WO2020032068A1 - Bonding head - Google Patents

Bonding head Download PDF

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Publication number
WO2020032068A1
WO2020032068A1 PCT/JP2019/030995 JP2019030995W WO2020032068A1 WO 2020032068 A1 WO2020032068 A1 WO 2020032068A1 JP 2019030995 W JP2019030995 W JP 2019030995W WO 2020032068 A1 WO2020032068 A1 WO 2020032068A1
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WIPO (PCT)
Prior art keywords
arm
bonding head
base
load sensor
spring
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PCT/JP2019/030995
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French (fr)
Japanese (ja)
Inventor
前田　徹
晋 高山
Original Assignee
ヤマハモーターロボティクスホールディングス株式会社
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Application filed by ヤマハモーターロボティクスホールディングス株式会社 filed Critical ヤマハモーターロボティクスホールディングス株式会社
Priority to CN201980051929.8A priority Critical patent/CN112585732A/en
Priority to JP2020535813A priority patent/JP6905778B2/en
Priority to KR1020207030918A priority patent/KR102399934B1/en
Publication of WO2020032068A1 publication Critical patent/WO2020032068A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws

Definitions

  • the present invention relates to the structure of a bonding head.
  • ground detection is performed to detect that the semiconductor die adsorbed on the tip of the collet is grounded on the surface of the substrate.
  • a collet is supported by a spring, and ground detection is performed by releasing a contact due to displacement of a rear end of the collet when the front end of the collet is grounded (for example, see Patent Document 1).
  • the ground detection according to the prior art described in Patent Literature 1 detects the ground when the displacement becomes large enough to open the contact, so that the detection may be delayed.
  • the sliding resistance of the vertical supporting portion of the collet increases due to aging dirt or the like, there is a problem that the sensitivity is reduced and erroneous detection is caused.
  • the collet since the collet is supported by the coil spring, the collet vibrates vertically due to the external force when the bonding head moves, which affects the position detection of the semiconductor die adsorbed by the collet. was there.
  • the bonding head includes a base moving vertically, an arm having a bonding tool attached to one end thereof and rotatably attached to the base about a horizontal axis, and an arm attached between the other end of the arm and the base.
  • a spring with initial tension a stopper that restrains rotation of the arm against the urging force of the spring, and a load sensor that detects an upward grounding load applied to the bonding tool. Ground detection is performed while the rotation of the arm is restricted by the stopper.
  • the horizontal axis may be arranged so that the axial center line passes through the center of gravity of the arm.
  • the stopper may be a portion of the base at which the other end of the arm contacts, and the load sensor may be connected in series with the spring between the base and the arm.
  • the load sensor may detect a tensile load.
  • the arm is rotatably mounted on a bracket projecting downward from the base
  • the stopper is a member projecting from the bracket toward the distal end side of the arm
  • the load sensor comprises a bracket and the base. And may be sandwiched between them.
  • the load sensor may detect a compression load.
  • the bonding head of the present invention detects the ground contact by the load sensor, it is possible to improve the sensitivity and responsiveness of the contact detection and to perform the contact detection that is hardly affected by external force.
  • FIG. 2 is a vertical sectional view of the bonding head shown in FIG. 1. It is an elevation view of the bonding head of other embodiments.
  • the bonding head 100 of the embodiment includes a base 11 that is moved in a vertical Z direction by a Z-direction drive mechanism (not shown), a bracket 12 fixed to the base 11, and a lower end of the bracket 12.
  • the arm 20 includes a freely detachable arm 20, a spring 19 attached to the Y direction minus side end 22 of the arm 20, and a load sensor 25.
  • the Z direction indicates the vertical direction
  • the XY direction indicates the horizontal direction.
  • each arrow of XYZ in the figure indicates the respective plus direction.
  • the base 11 is a rectangular parallelepiped block, and has an L-shaped protrusion 15 on the upper end surface, the tip of which extends to the minus side in the Y direction.
  • a hook 16 with which the upper end of the spring 19 is engaged is provided at the minus side end of the protrusion 15 in the Y direction.
