TWI711089B - Joint head - Google Patents

Joint head Download PDF

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Publication number
TWI711089B
TWI711089B TW108127957A TW108127957A TWI711089B TW I711089 B TWI711089 B TW I711089B TW 108127957 A TW108127957 A TW 108127957A TW 108127957 A TW108127957 A TW 108127957A TW I711089 B TWI711089 B TW I711089B
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arm
base
spring
load sensor
load
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TW108127957A
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Chinese (zh)
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TW202008474A (en
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前田徹
高山晋
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日商新川股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

本發明的課題在於在接合頭中，進行如下的接地檢測，即，使接地檢測的靈敏度與響應性提高，並且不容易受到外力的影響。本發明的接合頭包括：底座11，在上下方向上移動；臂20，在一端安裝有筒夾21，相對於底座11圍繞著旋轉軸13旋轉自如地安裝；附帶初始張力的彈簧19，安裝於臂20的另一端與底座11之間；止動件部分18，抵抗彈簧19的拉伸力而束縛臂20的旋轉；以及載荷感測器25，檢測施加至筒夾21的向上的接地載荷；且載荷感測器25僅在藉由止動件部分18而束縛著臂20的旋轉的狀態下進行接地檢測。The subject of the present invention is to perform ground fault detection in a bonding head that improves the sensitivity and responsiveness of ground fault detection and is not easily affected by external forces. The joint head of the present invention includes: a base 11, which moves in the up and down direction; an arm 20 with a collet 21 mounted on one end, and is rotatably mounted relative to the base 11 around a rotation axis 13; a spring 19 with initial tension is mounted on Between the other end of the arm 20 and the base 11; a stopper portion 18 that restrains the rotation of the arm 20 against the tensile force of the spring 19; and a load sensor 25 that detects the upward ground load applied to the collet 21; In addition, the load sensor 25 performs grounding detection only in a state where the rotation of the arm 20 is restrained by the stopper portion 18.

Description

接合頭Joint head

本發明是有關於一種接合頭(bonding head)的結構。 The present invention relates to the structure of a bonding head.

將半導體晶粒(die)封裝於基板的接合裝置正在大量使用。在接合裝置中，會進行接地檢測，檢測吸附於筒夾(collet)的前端的半導體晶粒已與基板的表面接地。在現有的接合裝置中，利用彈簧支持筒夾，藉由筒夾的前端接地時的筒夾後端的位移所引起的接點的斷開來進行接地檢測(例如，參照專利文獻1)。 Bonding devices for packaging semiconductor dies on substrates are being used in large numbers. In the bonding device, grounding detection is performed to detect that the semiconductor die adsorbed to the tip of the collet is grounded to the surface of the substrate. In the conventional joining device, the collet is supported by a spring, and grounding detection is performed by disconnection of the contact caused by the displacement of the rear end of the collet when the front end of the collet is grounded (for example, refer to Patent Document 1).

[現有技術文獻] [Prior Art Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平7-45644號公報 [Patent Document 1] Japanese Patent Laid-Open No. 7-45644

但是，專利文獻1所述的現有技術的接地檢測在位移成為使接點斷開的程度的大小時檢測接地，因此存在檢測出現時間延遲的情況。又，存在如下的問題：當隨時間經過產生的污染等而使筒夾的上下方向支持部的滑動阻力增加時，則靈敏度會降低而導致錯誤檢測。此外，利用盤簧支持著筒夾，故而存在如下的情況：因接合頭移動時的外力的影響，而使得筒夾在上下方向上 振動，從而對吸附於筒夾的半導體晶粒的位置檢測造成影響。 However, the prior art ground fault detection described in Patent Document 1 detects the ground fault when the displacement becomes such a magnitude that the contact point is disconnected, and therefore there is a case where the detection is delayed in time. In addition, there is a problem that when the sliding resistance of the vertical support portion of the collet increases due to contamination or the like that occurs over time, the sensitivity decreases and erroneous detection occurs. In addition, a coil spring is used to support the collet, so there are cases where the collet is moved up and down due to the influence of the external force when the joint head moves. Vibration affects the position detection of the semiconductor die adsorbed on the collet.

