JP4314313B1 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
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- JP4314313B1 JP4314313B1 JP2008169797A JP2008169797A JP4314313B1 JP 4314313 B1 JP4314313 B1 JP 4314313B1 JP 2008169797 A JP2008169797 A JP 2008169797A JP 2008169797 A JP2008169797 A JP 2008169797A JP 4314313 B1 JP4314313 B1 JP 4314313B1
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- 238000000926 separation method Methods 0.000 claims description 3
- 210000001015 abdomen Anatomy 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
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- 230000002159 abnormal effect Effects 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
- H01L2224/85206—Direction of oscillation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01005—Boron [B]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
【解決手段】超音波振動子13の振動と共振して中心軸15の方向に縦振動する超音波ホーン12と、超音波ホーン12の振動の腹に取り付けられるキャピラリ17と、超音波ホーン12の振動の節に設けられるフランジ14と、ボンディングアーム21と、を備え、ボンディングアーム21の回転中心43とフランジ取り付け面22との間に取り付けられる荷重センサ31と、バンドパスフィルタによって荷重センサ31で取得した信号から超音波振動子の振動周波数近傍の周波数帯にある信号を抽出してキャピラリ17の先端17aに加わる超音波ホーン12の中心軸15方向の振動荷重を検出する振動荷重検出部50と、を有する。
【選択図】図1
Description
Claims (3)
- 基体部と、
超音波振動子の振動と共振して長手方向に縦振動する超音波ホーンと、
超音波ホーンの振動の腹に取り付けられるボンディングツールと、
超音波ホーンの振動の節に設けられるフランジと、
超音波ホーンのフランジが固定されるフランジ取り付け面を含み、ボンディングツール先端をボンディング対象に対して接離方向に動作させるように基体部に回転自在に取り付けられたボンディングアームと、を備えるボンディング装置であって、
ボンディングアームの回転中心とフランジ取り付け面との間に取り付けられる荷重センサと、
超音波振動子の振動周波数近傍の周波数帯にある信号を通過させるフィルタによって荷重センサで取得した信号から超音波振動子の振動周波数近傍の周波数帯にある信号を抽出し、抽出した信号に基づいてボンディングツール先端に加わる超音波ホーン長手方向の振動荷重を検出する振動荷重検出部と、を含み、
振動荷重検出部は、ボンディング開始後、ボンディングツール先端に加わる超音波ホーン長手方向の振動荷重の振幅が増大する振幅増大期間と振幅増大期間の後に振幅が略一定となる振幅安定期間とはボンディングツール先端に形成されたイニシャルボールが潰されてボンディング対象に接合されていく接合途中状態と判定して接合途中状態信号を出力し、振幅安定期間の振幅よりも振幅が増大してから所定時間が経過した場合に接合終了と判定して接合終了信号を出力し、検出したボンディングツール先端に加わる超音波ホーン長手方向の振動荷重の振幅の変化に基づいてボンディングツール先端に形成されたイニシャルボールとボンディング対象との間の接合状態を判定して各接合状態に応じた信号を出力する接合状態判定手段を有すること、
を特徴とするボンディング装置。 - 請求項1に記載のボンディング装置であって、
振動荷重検出部が接続され、超音波振動子の出力を変化させる制御部を含み、
制御部は、
振動荷重検出部から接合終了信号が入力された場合に、超音波振動子の出力を停止させる超音波振動停止手段を備えること、
を特徴とするボンディング装置。 - 請求項1または2に記載のボンディング装置であって、
制御部は、
振動荷重検出部によって検出される振幅安定期間の振幅が所定の値よりも小さい場合には、超音波振動子の出力を予め設定された出力よりも増大させ、振幅安定期間の振幅が所定の値よりも大きい場合には、超音波振動子の出力を予め設定された出力よりも減少させる超音波振動変化手段を備えること、
を特徴とするボンディング装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008169797A JP4314313B1 (ja) | 2008-06-30 | 2008-06-30 | ボンディング装置 |
TW97144641A TW201000238A (en) | 2008-06-30 | 2008-11-19 | Bonding device |
PCT/JP2008/072969 WO2010001500A1 (ja) | 2008-06-30 | 2008-12-17 | ボンディング装置 |
CN200880130099XA CN102077334B (zh) | 2008-06-30 | 2008-12-17 | 焊接装置 |
US12/982,019 US8800843B2 (en) | 2008-06-30 | 2010-12-30 | Bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008169797A JP4314313B1 (ja) | 2008-06-30 | 2008-06-30 | ボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4314313B1 true JP4314313B1 (ja) | 2009-08-12 |
JP2010010510A JP2010010510A (ja) | 2010-01-14 |
Family
ID=41036723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008169797A Active JP4314313B1 (ja) | 2008-06-30 | 2008-06-30 | ボンディング装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8800843B2 (ja) |
JP (1) | JP4314313B1 (ja) |
CN (1) | CN102077334B (ja) |
TW (1) | TW201000238A (ja) |
WO (1) | WO2010001500A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210272927A1 (en) * | 2018-07-11 | 2021-09-02 | Shinkawa Ltd. | Wire bonding apparatus |
US20230125756A1 (en) * | 2021-02-22 | 2023-04-27 | Shinkawa Ltd. | Wire bonding apparatus |