  • H An H-shaped thick plate-shaped bracket 12 is attached to the surface on the plus side in the Y direction of the base 11.
  • the tip of the air pipe 30 passes through the cutout 31 on the upper side of the bracket 12 constituting the H-shape.
  • a bar-shaped arm 20 extending in the Y direction with a square cross section is arranged inside the concave portion 17 on the lower side of the bracket 12 constituting the H-shape.
  • the arm 20 is rotatably mounted on a rotating shaft 13 which is a horizontal shaft extending in the horizontal direction and fixed to the both sides of the lower concave portion 17 by a nut 14.
  • the rotating shaft 13 is arranged so that the axial center line passes through the center of gravity of the arm 20.
  • a collet 21 serving as a bonding tool is attached to one end of the arm 20 at the positive side in the Y direction.
  • the upper surface of the other end 22 of the arm 20 on the minus side 22 in the Y direction is in contact with a stopper portion 18 provided on the lower surface of the minus side of the base 11 in the minus direction.
  • the upper end of the spring 19 is engaged with a hook 16 attached to the Y direction minus side end of the protrusion 15 provided on the base 11, and the lower end of the spring 19 is connected to the load sensor 25.
  • the lower end of the load sensor 25 is fixed to the Y-side minus end 22 of the arm 20 with a bolt.
  • the load sensor 25 is connected between the base 11 and the arm 20 in series with the spring 19.
  • the spring 19 is a spring with an initial tension in which the extension is zero until the initial tension F is applied, and the entire length starts to extend only when a tension exceeding the initial tension F is applied.
  • the load sensor 25 is obtained by attaching a piezo element or a strain gauge or the like to a plate-like member, and detects a tensile force applied to the plate-like member as a ground load by detecting a strain of the plate-like member. .
  • the spring 19 is set so that a slight tension smaller than the initial tension F is applied as an urging force when the collet 21 is not in contact with the ground, and this tension causes the upper surface of the arm 20 to be in the Y direction minus side end 22. Is pressed against a stopper portion 18 of the base 11. Thus, the rotation of the arm 20 is restricted. Thus, the stopper portion 18 restrains the rotation of the arm 20 against the urging force of the spring 19.
  • the tip of the collet 21 touches the ground, a rotational moment about the rotation shaft 13 is applied to the arm 20. Due to this rotational moment, the negative end 22 in the Y direction of the arm 20 is pulled downward, and a tensile load is applied to the load sensor 25.
  • the load sensor 25 detects the tensile load, and detects the contact of the collet 21 when the load exceeds a predetermined threshold.
  • the spring 19 does not extend until the tensile force applied to the spring 19 and the load sensor 25 by the upward force applied to the tip of the collet 21 exceeds the initial tension F of the spring 19, so that the spring 19 The load in the direction can be detected by the load sensor 25.
  • the bonding head 100 of the present embodiment detects the grounding by the load sensor 25, the responsiveness of the grounding detection can be improved. Further, since the load applied to the collet 21 is amplified by the arm 20 and applied to the load sensor 25, the load detection sensitivity can be increased. Further, when a large load is applied to the tip of the collet 21, the spring 19 extends to release the load related to the tip of the collet 21, thereby suppressing damage to the semiconductor die adsorbed to the tip of the collet 21. can do. Further, when the collet 21 is not in contact with the ground, the upper surface of the Y direction minus side end 22 of the arm 20 is pressed against the stopper portion 18 of the base 11 by the spring 19. Does not vibrate in the Z direction, and it is possible to suppress the influence on the position detection of the semiconductor die sucked to the tip of the collet 21 during the movement of the bonding head 100.
  • the bonding head 200 includes a base 51, a bracket 52, an arm 54, a collet 55, a stopper 53, a spring 56, and a load sensor 58.
  • the bracket 52 is attached to the lower side of the base 51 so as to protrude downward.
  • the arm 54 is rotatably attached to the lower end of the bracket 52.
  • the stopper 53 is a plate-shaped member that is attached to the lower end of the bracket 52 and protrudes from the bracket 52 toward the plus side end of the arm 20 in the Y direction.
  • the load sensor 58 is sandwiched between the bracket 52 and the base 51 to detect a compressive load.
