TWI711089B - 接合頭 - Google Patents

接合頭 Download PDF

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Publication number
TWI711089B
TWI711089B TW108127957A TW108127957A TWI711089B TW I711089 B TWI711089 B TW I711089B TW 108127957 A TW108127957 A TW 108127957A TW 108127957 A TW108127957 A TW 108127957A TW I711089 B TWI711089 B TW I711089B
Authority
TW
Taiwan
Prior art keywords
arm
base
spring
load sensor
load
Prior art date
Application number
TW108127957A
Other languages
English (en)
Chinese (zh)
Other versions
TW202008474A (zh
Inventor
前田徹
高山晋
Original Assignee
日商新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新川股份有限公司 filed Critical 日商新川股份有限公司
Publication of TW202008474A publication Critical patent/TW202008474A/zh
Application granted granted Critical
Publication of TWI711089B publication Critical patent/TWI711089B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
TW108127957A 2018-08-06 2019-08-06 接合頭 TWI711089B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018147318 2018-08-06
JP2018-147318 2018-08-06

Publications (2)

Publication Number Publication Date
TW202008474A TW202008474A (zh) 2020-02-16
TWI711089B true TWI711089B (zh) 2020-11-21

Family

ID=69413497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108127957A TWI711089B (zh) 2018-08-06 2019-08-06 接合頭

Country Status (5)

Country Link
JP (1) JP6905778B2 (ja)
KR (1) KR102399934B1 (ja)
CN (1) CN112585732B (ja)
TW (1) TWI711089B (ja)
WO (1) WO2020032068A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984730A (en) * 1988-11-11 1991-01-15 Emhart Inc. Quality control for wire bonding
TW200842991A (en) * 2007-04-23 2008-11-01 Shinkawa Kk Method for fixing bent circuit board of die bonder and die bonder apparatus
TW201308459A (zh) * 2011-07-12 2013-02-16 Shinkawa Kk 晶粒接合裝置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085842U (ja) * 1983-11-18 1985-06-13 株式会社新川 ダイボンダ−のコレツトタツチ検出機構
JP2501946B2 (ja) * 1990-09-26 1996-05-29 三菱電機株式会社 ダイボンド装置およびその制御方法
JPH086352Y2 (ja) * 1991-06-03 1996-02-21 光洋電子工業株式会社 非接触検出器の取付構造
JP3005786B2 (ja) 1993-07-26 2000-02-07 株式会社新川 チップボンデイング方法及び装置
JP2002110706A (ja) * 2000-09-27 2002-04-12 Nidec Tosok Corp ボンディング装置
CN1318203C (zh) * 2002-11-27 2007-05-30 宝洁公司 模拟压力机以及在工件上模拟环轧操作的方法
US7677118B2 (en) * 2005-07-01 2010-03-16 Yamaha Hatsudoki Kabushiki Kaisha Magnetostrictive load sensor and moveable object including the same
JP4572763B2 (ja) * 2005-07-08 2010-11-04 ソニー株式会社 ボンディング装置、半導体チップの運搬装置、ボンディング方法及び半導体チップの運搬方法
WO2009060560A1 (ja) * 2007-11-06 2009-05-14 Panasonic Corporation 部品実装機、部品装着ヘッド、および部品装着方法
JP4314313B1 (ja) * 2008-06-30 2009-08-12 株式会社新川 ボンディング装置
JP4275724B1 (ja) * 2008-07-16 2009-06-10 株式会社新川 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
JP5997448B2 (ja) * 2012-01-31 2016-09-28 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP5984561B2 (ja) * 2012-08-02 2016-09-06 株式会社エフテック 摩擦攪拌接合装置
JP5583179B2 (ja) * 2012-08-03 2014-09-03 株式会社カイジョー ボンディング装置
WO2017082219A1 (ja) * 2015-11-09 2017-05-18 株式会社Ihi 線形摩擦接合装置
CN107289872A (zh) 2017-06-28 2017-10-24 京东方科技集团股份有限公司 测高装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984730A (en) * 1988-11-11 1991-01-15 Emhart Inc. Quality control for wire bonding
TW200842991A (en) * 2007-04-23 2008-11-01 Shinkawa Kk Method for fixing bent circuit board of die bonder and die bonder apparatus
TW201308459A (zh) * 2011-07-12 2013-02-16 Shinkawa Kk 晶粒接合裝置

Also Published As

Publication number Publication date
KR20200135515A (ko) 2020-12-02
JP6905778B2 (ja) 2021-07-21
KR102399934B1 (ko) 2022-05-19
TW202008474A (zh) 2020-02-16
CN112585732A (zh) 2021-03-30
WO2020032068A1 (ja) 2020-02-13
CN112585732B (zh) 2024-10-11
JPWO2020032068A1 (ja) 2021-01-07

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