因此，本發明的目的在於在接合頭中，進行如下的接地檢測，即，使接地檢測的靈敏度與響應性提高，並且不容易受到外力的影響。 Therefore, the object of the present invention is to perform grounding detection in a bonding head that improves the sensitivity and responsiveness of grounding detection and is not easily affected by external forces.

本發明的接合頭包括：底座，在上下方向上移動；臂，在一端安裝有接合工具，相對於底座圍繞著水平軸旋轉自如地安裝；附帶初始張力的彈簧，安裝於臂的另一端與底座之間；止動件(stopper)，抵抗彈簧所施加的力而束縛臂的旋轉；以及載荷感測器，檢測施加至接合工具的向上的接地載荷；且載荷感測器在藉由止動件而束縛著臂的旋轉的狀態下進行接地檢測。 The bonding head of the present invention includes: a base, which moves in the up and down direction; an arm with a bonding tool installed at one end, and is rotatably installed relative to the base around a horizontal axis; a spring with initial tension is installed on the other end of the arm and the base Between; a stopper, which restrains the rotation of the arm against the force exerted by a spring; and a load sensor, which detects the upward grounding load applied to the joining tool; and the load sensor is used by the stopper The grounding detection is performed while restraining the rotation of the arm.

在本發明的接合頭中，亦可設為：水平軸配置為以軸方向的中心線穿過所述臂的重心的方式。 In the bonding head of the present invention, the horizontal axis may be arranged such that the center line in the axial direction passes through the center of gravity of the arm.

在本發明的接合頭中，亦可為：止動件是臂的另一端側所抵接的底座的部分，載荷感測器在底座與臂之間與彈簧串聯連接著。此時，載荷感測器亦可對拉伸載荷進行檢測。 In the bonding head of the present invention, the stopper may be a part of the base that the other end of the arm abuts against, and the load sensor is connected in series with the spring between the base and the arm. At this time, the load sensor can also detect the tensile load.

在本發明的接合頭中，亦可為：臂旋轉自如地安裝於支架(bracket)，所述支架自底座向下突出，止動件是自支架向臂的前端側突出的構件，載荷感測器夾於支架與底座之間。此時，載荷感測器亦可對壓縮載荷進行檢測。 In the joint head of the present invention, the arm may be rotatably mounted on a bracket, the bracket protruding downward from the base, the stopper is a member protruding from the bracket toward the front end of the arm, and the load sensing The device is clamped between the bracket and the base. At this time, the load sensor can also detect the compression load.

本發明的接合頭藉由載荷感測器而進行接地檢測，因此 可進行如下的接地檢測，即，使接地檢測的靈敏度與響應性提高，並且不容易受到外力的影響。 The joint head of the present invention is grounded through the load sensor, so Ground detection can be performed, that is, the sensitivity and responsiveness of ground detection are improved, and it is not easily affected by external forces.

11、51:底座 11, 51: base

12、52:支架 12, 52: bracket

13:旋轉軸 13: Rotation axis

14:螺母 14: Nut

15:突出部 15: protrusion

16:彎鈎 16: hook

17:凹部 17: recess

18:止動件部分 18: Stopper part

19、56:彈簧 19, 56: Spring

20、54:臂 20, 54: arm

21、55:筒夾 21, 55: Collet

22:Y方向負側端 22: Y direction negative side

25、58:載荷感測器 25, 58: Load sensor

30:空氣管 30: Air pipe

31、32:缺口部 31, 32: Notch

33:孔 33: Hole

53:止動件 53: stop

100、200:接合頭 100, 200: joint head

F:初始張力 F: initial tension

圖1是實施形態的接合頭立體圖。 Fig. 1 is a perspective view of the bonding head of the embodiment.

圖2是圖1所示的接合頭的立剖面圖。 Fig. 2 is a vertical cross-sectional view of the bonding head shown in Fig. 1.

圖3是另一實施形態的接合頭的立面圖。 Fig. 3 is an elevation view of a bonding head of another embodiment.

以下，一面參照圖式，一面說明實施形態的接合頭100。如圖1、圖2所示，接合頭100包括：底座11，藉由未圖示的Z方向驅動機構而在上下方向即Z方向上移動；支架12，固定於底座11；臂20，旋轉自如地安裝於支架12的下端；彈簧19，安裝於臂20的Y方向負側端22；以及載荷感測器25。在圖1中，Z方向表示上下方向，XY方向表示水平方向。又，圖中的XYZ的各箭頭表示各自的正方向。 Hereinafter, referring to the drawings, the bonding head 100 of the embodiment will be described. As shown in Figures 1 and 2, the bonding head 100 includes: a base 11, which is moved in the vertical direction, that is, in the Z direction by a Z-direction drive mechanism not shown; a bracket 12, which is fixed to the base 11; The ground is mounted on the lower end of the bracket 12; the spring 19 is mounted on the negative side end 22 of the arm 20 in the Y direction; and the load sensor 25. In FIG. 1, the Z direction represents the vertical direction, and the XY direction represents the horizontal direction. In addition, the arrows of XYZ in the figure indicate their respective positive directions.

底座11是長方體的塊體，在上端面具有L字型的突出部15，所述L字型的突出部15的前端延伸至Y方向負側。在突出部15的Y方向負側端，設置有彈簧19的上端所卡合的彎鈎(hook)16。在底座11的Y方向正側，設置有安裝空氣管30的孔33、及缺口部31。安裝於孔33的空氣管30的上端自缺口部31延伸至Y方向正側。 The base 11 is a rectangular parallelepiped block, and has an L-shaped protrusion 15 on the upper end surface, and the front end of the L-shaped protrusion 15 extends to the negative side in the Y direction. At the negative side end of the protrusion 15 in the Y direction, a hook 16 to which the upper end of the spring 19 is engaged is provided. On the positive side of the base 11 in the Y direction, a hole 33 for attaching the air tube 30 and a notch 31 are provided. The upper end of the air pipe 30 attached to the hole 33 extends from the notch portion 31 to the positive side in the Y direction.

在底座11的Y方向正側的面，安裝有H型的厚板形狀 的支架12。在構成H型的支架12的上側的缺口部32，空氣管30的前端穿過。在構成H型的支架12的下側的凹部17的內側，配置有棒狀的臂20，所述棒狀的臂20以四角剖面在Y方向上延伸。臂20圍繞著旋轉軸13旋轉自如地安裝於下側的凹部17的兩側部分，所述旋轉軸13經螺母14固定的在水平方向上延伸的水平軸。此處，旋轉軸13配置為以軸方向的中心線穿過臂20的重心的方式。在臂20的一端即Y方向正側端安裝有接合工具即筒夾21。又，臂20的另一端即Y方向負側端22的上側的面抵接於止動件部分18，所述止動件部分18設置於底座11的Y方向負側端的下表面。 On the positive side of the base 11 in the Y direction, an H-shaped thick plate is attached 的架12。 The bracket 12. The tip of the air tube 30 passes through the notch 32 on the upper side of the H-shaped bracket 12. Inside the recess 17 constituting the lower side of the H-shaped bracket 12, a rod-shaped arm 20 is arranged, and the rod-shaped arm 20 extends in the Y direction with a quadrangular cross section. The arm 20 is rotatably installed on both sides of the lower recess 17 around a rotating shaft 13, which is a horizontal shaft that is fixed by a nut 14 and extends in the horizontal direction. Here, the rotation shaft 13 is arranged so that the center line in the axial direction passes through the center of gravity of the arm 20. A collet 21 which is a joining tool is attached to one end of the arm 20, that is, the end on the positive side in the Y direction. In addition, the other end of the arm 20, that is, the upper surface of the Y-direction negative end 22 abuts on the stopper portion 18 provided on the lower surface of the Y-direction negative end of the base 11.

如圖2所示，彈簧19的上端卡合於彎鈎16，所述彎鈎16安裝於突出部15的Y方向負側端，所述突出部15設置於底座11，彈簧19的下端與載荷感測器25連接。並且，載荷感測器25的下端藉由螺栓而固定於臂20的Y方向負側端22。如上所述，載荷感測器25在底座11與臂20之間與彈簧19串聯連接著。 As shown in Figure 2, the upper end of the spring 19 is engaged with the hook 16, and the hook 16 is mounted on the negative side end of the protrusion 15 in the Y direction. The protrusion 15 is provided on the base 11, and the lower end of the spring 19 is connected to the load The sensor 25 is connected. In addition, the lower end of the load sensor 25 is fixed to the negative end 22 of the arm 20 in the Y direction with a bolt. As described above, the load sensor 25 is connected in series with the spring 19 between the base 11 and the arm 20.