  • the spring 56 of the bonding head 200 is a spring with an initial tension similar to the spring 19 of the bonding head 100 described above. When the tip of the collet 21 is not grounded, the spring 56 has a slight tension smaller than the initial tension F. The lower end of the arm 54 in the Y direction is pulled upward, and the lower surface of the arm 54 is pressed against the upper surface of the stopper 53.
  • the bonding head 200 has the same operation and effect as the bonding head 100.

Abstract

This bonding head comprises: a base (11) that moves in a vertical direction; an arm (20) that is attached to the base (11) such that it can rotate freely around a rotary shaft (13), a collet (21) being attached to one end of the arm; a spring (19) with an initial tensile force that is attached between the base (11) and the other end of the arm (20); a stopper portion (18) that restricts rotation of the arm (20) against the tensile force of the spring (19); and a load sensor (25) that detects an upward contact load applied to the collet (21). The load sensor (25) detects the contact load only when the rotation of the arm (20) is restricted by the stopper portion (18).

Description

ボンディングヘッドBonding head
　本発明は、ボンディングヘッドの構造に関する。 The present invention relates to the structure of a bonding head.
　半導体ダイを基板に実装するボンディング装置が多く用いられている。ボンディング装置では、コレットの先端に吸着した半導体ダイが基板の表面に接地したことを検出する接地検出が行われる。従来のボンディング装置では、コレットをスプリングで支持し、コレットの先端が接地した際のコレット後端の変位による接点の解放により接地検出を行っている（例えば、特許文献１参照）。 ボ ン デ ィ ン グ Bonding devices for mounting semiconductor dies on substrates are widely used. In the bonding apparatus, ground detection is performed to detect that the semiconductor die adsorbed on the tip of the collet is grounded on the surface of the substrate. In a conventional bonding apparatus, a collet is supported by a spring, and ground detection is performed by releasing a contact due to displacement of a rear end of the collet when the front end of the collet is grounded (for example, see Patent Document 1).
特開平7－４５６４４号公報JP-A-7-45644
　しかし、特許文献１に記載されている従来技術による接地検出は、変位が接点を開放する程度の大きさになった際に接地を検出するので、検出に時間遅れが出る場合があった。また、経年的な汚れ等によりコレットの上下方向支持部の摺動抵抗が増加すると感度が低下して誤検出を招くという問題があった。更に、コレットをコイルスプリングで支持しているため、ボンディングヘッドが移動する際の外力の影響によりコレットが上下方向に振動してしまい、コレットに吸着されている半導体ダイの位置検出に影響が出る場合があった。 However, the ground detection according to the prior art described in Patent Literature 1 detects the ground when the displacement becomes large enough to open the contact, so that the detection may be delayed. In addition, when the sliding resistance of the vertical supporting portion of the collet increases due to aging dirt or the like, there is a problem that the sensitivity is reduced and erroneous detection is caused. Furthermore, since the collet is supported by the coil spring, the collet vibrates vertically due to the external force when the bonding head moves, which affects the position detection of the semiconductor die adsorbed by the collet. was there.
　そこで、本発明は、ボンディングヘッドにおいて、接地検出の感度と応答性とを向上させると共に外力の影響を受けにくい接地検出を行うことを目的とする。 Accordingly, it is an object of the present invention to improve the sensitivity and responsiveness of ground detection in a bonding head and to perform ground detection that is not easily affected by external force.
　本発明のボンディングヘッドは、上下方向に移動するベースと、一端にボンディングツールが取り付けられ、ベースに対して水平軸回りに回転自在に取りつけられるアームと、アームの他端とベースとの間に取り付けられた初期張力付きのばねと、ばねの付勢力に対抗してアームの回転を拘束するストッパと、ボンディングツールに印加される上方向の接地荷重を検出する荷重センサと、を備え、荷重センサは、ストッパによりアームの回転が拘束されている状態で接地検出を行うこと、を特徴とする。 The bonding head according to the present invention includes a base moving vertically, an arm having a bonding tool attached to one end thereof and rotatably attached to the base about a horizontal axis, and an arm attached between the other end of the arm and the base. A spring with initial tension, a stopper that restrains rotation of the arm against the urging force of the spring, and a load sensor that detects an upward grounding load applied to the bonding tool. Ground detection is performed while the rotation of the arm is restricted by the stopper.
　本発明のボンディングヘッドにおいて、水平軸は、軸方向の中心線が前記アームの重心を通るように配置されていること、としてもよい。 In the bonding head of the present invention, the horizontal axis may be arranged so that the axial center line passes through the center of gravity of the arm.
　本発明のボンディングヘッドにおいて、ストッパは、アームの他端側が当接するベースの部分であり、荷重センサは、ベースとアームとの間にばねと直列に接続されていてもよい。この場合、荷重センサは、引張荷重を検出してもよい。 In the bonding head of the present invention, the stopper may be a portion of the base at which the other end of the arm contacts, and the load sensor may be connected in series with the spring between the base and the arm. In this case, the load sensor may detect a tensile load.
　本発明のボンディングヘッドにおいて、アームは、ベースから下方向に突出したブラケットに回転自在に取り付けられ、ストッパは、ブラケットからアームの先端側に向かって突出した部材であり、荷重センサは、ブラケットとベースとの間に挟みこまれてもよい。この場合、荷重センサは、圧縮荷重を検出してもよい。 In the bonding head of the present invention, the arm is rotatably mounted on a bracket projecting downward from the base, the stopper is a member projecting from the bracket toward the distal end side of the arm, and the load sensor comprises a bracket and the base. And may be sandwiched between them. In this case, the load sensor may detect a compression load.
　本発明のボンディングヘッドは、荷重センサによって接地検出を行うので、接地検出の感度と応答性とを向上させると共に外力の影響を受けにくい接地検出を行うことができる。 (4) Since the bonding head of the present invention detects the ground contact by the load sensor, it is possible to improve the sensitivity and responsiveness of the contact detection and to perform the contact detection that is hardly affected by external force.
実施形態のボンディングヘッド斜視図である。It is a bonding head perspective view of an embodiment. 図１に示すボンディングヘッドの立断面図である。FIG. 2 is a vertical sectional view of the bonding head shown in FIG. 1. 他の実施形態のボンディングヘッドの立面図である。It is an elevation view of the bonding head of other embodiments.
　以下、図面を参照しながら実施形態のボンディングヘッド１００について説明する。図１，２に示すように、ボンディングヘッド１００は、図示しないＺ方向駆動機構によって上下方向であるＺ方向に移動するベース１１と、ベース１１に固定されたブラケット１２と、ブラケット１２の下端に回転自在に取りけられたアーム２０と、アーム２０のＹ方向マイナス側端２２に取り付けられたばね１９と、荷重センサ２５とを含んでいる。図１においてＺ方向は上下方向、ＸＹ方向は水平方向を示す。また、図中のＸＹＺの各矢印は、それぞれのプラス方向を示す。 Hereinafter, the bonding head 100 of the embodiment will be described with reference to the drawings. As shown in FIGS. 1 and 2, the bonding head 100 includes a base 11 that is moved in a vertical Z direction by a Z-direction drive mechanism (not shown), a bracket 12 fixed to the base 11, and a lower end of the bracket 12. The arm 20 includes a freely detachable arm 20, a spring 19 attached to the Y direction minus side end 22 of the arm 20, and a load sensor 25. In FIG. 1, the Z direction indicates the vertical direction, and the XY direction indicates the horizontal direction. Further, each arrow of XYZ in the figure indicates the respective plus direction.
　ベース１１は、直方体のブロックで、上端面に先端がＹ方向マイナス側に延びるＬ字型の突出部１５を有している。突出部１５のＹ方向マイナス側端には、ばね１９の上端が係合するフック１６が設けられている。ベース１１のＹ方向プラス側には、空気管３０が取り付けられる穴３３と、切り欠き部３１とが設けられている。穴３３に取り付けられた空気管３０の上端は、切り欠き部３１からＹ方向プラス側に伸びている。 The base 11 is a rectangular parallelepiped block, and has an L-shaped protrusion 15 on the upper end surface, the tip of which extends to the minus side in the Y direction. A hook 16 with which the upper end of the spring 19 is engaged is provided at the minus side end of the protrusion 15 in the Y direction. On the plus side in the Y direction of the base 11, a hole 33 to which the air pipe 30 is attached and a notch 31 are provided. The upper end of the air pipe 30 attached to the hole 33 extends from the notch 31 to the positive side in the Y direction.
　ベース１１のＹ方向プラス側の面には、Ｈ型の厚板形状のブラケット１２が取り付けられている。Ｈ型を構成するブラケット１２の上側の切り欠き部３１には空気管３０の先端が通っている。Ｈ型を構成するブラケット１２の下側の凹部１７の内側には、四角断面でＹ方向に伸びる棒状のアーム２０が配置されている。アーム２０は、下側の凹部１７の両側部分にナット１４で固定された水平方向に伸びる水平軸である回転軸１３の周りに回転自在に取りつけられている。ここで、回転軸１３は、軸方向の中心線がアーム２０の重心を通るように配置されている。アーム２０の一端であるＹ方向プラス側端にはボンディングツールであるコレット２１が取り付けられている。また、アーム２０の他端であるＹ方向マイナス側端２２の上側の面は、ベース１１のＹ方向マイナス側端の下面に設けられたストッパ部分１８に当接している。 Ｈ An H-shaped thick plate-shaped bracket 12 is attached to the surface on the plus side in the Y direction of the base 11. The tip of the air pipe 30 passes through the cutout 31 on the upper side of the bracket 12 constituting the H-shape. Inside the concave portion 17 on the lower side of the bracket 12 constituting the H-shape, a bar-shaped arm 20 extending in the Y direction with a square cross section is arranged. The arm 20 is rotatably mounted on a rotating shaft 13 which is a horizontal shaft extending in the horizontal direction and fixed to the both sides of the lower concave portion 17 by a nut 14. Here, the rotating shaft 13 is arranged so that the axial center line passes through the center of gravity of the arm 20. A collet 21 serving as a bonding tool is attached to one end of the arm 20 at the positive side in the Y direction. The upper surface of the other end 22 of the arm 20 on the minus side 22 in the Y direction is in contact with a stopper portion 18 provided on the lower surface of the minus side of the base 11 in the minus direction.
　図２に示すように、ばね１９の上端は、ベース１１に設けられた突出部１５のＹ方向マイナス側端に取り付けられたフック１６に係合し、ばね１９の下端は、荷重センサ２５に接続されている。そして、荷重センサ２５の下端はアーム２０のＹ方向マイナス側端２２にボルトで固定されている。このように、荷重センサ２５は、ベース１１とアーム２０との間にばね１９と直列に接続されている。 As shown in FIG. 2, the upper end of the spring 19 is engaged with a hook 16 attached to the Y direction minus side end of the protrusion 15 provided on the base 11, and the lower end of the spring 19 is connected to the load sensor 25. Have been. The lower end of the load sensor 25 is fixed to the Y-side minus end 22 of the arm 20 with a bolt. Thus, the load sensor 25 is connected between the base 11 and the arm 20 in series with the spring 19.
　ばね１９は、初期張力Ｆが掛るまでは延びがゼロであり、初期張力Ｆを超える張力が掛かると初めて全長が延び始める初期張力付きのばねである。荷重センサ２５は、板状の部材の上にピエゾ素子或いはひずみゲージ等を張り付けたもので、板状部材のひずみを検出することにより板状部材に掛かる引張力を接地荷重と検出するものである。 The spring 19 is a spring with an initial tension in which the extension is zero until the initial tension F is applied, and the entire length starts to extend only when a tension exceeding the initial tension F is applied. The load sensor 25 is obtained by attaching a piezo element or a strain gauge or the like to a plate-like member, and detects a tensile force applied to the plate-like member as a ground load by detecting a strain of the plate-like member. .
　ばね１９は、コレット２１が接地していない状態で初期張力Ｆよりも小さい僅かな張力が付勢力として掛かるように設定されており、この張力によりアーム２０のＹ方向マイナス側端２２の上側の面はベース１１のストッパ部分１８に押し付けられている。これにより、アーム２０の回転が拘束されている。このように、ストッパ部分１８は、ばね１９の付勢力に対抗してアーム２０の回転を拘束している。 The spring 19 is set so that a slight tension smaller than the initial tension F is applied as an urging force when the collet 21 is not in contact with the ground, and this tension causes the upper surface of the arm 20 to be in the Y direction minus side end 22. Is pressed against a stopper portion 18 of the base 11. Thus, the rotation of the arm 20 is restricted. Thus, the stopper portion 18 restrains the rotation of the arm 20 against the urging force of the spring 19.
　コレット２１の先端が接地すると、アーム２０には回転軸１３の周りの回転モーメントが掛かる。この回転モーメントにより、アーム２０のＹ方向マイナス側端２２が下側に引っ張られ、荷重センサ２５には引張荷重が加わる。荷重センサ２５は、この引張荷重を検出し、所定の閾値を超えた場合にコレット２１の接地を検出する。 When the tip of the collet 21 touches the ground, a rotational moment about the rotation shaft 13 is applied to the arm 20. Due to this rotational moment, the negative end 22 in the Y direction of the arm 20 is pulled downward, and a tensile load is applied to the load sensor 25. The load sensor 25 detects the tensile load, and detects the contact of the collet 21 when the load exceeds a predetermined threshold.
　この際、コレット２１の先端に印加される上方向の力によりばね１９、荷重センサ２５に加わる引張力がばね１９の初期張力Ｆを超えるまでは、ばね１９は延びないので、コレット２１から加わる上方向の荷重を荷重センサ２５で検出することができる。 At this time, the spring 19 does not extend until the tensile force applied to the spring 19 and the load sensor 25 by the upward force applied to the tip of the collet 21 exceeds the initial tension F of the spring 19, so that the spring 19 The load in the direction can be detected by the load sensor 25.
　一方、コレット２１の先端に印加される上方向の力により、ばね１９、荷重センサ２５に加わる引張力がばね１９の初期張力Ｆを超えると、コレット２１からの上方向の力により、ばね１９が延び、アーム２０のＹ方向マイナス側端２２の上側の面がベース１１のストッパ部分１８から離れる。このため、コレット２１に過大な荷重が掛かり、コレット２１の先端に吸着している半導体ダイが損傷することを抑制できる。この状態では、荷重センサ２５の延びはコレット２１の上方向の力に比例しなくなる。したがって、荷重センサ２５はストッパ部分１８によりアーム２０の回転が拘束されている状態でのみ接地検出を行うことができる。 On the other hand, when the tensile force applied to the spring 19 and the load sensor 25 exceeds the initial tension F of the spring 19 due to the upward force applied to the tip of the collet 21, the spring 19 is increased due to the upward force from the collet 21. The upper surface of the arm 20 extends away from the stopper 18 of the base 11. For this reason, it is possible to prevent the excessive load from being applied to the collet 21 and the semiconductor die adsorbed on the tip of the collet 21 from being damaged. In this state, the extension of the load sensor 25 is not proportional to the upward force of the collet 21. Therefore, the load sensor 25 can perform the ground detection only when the rotation of the arm 20 is restricted by the stopper portion 18.
　以上説明したように、本実施形態のボンディングヘッド１００は、荷重センサ２５によって接地検出を行うので、接地検出の応答性を向上させることができる。また、アーム２０によってコレット２１に掛かる荷重を増幅して荷重センサ２５に掛けるようにしているので、荷重の検出感度を大きくすることができる。更に、コレット２１の先端に大きな荷重が印加された際には、ばね１９が延びることによってコレット２１の先端に係る荷重を逃がし、コレット２１の先端に吸着されている半導体ダイが損傷することを抑制することができる。更に、コレット２１が接地していない状態ではばね１９によりアーム２０のＹ方向マイナス側端２２の上側の面をベース１１のストッパ部分１８に押し付けているので、ボンディングヘッド１００の移動の際にコレット２１がＺ方向に振動することがなく、ボンディングヘッド１００の移動中にコレット２１の先端に吸着された半導体ダイの位置検出に影響が出ることを抑制することができる。 As described above, since the bonding head 100 of the present embodiment detects the grounding by the load sensor 25, the responsiveness of the grounding detection can be improved. Further, since the load applied to the collet 21 is amplified by the arm 20 and applied to the load sensor 25, the load detection sensitivity can be increased. Further, when a large load is applied to the tip of the collet 21, the spring 19 extends to release the load related to the tip of the collet 21, thereby suppressing damage to the semiconductor die adsorbed to the tip of the collet 21. can do. Further, when the collet 21 is not in contact with the ground, the upper surface of the Y direction minus side end 22 of the arm 20 is pressed against the stopper portion 18 of the base 11 by the spring 19. Does not vibrate in the Z direction, and it is possible to suppress the influence on the position detection of the semiconductor die sucked to the tip of the collet 21 during the movement of the bonding head 100.
　次に、図３を参照しながら、他の実施形態のボンディングヘッド２００について説明する。ボンディングヘッド２００は、ベース５１と、ブラケット５２と、アーム５４と、コレット５５と、ストッパ５３と、ばね５６と、荷重センサ５８と、を含んでいる。 Next, a bonding head 200 according to another embodiment will be described with reference to FIG. The bonding head 200 includes a base 51, a bracket 52, an arm 54, a collet 55, a stopper 53, a spring 56, and a load sensor 58.
　ブラケット５２はベース５１の下側に下方向に突出するように取り付けられている。アーム５４は、ブラケット５２の下端部に回転自在に取り付けられている。ストッパ５３は、ブラケット５２の下端に取りけられ、ブラケット５２からアーム２０のＹ方向プラス側端側に向かって突出した板状の部材である。荷重センサ５８は、ブラケット５２とベース５１むとの間に挟みこまれて圧縮荷重を検出する。 The bracket 52 is attached to the lower side of the base 51 so as to protrude downward. The arm 54 is rotatably attached to the lower end of the bracket 52. The stopper 53 is a plate-shaped member that is attached to the lower end of the bracket 52 and protrudes from the bracket 52 toward the plus side end of the arm 20 in the Y direction. The load sensor 58 is sandwiched between the bracket 52 and the base 51 to detect a compressive load.
　ボンディングヘッド２００のばね５６は、先に説明したボンディングヘッド１００のばね１９と同様の初期張力付きばねであり、コレット２１の先端が接地していない状態では、初期張力Ｆより小さい僅かな引張力でアーム５４のＹ方向マイナス側端を上方向に引張上げてアーム５４の下面をストッパ５３の上側の面に押し付けている。 The spring 56 of the bonding head 200 is a spring with an initial tension similar to the spring 19 of the bonding head 100 described above. When the tip of the collet 21 is not grounded, the spring 56 has a slight tension smaller than the initial tension F. The lower end of the arm 54 in the Y direction is pulled upward, and the lower surface of the arm 54 is pressed against the upper surface of the stopper 53.
　接地によりコレット２１の先端に加わる上方向の力によりばね５６に掛かる引張力が初期張力Ｆよりも小さい状態では、ばね５６の延びはゼロで、コレット２１の先端に加わる荷重は荷重センサ５８によって検出される。また、ばね５６に加わる荷重が初期張力Ｆを超えた場合には、ばね５６が延びてコレット２１の先端に加わる荷重を逃がす。 In a state where the tensile force applied to the spring 56 by the upward force applied to the tip of the collet 21 due to the grounding is smaller than the initial tension F, the extension of the spring 56 is zero, and the load applied to the tip of the collet 21 is detected by the load sensor 58. Is done. When the load applied to the spring 56 exceeds the initial tension F, the spring 56 extends and releases the load applied to the tip of the collet 21.
　このように、ボンディングヘッド２００は、ボンディングヘッド１００と同様の作用効果を奏する。 Thus, the bonding head 200 has the same operation and effect as the bonding head 100.
