KR102399934B1 - 본딩 헤드 - Google Patents
본딩 헤드 Download PDFInfo
- Publication number
- KR102399934B1 KR102399934B1 KR1020207030918A KR20207030918A KR102399934B1 KR 102399934 B1 KR102399934 B1 KR 102399934B1 KR 1020207030918 A KR1020207030918 A KR 1020207030918A KR 20207030918 A KR20207030918 A KR 20207030918A KR 102399934 B1 KR102399934 B1 KR 102399934B1
- Authority
- KR
- South Korea
- Prior art keywords
- arm
- base
- spring
- load sensor
- load
- Prior art date
Links
- 238000001514 detection method Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims 3
- 230000000452 restraining effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 4
- 230000004043 responsiveness Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018147318 | 2018-08-06 | ||
JPJP-P-2018-147318 | 2018-08-06 | ||
PCT/JP2019/030995 WO2020032068A1 (ja) | 2018-08-06 | 2019-08-06 | ボンディングヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20200135515A KR20200135515A (ko) | 2020-12-02 |
KR102399934B1 true KR102399934B1 (ko) | 2022-05-19 |
Family
ID=69413497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207030918A KR102399934B1 (ko) | 2018-08-06 | 2019-08-06 | 본딩 헤드 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6905778B2 (ja) |
KR (1) | KR102399934B1 (ja) |
CN (1) | CN112585732A (ja) |
TW (1) | TWI711089B (ja) |
WO (1) | WO2020032068A1 (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107289872A (zh) | 2017-06-28 | 2017-10-24 | 京东方科技集团股份有限公司 | 测高装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085842U (ja) * | 1983-11-18 | 1985-06-13 | 株式会社新川 | ダイボンダ−のコレツトタツチ検出機構 |
GB8826488D0 (en) * | 1988-11-11 | 1988-12-14 | Emhart Deutschland | Quality control for wire bonding |
JP2501946B2 (ja) * | 1990-09-26 | 1996-05-29 | 三菱電機株式会社 | ダイボンド装置およびその制御方法 |
JPH086352Y2 (ja) * | 1991-06-03 | 1996-02-21 | 光洋電子工業株式会社 | 非接触検出器の取付構造 |
JP3005786B2 (ja) | 1993-07-26 | 2000-02-07 | 株式会社新川 | チップボンデイング方法及び装置 |
JP2002110706A (ja) * | 2000-09-27 | 2002-04-12 | Nidec Tosok Corp | ボンディング装置 |
JP2008270591A (ja) * | 2007-04-23 | 2008-11-06 | Shinkawa Ltd | ダイボンダにおける湾曲回路基板の固定方法及びプログラム |
KR20100085030A (ko) * | 2007-11-06 | 2010-07-28 | 파나소닉 주식회사 | 부품 실장기, 부품 장착 헤드 및 부품 장착 방법 |
JP5762185B2 (ja) * | 2011-07-12 | 2015-08-12 | 株式会社新川 | ダイボンディング装置 |
JP5997448B2 (ja) * | 2012-01-31 | 2016-09-28 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
-
2019
- 2019-08-06 JP JP2020535813A patent/JP6905778B2/ja active Active
- 2019-08-06 TW TW108127957A patent/TWI711089B/zh active
- 2019-08-06 CN CN201980051929.8A patent/CN112585732A/zh active Pending
- 2019-08-06 WO PCT/JP2019/030995 patent/WO2020032068A1/ja active Application Filing
- 2019-08-06 KR KR1020207030918A patent/KR102399934B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107289872A (zh) | 2017-06-28 | 2017-10-24 | 京东方科技集团股份有限公司 | 测高装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20200135515A (ko) | 2020-12-02 |
TWI711089B (zh) | 2020-11-21 |
JP6905778B2 (ja) | 2021-07-21 |
JPWO2020032068A1 (ja) | 2021-01-07 |
TW202008474A (zh) | 2020-02-16 |
WO2020032068A1 (ja) | 2020-02-13 |
CN112585732A (zh) | 2021-03-30 |
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E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |