja) * | 2000-09-27 | 2002-04-12 | Nidec Tosok Corp | ボンディング装置 |
JP2008270591A (ja) * | 2007-04-23 | 2008-11-06 | Shinkawa Ltd | ダイボンダにおける湾曲回路基板の固定方法及びプログラム |
CN101836525B (zh) * | 2007-11-06 | 2012-08-29 | 松下电器产业株式会社 | 零件安装机、零件装配头及零件装配方法 |
JP5762185B2 (ja) * | 2011-07-12 | 2015-08-12 | 株式会社新川 | ダイボンディング装置 |
JP5997448B2 (ja) * | 2012-01-31 | 2016-09-28 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
CN107289872A (zh) | 2017-06-28 | 2017-10-24 | 京东方科技集团股份有限公司 | 测高装置 |
-
2019
- 2019-08-06 CN CN201980051929.8A patent/CN112585732A/zh active Pending
- 2019-08-06 KR KR1020207030918A patent/KR102399934B1/ko active IP Right Grant
- 2019-08-06 JP JP2020535813A patent/JP6905778B2/ja active Active
- 2019-08-06 WO PCT/JP2019/030995 patent/WO2020032068A1/ja active Application Filing
- 2019-08-06 TW TW108127957A patent/TWI711089B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102399934B1 (ko) | 2022-05-19 |
CN112585732A (zh) | 2021-03-30 |
KR20200135515A (ko) | 2020-12-02 |
JPWO2020032068A1 (ja) | 2021-01-07 |
TWI711089B (zh) | 2020-11-21 |
WO2020032068A1 (ja) | 2020-02-13 |
TW202008474A (zh) | 2020-02-16 |
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