　１１，５１　ベース、１２，５２　ブラケット、１３　回転軸、１４　ナット、１５　突出部、１６　フック、１７　凹部、１８　ストッパ部分、２０，５４　アーム、２１，５５　コレット、２２　Ｙ方向マイナス側端、２５，５８　荷重センサ、３０　空気管、３１　切り欠き部、３３　穴、５３　ストッパ、１００，２００　ボンディングヘッド、Ｆ　初期張力。 11, 51 base, 12, 52 bracket, 13 rotation shaft, 14 nut, 15 projection, 16 hook, 17 recess, 18 stopper, 20, 54 arm, 21, 55 collet, 22 Y direction minus side end, 25, 58 load sensor, 30 air tube, 31 notch, 33 hole, 53 stopper, 100, 200 bonding head, F initial tension.

Claims (6)

  1. 　上下方向に移動するベースと、
    　一端にボンディングツールが取り付けられ、前記ベースに対して水平軸の回りに回転自在に取りつけられるアームと、
    　前記アームの他端と前記ベースとの間に取り付けられた初期張力付きのばねと、
    　前記ばねの付勢力に対抗して前記アームの回転を拘束するストッパと、
    　前記ボンディングツールに印加される上方向の接地荷重を検出する荷重センサと、を備え、
    　前記荷重センサは、前記ストッパにより前記アームの回転が拘束されている状態で接地検出を行うこと、
    　を特徴とするボンディングヘッド。     A base that moves up and down,
    An arm to which a bonding tool is attached at one end, and which is rotatably attached to the base around a horizontal axis;
    An initial tensioned spring mounted between the other end of the arm and the base;
    A stopper for restraining the rotation of the arm against the urging force of the spring;
    A load sensor for detecting an upward ground load applied to the bonding tool,
    The load sensor performs ground detection while the rotation of the arm is restricted by the stopper,
    A bonding head.
  2. 　請求項１に記載のボンディングヘッドであって、
    　前記水平軸は、軸方向の中心線が前記アームの重心を通るように配置されていること、
    　を特徴とするボンディングヘッド。     The bonding head according to claim 1, wherein
    The horizontal axis is arranged so that an axial centerline passes through the center of gravity of the arm,
    A bonding head.
  3. 　請求項１または２に記載のボンディングヘッドであって、
    　前記ストッパは、前記アームの他端側が当接する前記ベースの部分であり、
    　前記荷重センサは、前記ベースと前記アームとの間に前記ばねと直列に接続されていること、
    　を特徴とするボンディングヘッド。     The bonding head according to claim 1 or 2,
    The stopper is a portion of the base with which the other end of the arm contacts,
    The load sensor is connected in series with the spring between the base and the arm;
    A bonding head.
  4. 　請求項３に記載のボンディングヘッドであって、
    　前記荷重センサは、引張荷重を検出すること、
    　を特徴とするボンディングヘッド。     The bonding head according to claim 3, wherein
    The load sensor detects a tensile load,
    A bonding head.
  5. 　請求項１に記載のボンディングヘッドであって、
    　前記アームは、前記ベースから下方向に突出したブラケットに回転自在に取り付けられ、
    　前記ストッパは、前記ブラケットから前記アームの先端側に向かって突出した部材であり、
    　前記荷重センサは、前記ブラケットと前記ベースとの間に挟みこまれていること、
    　を特徴とするボンディングヘッド。     The bonding head according to claim 1, wherein
    The arm is rotatably attached to a bracket projecting downward from the base,
    The stopper is a member protruding from the bracket toward the distal end side of the arm,
    The load sensor is sandwiched between the bracket and the base,
    A bonding head.
  6. 　請求項５に記載のボンディングヘッドであって、
    　前記荷重センサは、圧縮荷重を検出すること、
    　を特徴とするボンディングヘッド。     The bonding head according to claim 5, wherein
    The load sensor detects a compression load,
    A bonding head.
PCT/JP2019/030995 2018-08-06 2019-08-06 Bonding head WO2020032068A1 (en)

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JPH04133337A (en) * 1990-09-26 1992-05-07 Mitsubishi Electric Corp Die bonding apparatus and its control method
JP2002110706A (en) * 2000-09-27 2002-04-12 Nidec Tosok Corp Bonding device

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