US11798911B1 (en) * | 2022-04-25 | 2023-10-24 | Asmpt Singapore Pte. Ltd. | Force sensor in an ultrasonic wire bonding device |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101417252B1 (ko) * | 2012-02-24 | 2014-07-08 | 엘지이노텍 주식회사 | 카메라 모듈의 기판 접합 장치 |
US10466204B2 (en) * | 2013-01-15 | 2019-11-05 | Automotive Energy Supply Corporation | Welding state inspection method |
JP5930419B2 (ja) * | 2014-03-14 | 2016-06-08 | 株式会社カイジョー | ボンディング装置 |
JP5930423B2 (ja) * | 2014-05-09 | 2016-06-08 | 株式会社カイジョー | ボンディング装置 |
CN107124904B (zh) * | 2015-12-25 | 2020-04-21 | 华祥股份有限公司 | 打线接合装置 |
JP6316340B2 (ja) * | 2016-06-02 | 2018-04-25 | 株式会社カイジョー | ボンディング装置、ボンディング方法及びボンディング制御プログラム |
WO2018047896A1 (ja) * | 2016-09-07 | 2018-03-15 | 株式会社新川 | ワイヤボンディング装置 |
CN109702315B (zh) * | 2018-12-27 | 2024-05-03 | 东莞市鸿振超声波设备有限公司 | 一种利用位置与压力触发的超声波控制电路及焊接方法 |
US11901329B2 (en) * | 2019-06-17 | 2024-02-13 | Kaijo Corporation | Wire bonding method and wire bonding apparatus |
JP2022061631A (ja) * | 2020-10-07 | 2022-04-19 | 株式会社東芝 | 超音波接合装置、制御装置及び制御方法 |
JP7343941B2 (ja) * | 2021-06-17 | 2023-09-13 | 株式会社新川 | 超音波複合振動装置および半導体装置の製造装置 |
US11691214B2 (en) * | 2021-10-17 | 2023-07-04 | Shinkawa Ltd. | Ultrasound horn |
JP2024011603A (ja) * | 2022-07-15 | 2024-01-25 | 株式会社新川 | 半導体装置の製造装置および製造方法 |
US20240116126A1 (en) * | 2022-10-11 | 2024-04-11 | Asmpt Singapore Pte. Ltd. | Ultrasonic transducer operable at multiple resonant frequencies |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2705423B2 (ja) | 1992-01-24 | 1998-01-28 | 株式会社日立製作所 | 超音波接合装置及び品質モニタリング方法 |
JPH10256320A (ja) * | 1997-03-12 | 1998-09-25 | Toshiba Mechatronics Kk | 半導体製造装置 |
WO2004073914A1 (en) * | 1999-11-10 | 2004-09-02 | Asm Technology Singapore Pte Ltd. | Force sensing apparatus |
US6279810B1 (en) | 2000-02-23 | 2001-08-28 | Asm Assembly Automation Ltd | Piezoelectric sensor for measuring bonding parameters |
JP3818932B2 (ja) * | 2002-03-04 | 2006-09-06 | 株式会社カイジョー | ワイヤボンディング装置 |
JP4679454B2 (ja) * | 2006-07-13 | 2011-04-27 | 株式会社新川 | ワイヤボンディング装置 |
CN100556602C (zh) * | 2007-12-24 | 2009-11-04 | 哈尔滨工业大学 | 超声波辅助激光钎焊或激光钎熔焊的方法 |
-
2008
- 2008-06-30 JP JP2008169797A patent/JP4314313B1/ja active Active
- 2008-11-19 TW TW97144641A patent/TW201000238A/zh not_active IP Right Cessation
- 2008-12-17 CN CN200880130099XA patent/CN102077334B/zh active Active
- 2008-12-17 WO PCT/JP2008/072969 patent/WO2010001500A1/ja active Application Filing
-
2010
- 2010-12-30 US US12/982,019 patent/US8800843B2/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210272927A1 (en) * | 2018-07-11 | 2021-09-02 | Shinkawa Ltd. | Wire bonding apparatus |
US11824038B2 (en) * | 2018-07-11 | 2023-11-21 | Shinkawa Ltd. | Wire bonding apparatus |
US20230125756A1 (en) * | 2021-02-22 | 2023-04-27 | Shinkawa Ltd. | Wire bonding apparatus |
US11798911B1 (en) * | 2022-04-25 | 2023-10-24 | Asmpt Singapore Pte. Ltd. | Force sensor in an ultrasonic wire bonding device |
US20230343741A1 (en) * | 2022-04-25 | 2023-10-26 | Asmpt Singapore Pte. Ltd. | Force sensor in an ultrasonic wire bonding device |
Also Published As
Publication number | Publication date |
---|---|
CN102077334A (zh) | 2011-05-25 |
US8800843B2 (en) | 2014-08-12 |
WO2010001500A1 (ja) | 2010-01-07 |
US20110155789A1 (en) | 2011-06-30 |
TW201000238A (en) | 2010-01-01 |
TWI361122B (ja) | 2012-04-01 |
CN102077334B (zh) | 2013-05-01 |
JP2010010510A (ja) | 2010-01-14 |
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