彈簧19是附帶初始張力的彈簧，在施加初始張力F之前延伸為零，當施加超過初始張力F的張力時全長才開始延伸。載荷感測器25是在板狀的構件上黏附有壓電元件或形變計(gauge)等的器件，藉由檢測板狀構件的形變而將施加至板狀構件的拉伸力檢測為接地載荷。 The spring 19 is a spring with initial tension, and it extends to zero before the initial tension F is applied, and the full length starts to extend when the tension exceeds the initial tension F is applied. The load sensor 25 is a device in which a piezoelectric element or gauge is attached to a plate-shaped member, and detects the tensile force applied to the plate-shaped member as a ground load by detecting the deformation of the plate-shaped member .

彈簧19以如下的方式設定，即，在筒夾21未接地的狀態下，施加小於初始張力F的微小張力作為所施加的力，藉由所 述張力，而使臂20的Y方向負側端22的上側的面按壓至底座11的止動件部分18。藉此，臂20的旋轉被束縛。如上所述，止動件部分18抵抗彈簧19所施加的力而束縛臂20的旋轉。 The spring 19 is set in such a way that when the collet 21 is not grounded, a small tension less than the initial tension F is applied as the applied force. According to the tension, the upper surface of the negative end 22 in the Y direction of the arm 20 is pressed to the stopper portion 18 of the base 11. Thereby, the rotation of the arm 20 is restrained. As described above, the stopper portion 18 restrains the rotation of the arm 20 against the force exerted by the spring 19.

當筒夾21的前端接地時，對臂20施加圍繞著旋轉軸13的旋轉力矩。藉由所述旋轉力矩，而將臂20的Y方向負側端22向下側拉伸，對載荷感測器25施加拉伸載荷。載荷感測器25對所述拉伸載荷進行檢測，當超過規定的臨限值時檢測出筒夾21的接地。 When the front end of the collet 21 is grounded, a rotation moment around the rotation shaft 13 is applied to the arm 20. Due to the rotational moment, the Y-direction negative side end 22 of the arm 20 is pulled downward, and a tensile load is applied to the load sensor 25. The load sensor 25 detects the tensile load, and detects the grounding of the collet 21 when it exceeds a predetermined threshold.

此時，在藉由施加至筒夾21的前端的向上的力，而使得施加至彈簧19、載荷感測器25的拉伸力超過彈簧19的初始張力F之前，彈簧19不延伸，因此可利用載荷感測器25來檢測自筒夾21施加的向上的載荷。 At this time, until the upward force applied to the front end of the collet 21 causes the tensile force applied to the spring 19 and the load sensor 25 to exceed the initial tension F of the spring 19, the spring 19 does not extend. The load sensor 25 is used to detect the upward load applied from the collet 21.

另一方面，當藉由施加至筒夾21的前端的向上的力，而使得施加至彈簧19、載荷感測器25的拉伸力超過彈簧19的初始張力F時，藉由來自筒夾21的向上的力，彈簧19延伸，臂20的Y方向負側端22的上側的面遠離底座11的止動件部分18。因此，可抑制過大的載荷施加至筒夾21，而使吸附於筒夾21的前端的半導體晶粒損傷。在所述狀態下，載荷感測器25的延伸與筒夾21的向上的力不成比例。因此，載荷感測器25可僅在藉由止動件部分18而束縛著臂20的旋轉的狀態下進行接地檢測。 On the other hand, when the upward force applied to the front end of the collet 21 causes the tensile force applied to the spring 19 and the load sensor 25 to exceed the initial tension F of the spring 19, the force from the collet 21 With the upward force, the spring 19 extends, and the upper surface of the Y-direction negative end 22 of the arm 20 is away from the stopper portion 18 of the base 11. Therefore, it is possible to suppress the application of an excessive load to the collet 21 and damage the semiconductor crystal grains adsorbed to the tip of the collet 21. In this state, the extension of the load sensor 25 is not proportional to the upward force of the collet 21. Therefore, the load sensor 25 can perform grounding detection only in a state where the rotation of the arm 20 is restrained by the stopper portion 18.

如以上說明，本實施形態的接合頭100藉由載荷感測器25而進行接地檢測，因此可提高接地檢測的響應性。又，由於設 為使藉由臂20而施加至筒夾21的載荷增大，而施加至載荷感測器25，因此可增大載荷的檢測靈敏度。此外，當對筒夾21的前端施加有大的載荷時，可藉由彈簧19延伸，而使施加至筒夾21的前端的載荷釋放，從而抑制吸附於筒夾21的前端的半導體晶粒損傷。此外，由於在筒夾21未接地的狀態下，藉由彈簧19而使臂20的Y方向負側端22的上側的面按壓至底座11的止動件部分18，故而在接合頭100移動時，筒夾21不會在Z方向上振動，從而可抑制在接合頭100的移動過程中對吸附於筒夾21的前端的半導體晶粒的位置檢測造成影響。 As described above, the bond head 100 of the present embodiment performs grounding detection by the load sensor 25, so that the responsiveness of grounding detection can be improved. Also, due to In order to increase the load applied to the collet 21 by the arm 20, it is applied to the load sensor 25, so that the detection sensitivity of the load can be increased. In addition, when a large load is applied to the front end of the collet 21, the spring 19 can be extended to release the load applied to the front end of the collet 21, thereby suppressing damage to the semiconductor die adsorbed to the front end of the collet 21 . In addition, since the upper surface of the Y-direction negative end 22 of the arm 20 is pressed against the stopper portion 18 of the base 11 by the spring 19 when the collet 21 is not grounded, when the bonding head 100 is moved Therefore, the collet 21 does not vibrate in the Z direction, thereby suppressing the influence on the position detection of the semiconductor die adsorbed to the tip of the collet 21 during the movement of the bonding head 100.

其次，一面參照圖3，一面說明另一實施形態的接合頭200。接合頭200包括：底座51、支架52、臂54、筒夾55、止動件53、彈簧56及載荷感測器58。 Next, referring to FIG. 3, a bonding head 200 of another embodiment will be described. The joint head 200 includes a base 51, a bracket 52, an arm 54, a collet 55, a stopper 53, a spring 56 and a load sensor 58.

支架52以向下突出的方式安裝於底座51的下側。臂54旋轉自如地安裝於支架52的下端部。止動件53是板狀的構件，安裝於支架52的下端，且自支架52向臂20的Y方向正側端側突出。載荷感測器58夾於支架52與底座51之間而檢測壓縮載荷。 The bracket 52 is installed on the lower side of the base 51 in a manner of protruding downward. The arm 54 is rotatably attached to the lower end of the bracket 52. The stopper 53 is a plate-shaped member, which is attached to the lower end of the bracket 52 and protrudes from the bracket 52 toward the end on the positive side of the arm 20 in the Y direction. The load sensor 58 is sandwiched between the bracket 52 and the base 51 to detect the compressive load.

接合頭200的彈簧56是與先前說明的接合頭100的彈簧19相同的附帶初始張力的彈簧，在筒夾21的前端未接地的狀態下，利用小於初始張力F的微小的拉伸力將臂54的Y方向負側端向上拉伸而使臂54的下表面按壓至止動件53的上側的面。 The spring 56 of the bonding head 200 is the same spring with initial tension as the spring 19 of the bonding head 100 described earlier. When the tip of the collet 21 is not grounded, the arm is pulled by a slight tensile force less than the initial tension F. The Y-direction negative end of 54 is stretched upward to press the lower surface of the arm 54 to the upper surface of the stopper 53.

在藉由向上的力而施加至彈簧56的拉伸力小於初始張力F的狀態下，彈簧56的延伸為零，施加至筒夾21的前端的載 荷藉由載荷感測器58而檢測出來，所述向上的力藉由接地而施加至筒夾21的前端。又，當施加至彈簧56的載荷超過初始張力F時，彈簧56延伸，而使施加至筒夾21的前端的載荷釋放。 In a state where the tensile force applied to the spring 56 by the upward force is less than the initial tension F, the extension of the spring 56 is zero, and the load applied to the front end of the collet 21 The load is detected by the load sensor 58, and the upward force is applied to the front end of the collet 21 by grounding. Moreover, when the load applied to the spring 56 exceeds the initial tension F, the spring 56 extends, and the load applied to the front end of the collet 21 is released.

如上所述，接合頭200發揮與接合頭100相同的作用效果。 As described above, the bonding head 200 exerts the same functions and effects as the bonding head 100.

11‧‧‧底座 11‧‧‧Base

12‧‧‧支架 12‧‧‧Support

13‧‧‧旋轉軸 13‧‧‧Rotation axis

15‧‧‧突出部 15‧‧‧Protrusion

16‧‧‧彎鈎 16‧‧‧Hook

17‧‧‧凹部 17‧‧‧Concave

18‧‧‧止動件部分 18‧‧‧stop part

19‧‧‧彈簧 19‧‧‧Spring

20‧‧‧臂 20‧‧‧arm

21‧‧‧筒夾 21‧‧‧Collet

22‧‧‧Y方向負側端 22‧‧‧Y direction negative side

25‧‧‧載荷感測器 25‧‧‧Load Sensor

30‧‧‧空氣管 30‧‧‧Air pipe

31、32‧‧‧缺口部 31, 32‧‧‧Notch

33‧‧‧孔 33‧‧‧Hole

100‧‧‧接合頭 100‧‧‧Joint head

F‧‧‧初始張力 F‧‧‧Initial tension

Claims (5)

一種接合頭，包括：底座，在上下方向上移動；臂，在一端安裝有接合工具，相對於所述底座圍繞著水平軸旋轉自如地安裝；附帶初始張力的彈簧，安裝於所述臂的另一端與所述底座之間；止動件，抵抗所述彈簧所施加的力而束縛所述臂的旋轉；以及載荷感測器，檢測施加至所述接合工具的向上的接地載荷；且所述載荷感測器在藉由所述止動件而束縛著所述臂的旋轉的狀態下進行接地檢測，所述水平軸配置為以軸方向的中心線穿過所述臂的重心的方式。 A joint head, comprising: a base, which moves in the up and down direction; an arm with a joint tool installed at one end, and is rotatably installed relative to the base around a horizontal axis; a spring with initial tension is installed on the other side of the arm Between one end and the base; a stopper that restrains the rotation of the arm against the force applied by the spring; and a load sensor that detects an upward ground load applied to the bonding tool; and the The load sensor performs grounding detection in a state where the rotation of the arm is restrained by the stopper, and the horizontal axis is arranged such that the center line in the axial direction passes through the center of gravity of the arm. 如申請專利範圍第1項所述的接合頭，其中所述止動件是所述臂的另一端側所抵接的所述底座的部分，所述載荷感測器在所述底座與所述臂之間與所述彈簧串聯連接著。 The joint head according to claim 1, wherein the stopper is a part of the base that the other end of the arm abuts against, and the load sensor is connected between the base and the base The arms are connected in series with the spring. 如申請專利範圍第2項所述的接合頭，其中所述載荷感測器對拉伸載荷進行檢測。 The joint head according to the second item of the scope of patent application, wherein the load sensor detects the tensile load. 一種接合頭，包括： 底座，在上下方向上移動；臂，在一端安裝有接合工具，相對於所述底座圍繞著水平軸旋轉自如地安裝；附帶初始張力的彈簧，安裝於所述臂的另一端與所述底座之間；止動件，抵抗所述彈簧所施加的力而束縛所述臂的旋轉；以及載荷感測器，檢測施加至所述接合工具的向上的接地載荷；且所述載荷感測器在藉由所述止動件而束縛著所述臂的旋轉的狀態下進行接地檢測，所述臂旋轉自如地安裝於支架，所述支架自所述底座向下突出，所述止動件是自所述支架向所述臂的前端側突出的構件，所述載荷感測器夾於所述支架與所述底座之間。 A joint head, including: The base moves in the up and down direction; the arm is equipped with a joining tool at one end and is rotatably installed relative to the base around a horizontal axis; a spring with initial tension is installed between the other end of the arm and the base A stopper, which restrains the rotation of the arm against the force exerted by the spring; and a load sensor, which detects an upward ground load applied to the bonding tool; and the load sensor is borrowing The grounding detection is performed in a state where the rotation of the arm is restrained by the stopper, the arm is rotatably mounted on a bracket, the bracket protrudes downward from the base, and the stopper is The bracket is a member protruding toward the front end of the arm, and the load sensor is sandwiched between the bracket and the base. 如申請專利範圍第4項所述的接合頭，其中所述載荷感測器對壓縮載荷進行檢測。 The joint head as described in item 4 of the scope of patent application, wherein the load sensor detects the compression load.
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